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Theoretical investigation of a class of new planar transmission lines from microwave and millimeter-wave integrated circuits

New planar transmission lines employing multilayer structures are examined for possible applications in microwave and millimeter-wave integrated circuits. Detailed investigations are presented through numerical results calculated using the spectral domain technique. The newly proposed transmission lines have many attractive features such as large impedance ranges, flexibility and the ability to realize complicated, densely packed integrated circuits, as well as miniaturization through the use of thin dielectric layers.