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Hydrolytically stable aluminum nitride as a filler material for polymer based electronic packaging

A new filler material, SCAN, silica-coated aluminum nitride, has been developed by The Dow Chemical Company for microelectronic plastic packaging. SCAN is a hydrolytically stable aluminum nitride material with appropriate particle size distribution and thermal conductivity to be used as a filler material for molding compounds or glob-tops where power dissipation is required. The patented silica coating process imparts hydrolytic stability to the powder and modifies the surface chemistry to make it more compatible with resin formulations that have traditionally used fused silica.