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Development of a multilayer conductor electromagnetic shield for optimum shielding performance

Electromagnetic shielding for an electronic circuit is of prime concern in its design. With exponentially growing technology of VLSI; the circuit size is drastically reduced. Developing an electromagnetic shield for such a reduced size of electronic circuits requires ultra thin conductor shields while achieving the required shielding performance. Single conductor layer shield has thickness limitations to achieve required shielding effectiveness. Multilayered conductor electromagnetic shields are developed in this work so as to achieve the required performance of shielding effectiveness at lower thickness values. Mathematical analysis is carried out for a multilayered conductor electromagnetic shield. Conducting materials like copper, aluminum, silver, steel, nickel etc are considered for different layers of the shield at different thicknesses. Estimations for shielding effectiveness of a three layered (two layers of micro thin conductor films on a base conductor) conductor electromagnetic shield were carried out in different frequency ranges for various combinations of conductor layer materials. The combinations of conductor materials and their thicknesses were optimized to yield maximized performance at a reduced layer thickness.