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The influence of external factors on the temperature distribution of flip-chip package – Comparative Analysis between Flotherm and Abaqus

With the rapid development of electronic products, the problem of heat dissipation is becoming more and more serious. At present, numerical simulation methods are frequently used in the thermal analysis of designing electronic products. It is generally believed that the software of Flotherm may provide accurate results for temperature distribution in electronic products by considering the movement of air and other fluids in the principle of calculation. In other software, such as Abaqus, the heat transfer process could also be calculated, but the internal principle of calculation is relatively simplified. For example, a static convective heat transfer coefficient (CHTC) replaces the actual airflow. The comparative analysis of the two software between Flotherm and Abaqus has excellent value for practical application. If the temperature distribution calculated by Abaqus is much close to that of Flotherm i.e., a simplified method could be used to obtain higher-precision simulation results. In addition, the temperature field calculated in Abaqus could be further used for thermal-mechanical coupling analysis in the package structure. In this paper, the steady-state heat analysis is applied to systematically study the influence of external factors on the temperature distribution in flip-chip packages by both Flotherm and Abaqus, the temperature distribution in package calculated by Abaqus and Flotherm could be very consistent.