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Photoemission investigation of the Schottky barrier at the Sc/3C‐SiC (111) interface

The Schottky barrier and interfacial chemistry for interfaces formed by evaporation of Sc onto 3C‐SiC (111)‐(1x1) surfaces at 600 °C has been investigated using in situ X‐ray and ultra‐violet photoelectron spectroscopy (XPS and UPS) and low energy electron diffraction (LEED). Sc was observed to grow in a two‐dimensional manner and exhibit a (1x1) LEED pattern up to thicknesses of ∼2 nm beyond which diffraction patterns were no longer observable. XPS measurements of these same films showed a clear reaction of Sc with the 3C‐SiC (111)‐(1x1) surface to form a ScSix and ScCx interfacial layer in addition to the formation of a metallic Sc film. XPS measurements also showed the deposition of Sc induced ∼0.5 eV of upward band bending resulting in a Schottky barrier of 0.65 ± 0.15 eV.