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Reliability of pressureless sintered nanosilver for attaching IGBT devices

In this paper, a 1200-V, 150-A IGBT module was designed and fabricated using the nanosilver paste without additional pressure. Comparative tests on thermal-cycling aging were studied between the as-prepared IGBT modules and the commercial modules using high-temp solder. The results indicated that, by the thermal cycling test, the thermal resistance and on-state resistance of the as-prepared IGBT module with nanosilver paste increase more slowly than the one with high-temp solder. In order to clarify the failure behavior of the pressureless sintered nanosilver, void evolution of the pressureless sintered joints and the high-tem solder were also measured by x-ray computed tomography, respectively.