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Failure modes in microelectronic packages

In this paper, a novel interferometric method with a wide range of sensitivities, called holography quasi projection moire method, is presented. It combines the features of the varied double projection moire method and the holographic interferometry method. This technique has been used to study the various failure modes, such as spallation, delamination, 1D buckle, 2D buckle, and crush, in microelectronic packaging film/substrate modules. The experimental phenomenon and fracture mechanism for various failure modes are presented and analyzed.