{'fraction_non_alphanumeric': 0.007113821138211382, 'fraction_numerical': 0.0, 'mean_word_length': 5.793103448275862, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
FEM Stress Analysis of Interfacial Failure of Multilayered Thin Film Structures in Nanoscratching

Precision grinding of a multilayered thin film solar panel is recognized as the bottleneck in its manufacturing process. A primary challenge is the significantly high stress induced at the thin film interfaces during grinding. Such stress concentration can result in interfacial delamination between two dissimilar materials and thus device malfunction. This study used a finite element modelling analysis to understand the stress evolution of the multilayer thin film structure during a single grit scratching that simulates the individual interaction between abrasive grits and work materials in grinding. The results demonstrated that significant tensile and shear stresses were formed at interfaces during scratching, which could be traced back to the experimental evidence obtained from the nanoscratching process. The maximum stresses undertaken by the interfaces were simulated.