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Thermo-mechanical creep characteristics of electrically conductive epoxy adhesives at room temperature

A series of thermo-mechanical creep tests have been performed on samples of several electrically conductive epoxy adhesives with some data from eutectic tin-lead solder used as a baseline. Results suggest that twenty-four hours of load exposure appears to be a sufficient amount of time in determining the stability of the material with regard to thermo-mechanical creep strain and strain rates. The presence of a transition point (at room temperature) in the creep/temperature and creep rate/temperature curves could be of significance to designers and some associated discussion is included to highlight the need for accounting for room temperature effects in interconnection (joint) design.