{'fraction_non_alphanumeric': 0.024125452352231604, 'fraction_numerical': 0.008443908323281062, 'mean_word_length': 5.0144927536231885, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 1, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Silicon compilation: the answer to reducing IC development costs

Developing today's increasingly large and complex digital integrated circuit (IC) and system-on-chip (SoC) devices is becoming cost-prohibitive in terms of engineering resources and development time. Packing the advanced functionality of a microprocessor, a graphics processor, or a network controller into a silicon die just 18 millimeters on a side is a complex undertaking that can require a 50-person engineering team and up to 4 million lines of HDL code. In these complex designs managing and minimizing power is becoming a huge challenge. Meanwhile, the cost of the mask set needed to drive the semiconductor production equipment stands at more than $1 million. Errors found after the mask set is created increase costs by an additional $1 million or more.