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Prediction of thermal oxidation damage in polymers by using peridynamics

Design with polymers for long-term service under high temperature requires consideration of factors such as physical aging, chemical changes and thermo-oxidative degradation. Also, the coefficient of thermal expansion, glass transition temperature and fracture properties experience change such as decrease in fracture strain. The previous models in the literature are based on classical continuum mechanics (CCM) and solved using finite element methods for oxygen concentration, deformation, and failure prediction. This study presents a bond-based peridynamic modeling for coupled oxidation-diffusion and mechanical deformation of epoxy resins under isothermal condition. Its capability is demonstrated by considering a 977–2 epoxy resin and copper bi-material configuration under oxidation.