{'fraction_non_alphanumeric': 0.02186878727634195, 'fraction_numerical': 0.0, 'mean_word_length': 5.29375, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Embedded passive components in MCM-D for RF applications

The increasing demand for high density packaging was the driving forces to the development of MCM-D technology. Most of these development efforts have been focused on high performance digital circuits. However, recently there is a great need for mixed mode circuits with a combination of digital, analog and microwave devices. Mixed mode modules often have a large number of passive components that are connected to a small number of active devices. Integration of passive components into the high density MCM substrate becomes desirable to further reduce cost, size, and weight of electronic systems while improving their performance and reliability. So, we developed the embedded passive components (including resistors, capacitors, inductors) for RF module in MCM-D substrate. This paper will describe the manufacturing process of MCM-D substrate, the method for integrating passive components in MCM-D substrate and electrical performance test.