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Improved 3D-nonlinear compact modelling for power components

In this paper we present a simple methodology for generating electro-thermal compact models of electronics components, taking into account the 3D effects of the heat transfer, moreover, the grand challenge in our model is that it considers the effect of the nonlinearity of parameters like thermal conductivity. The generated model is a thermal network of resistances and capacitances which enables us to get the real changes of temperature by an electrical simulator (P-Spice), and so we can make full electro-thermal coupling in one step simulation process.