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Thermo-mechanical reliability of 3D package under different thermal cycling

In this paper, thermo-mechanical reliability of a three-dimensional (3D) package based on through-silicon-via (TSV) under different thermal cycling was investigated with finite element method. A finite element simulation of this 3D package was performed in order to compare the thermal stress and fatigue lives of the solder joints with and without underfill. It was found that the fatigue live of solder joints was extended by using of unerfill. The influence of TSV arrangement on the fatigue life of solder was compared.