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Appendix E : Understanding Integrated Circuit Package Power Capabilities INTRODUCTION

The short and long term reliability of National Semiconductor’s interface circuits, like any integrated circuit, is very dependent on its environmental condition. Beyond the mechanical/environmental factors, nothing has a greater influence on this reliability than the electrical and thermal stress seen by the integrated circuit. Both of these stress issues are specifically addressed on every interface circuit data sheet, under the headings of Absolute Maximum Ratings and Recommended Operating Conditions. However, through application calls, it has become clear that electrical stress conditions are generally more understood than the thermal stress conditions. Understanding the importance of electrical stress should never be reduced, but clearly, a higher focus and understanding must be placed on thermal stress. Thermal stress and its application to interface circuits from National Semiconductor is the subject of this application note.