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Overview of Electromagnetic Bandgap for Microwave and Millimeter-wave Packaging

Electromagnetic bandgap (EBG) structures has been introduced to microwave and millimeter-wave packaging to realize cavity mode suppression within their operating frequencies. In this paper, four EBG structures with different unit cells are overviewed for such application. The calculated and measured results demonstrate that these EBG structures contribute to cavity mode suppression and circuit protection. Moreover, the EBG packaging solution have the advantages of miniaturization and light-weight for the front-end module.