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Effect of low temperature on the micro-impact fracture behavior of Sn-Ag-Cu solder joint

In this work, the failure characteristics of lead-free solder joint were investigated with low temperature micro-impact test. A impact testing method with shear rate of 1 m/s and temperatures ranging from room temperature to −40 °C was set up to measure the interfacial strength of solder joints for evaluating the reliability. Experimental results have shown that the testing temperatures were found to have strong effects on the impact resistance and fracture mechanisms of Sn-Ag-Cu lead-free solder joint. The failure mode percentage, the peak load, and the energy to peak load under changing low temperature conditions will be presented in this paper.