{'fraction_non_alphanumeric': 0.020902090209020903, 'fraction_numerical': 0.011001100110011002, 'mean_word_length': 5.363636363636363, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Effect of SiC Whiskers on the Microstructure and Thermal Conductivity of Carbon Foam

This paper describes the modification of ultralight flexible carbon foam by chemical vapor deposition (CVD) of silicon carbide whiskers (SiCw). The effect of SiC whiskers on the microstructure and the thermal conductivity of carbon foam were investigated by scanning electron microscopy (SEM) and laser flash diffusivity method in a Netzsch LFA427. The results show that the macro-pores (~30 μm) of the carbon foam were divided by the random distribution of SiC whiskers. The diameter of SiC whiskers decreased with decreasing catalyst concentration which resulted in the improved microstructure with a smaller pore diameter (4~6 μm) and a more homogeneous distribution of the pores. The carbon foam reinforced by SiCw exhibits better insulation performance than the pristine carbon foam when the temperature exceeds 200°C.