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Impedance and EMC Characterization Data of Embedded Capacitance Materials

Passive components embedded in printed circuit boards promise several advantages. In high-speed computer applications, the biggest electrical advantage is reduced parasitics by eliminating connecting vias. One attractive way of embedding bypass capacitors is to use power-ground plane pairs in close proximity in the PCB stack up, possibly with high dielectric constant material in between. The paper gives measured electrical impedance and radiation results of embedded capacitive layers. Self and transfer impedances of power-ground plane pairs of embedded capacitance structures are shown. Measuring the impedances of closely-spaced power-ground planes create a special challenge, because most impedance analyzer setups have an inductance limit in the order of 100pH, which makes it hard to characterize closely spaced planes correctly at high frequencies. One suitable measurement technique is explained, which enables the reduction of inductance limit by at least one order of magnitude. Close-field radiation data of various embedded capacitance test boards are also shown with different dielectric thickness and dielectric constant values.