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Investigations of multi-layer ceramic-based MCM technology

We present the design and characterization of a 20-layer ceramic-based multichip module (MCM-C) using low temperature co-fired ceramic (LTCC) at microwave frequencies. Various aspects of this technology have been experimentally investigated, including material properties, the Q factor of passive devices and 3D (multilayer) interconnects. We establish the design rules and demonstrate the feasibility of utilizing LTCC for multi-layer microwave packaging.