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Failure Analysis of a Chip Carrier Board

The author analyzes different micro areas of the chip carrier board with scanning electron microscope (SEM) and X-ray energy dispersive spectrometer(EDS) to find out the reasons why a type of chip is detached from the carrier board and the device does not work properly. The results show that the phenomenon of chip shedding due to the presence of contaminants between the chip and the carrier board.