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MMIC packaging and on-chip low-loss lateral interconnection using additive manufacturing and laser machining

A new and versatile 3D printed on-chip integration approach using laser machining is demonstrated in this paper for microwave and mm-wave systems. The integration process extends interconnects laterally from a MMIC to a chip carrier. Laser machining techniques are studied and characterized to enhance the 3D printing quality. Specifically, the width of microdispensed printed traces is accurately controlled within micrometer range and probe pads are formed by laser cutting to facilitate RF measurement. S-parameters of a distributed amplifier integrated into the package are simulated and measured from 2 to 30 GHz. The overall performance is significantly better than traditional wirebonded QFN package. The attenuation of the microstrip line including interconnects is only 0.2 dB/mm at 20 GHz and return loss with the package is less than 10 dB through-out the operating frequency band.