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Microanalysis of Ni/Si ohmic contacts to n-SiC

The authors study the complicated ohmic contact formation process by conducting a complete microanalysis of the Ni contact containing various amounts of Si (with the Si:Ni ratios being 0:1, 1:2 and 1:1). The morphology of the annealed surface and cleaved cross sections are observed by SEM and/or AFM; the structure is studied using X-ray diffraction and TEM, and the chemistry is determined using Auger depth profiles.