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Approaching Programmable Self-Assembly from Nanoparticle-Based Devices to Integrated Circuits

This paper reports on two methods to enable the manufacturing of hybrid nano and micrometer sized systems: (i) electrostatically directed self-assembly of nanoparticles and nanowires to form nanoparticle and nanowire based devices, and (ii) surface tension driven self-assembly of micrometer sized components to form multi-component hybrid microsystems. Both self-assembly techniques are programmable and reconfigurable by applying external voltages to surface electrodes. We demonstrate that directed self-assembly can be used to position 5-100 nm sized nanoparticles with 50 nm resolution, fabricate electrically functional microsystems, integrate III/V semiconductors on silicon, fabricate cylindrical displays, and program the hybrid integration of optoelectronic components in three dimensions.