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Vertical cavity surface emitting laser-based smart pixels with coplanar bump-bonded contacts

Integration of vertical cavity surface emitting lasers (VCSELs) onto a prefabricated smart pixel chip introduces fabrication problems since they can not be grown on foundry fabricated Si CMOS or GaAs MESFET circuit. This paper presents an approach to flip-chip bump-bonding VCSEL-arrays to a pixel chip in which each VCSEL is bonding directly to the appropriate pixel circuit. Thus, no added area is required and the interconnect capacitance is held to a minimum. The technique requires contacting both the n- and p-mirror of the VCSEL on the same side of the VCSEL chip and in the same plane. This allows bump bonding both contacts to the pixel chip and subsequent removal of the VCSEL chip substrate. The steps required to accomplish the VCSEL coplanar bonding include reactive ion etching of mesas and device separation in BCL3/Cl, electroplating a 4.5 micrometers high gold coplanar contact post, In/Sn alloy solder deposition, bonding to the smart pixel chip, and accurate alignment of the VCSEL and pixel chips, epoxy underfill and at last substrate removal.