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Analysis of Low Friction Force and Low Contact Resistance Film Using Sn-Cu Plating

In recent years, there has been a demand for connectors to reduce insertion force and to improve connection reliability under high temperature conditions. To solve these problems, we investigated Sn-Cu alloy laminated plating. The film examined was created by stacking Sn-Cu plating and Sn plating, and then heat treatment to form an intermetallic compound. As a result of the examination, it was reported that a good friction coefficient and contact resistance could be obtained. In this study, in order to clarify the mechanism why good contact resistance was obtained by Sn-Cu alloy laminated plating, the composition of the outermost surface was analyzed. As a result, it was clarified that Sn oxide is dominant on the outermost surface of the Sn-Cu alloy laminated plating after heating.