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Joule heating effects on electromigration in Cu/low-κ interconnects

We investigated Joule heating effects on EM in Cu/low-κ interconnects. The 1-D radiation mainly contributes to Joule heating. The contribution of the 2-D radiation is larger in a smaller area. However, the passive lines in the same layer do not act as a radiation activator but rather as a compounding factor. EM lifetime degradation is remarkable for dense structure due to poor 2-D radiation. High frequency pulse stress reduces Joule heating, and EM lifetime is improved due to reduction of the Joule heating.