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Inspection of Internal Bonding Wire of Semiconductor Integrated Circuit by Image Processing

In this study, a construction of an automatic inspection system of X-ray images was tried. Images used in this study are acquired by a X-ray inspection for internal bonding wires of semiconductor integrated circuits. From a quality control point of view, a nondestructive inspection of complete parts such as solder balls, socket pins, bonding wires and so on, is very important. However, because of improvements of semiconductor integrated circuits, a visual inspection by using X-ray images becomes increasingly harder. In this study, the bonding wire inspection is particularly discussed. The wire is thin compared to a general inspection resolution and overlaps to other elements. In some case, the wire becomes deformed and breaks. Consequently, it is necessary for the automatic inspection system of the bonding wire to propose a specific image processing. As the result of the investigation by experiments using actual X-ray images, it was confirmed that the system constructed was effective to the inspection of the bonding wire.