{'fraction_non_alphanumeric': 0.03882657463330457, 'fraction_numerical': 0.0181190681622088, 'mean_word_length': 5.590909090909091, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
An online thermal-constrained task scheduler for 3D multi-core processors

Hotspots occur frequently in 3D multi-core processors (3D-MCPs) and they can adversely impact system reliability and lifetime. Moreover, frequent occurrences of hotspots lead to more dynamic voltage and frequency scaling (DVFS), resulting in degraded throughput. Therefore, a new thermal-constrained task scheduler based on thermal-pattern-aware voltage assignment (TPAVA) is proposed in this paper. By analyzing temperature profiles of different voltage assignments, TPAVA pre-emptively assigns different operating-voltage levels to cores for reducing temperature increase in 3D-MCPs. Moreover, the proposed task scheduler integrates a vertical-grouping voltage scaling (VGVS) strategy that considers thermal correlation in 3D-MCPs. Experimental results show that, compared with two previous methods, the proposed task scheduler can respectively lower hotspot occurrences by 47.13% and 53.91%, and improve throughput by 6.50% and 32.06%. As a result, TPAVA and VGVS are effectively for reducing occurrences of hotspots and optimizing throughput for 3D-MCPs under thermal constraints.