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Mechanism of electroless deposition of Ni–W–P alloys by adding surfactants

This paper describes an electroless deposition method for the formation of a thin metallic film containing mainly nickel with significant amounts of tungsten (up to 25%) and phosphorus (5–10%). The film was deposited from an aqueous electrolyte that contained sodium tungstate as a source of tungsten, nickel sulphate as a source of nickel and hypophosphite as the reducing agent and a source of phosphorus. The surfactants were p‐hexyloxy‐p‐sodium sulphonate azobenzene (HSA) with the formula H13C6OC6H4N2 C6H4SO3Na and p‐hexylbenzyltriethanol ammonium chloride (HBC) with the formula H13C6H4CH2N+ (C2H4OH)3Cl−, added as stabilizers.