{'fraction_non_alphanumeric': 0.028455284552845527, 'fraction_numerical': 0.0027100271002710027, 'mean_word_length': 5.657657657657658, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Function through structure: An atomistic view on the additive action at copper/electrolyte interfaces

Superfill (bottom-up) phenomena relevant for Damascene processing typically rely on the time-dependent interplay of various organic and inorganic additives with both the metallic copper surface and with cuprous ions as intermediates of the copper electro-reduction in the near-surface regime. In-situ STM, in-situ SXRD (Surface X-Ray Diffraction) measurements combined with DFT calculations provide new insights into the competitive additive-additive and additive-substrate interactions under non-reactive and reactive conditions. These results are discussed in the light of successful fill experiments of sub-50 nm Damascene features.