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Smart Manufacturing for Si, SiC, and GaN Power Devices in AI Era

Today's IC technology at AI/IoT era drives all aspects of high-tech industry as nation's strength. Power ICs and devices are progressed from Si to SiC and GaN based technologies and are also utilizing AI techniques extensively in product design (e.g. multi-level co-optimization, con-current design, failure analysis, and 3D packaging, etc.) as well as manufacturing (e.g. automation for thin wafer handling, defect/contamination control, etc.) toward superior performance, yield and reliability.