{'fraction_non_alphanumeric': 0.025793650793650792, 'fraction_numerical': 0.001984126984126984, 'mean_word_length': 5.5519480519480515, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Demonstration of Substrate Integrated Ribbon Waveguide Using 3-D Printing

A new waveguiding structure and fabrication technique is introduced for high-speed, low-loss, and ultrawideband interconnects. The proposed structure is a hybrid between a dielectric ribbon and a substrate integrated waveguide design. In this structure, a high-dielectric-constant-valued core is surrounded by a low-dielectric-constant-valued cladding, which in turn is surrounded by a metal layer. Both a substrate integrated ribbon waveguide and a metalized dielectric cylindrical waveguide are presented where the cylindrical waveguide serves as a comparison. Simulation and measurement results show that ultrawideband interconnects with low dispersion, which can be designed using this hybrid approach. Fabrication of the cladding layer was carried out using 3-D plastic printing. Simulated and measured results are discussed as well as fabrication techniques. An example circuit, a power splitter/combiner, is also demonstrated.