{'fraction_non_alphanumeric': 0.0187018701870187, 'fraction_numerical': 0.020902090209020903, 'mean_word_length': 4.947712418300654, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
CMOS compatible 3D flow and thermal sensors in SOI technology

Three-dimensional (3D) self-assembled microstructures are employed in various applications ranging from isolated inductors to tunable capacitors or micro-mirrors. In this article, we present interdigitated capacitors for flow and thermal sensing and circular-shaped bolometers for thermal applications, both based on a one-mask CMOS compatible silicon-on-insulator (SOI) process. We obtained a detection range of 0 to 20 m/s for flow with a variation of 450 MHz in resonance frequency or 9 fF in capacitance for a change of one meter per second and a detection range of 20 to 320deg C with a variation of 600 MHz in resonance frequency for a change of 10deg C. These flow and thermal sensors were also studied from a theoretical point of view simulating the capacitive transducer using finite element softwares which agreed well with measurements