{'fraction_non_alphanumeric': 0.013295346628679962, 'fraction_numerical': 0.0, 'mean_word_length': 5.311377245508982, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Copper Heat Sink Design A Practical Application of Mathematical Modelling

In this work, a new concept for cooling the electronic components using the copper-base heat sink is proposed. The thermal performance and temperature distribution for the heat sink were analysed and a procedure for optimising the geometrical design parameter is presented. A three-dimensional model is developed to investigate flow and conjugate heat transfer in the copper-based heat sink. The model was produced with the commercial program FLUENT. The theoretical model developed is validated by comparing the predictions of the model with available experimental data. Several examples with different types of cooling methods and manufacturing processes are analysed to show the reliability and effectiveness in heat spreading of those. This report will also describe a modelling methodology that can be used to predict performance, with comparison to experimental data. The reliability of the presented model in optimising the copper-base heat sink design will be discussed.