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Advances in silicon photonics integration with electronics to move more data faster

Silicon photonics technology brings the volume CMOS manufacturing to optical communications in order to address clear values as speed, cost, and integration. However, the targeted data-rate levels for Telecom or Datacom applications require also high speed electronics to be closely connected to the photonics into the optical transceivers. This co-integration is key to scaling bandwidths at low costs. We present different co-integration strategies from multi-chip-module to 3D stacking leading to a still thinner frontier between photonics and electronics. Such a co-empowering opens the way to new applications and architectures.