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Structure and carrier transport properties of hot‐press deformed Bi0.5Sb1.5Te3

A hot‐press deformation study of Bi0.5Sb1.5Te3 was undertaken to obtain polycrystals with a preferred textural orientation for use in thermoelectric applications. Source materials were prepared by mechanical alloying (MA) as well as hot pressing (HP) and they were deformed at 673–823 K by applying mechanical pressure in a graphite die. The materials were extruded in a direction opposite to the direction of the applied pressure. X‐ray diffraction (XRD) and electron backscattered diffraction (EBSD) analyses indicated that the hexagonal c‐planes of the samples that were deformed at high temperatures preferably aligned along the direction of the extrusion. The Hall mobility increased as the deformation temperature increased and it showed a good correlation to the textural orientation.