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Selective detection of microcracks under the surface of glass substrates by non-contact stress-induced light-scattering method with temperature variations

Demand for flexible electronics is increasing due to recent global movements related to IoT. In particular, the ultra-thin glass substrate can be bent, its use is expanding for various applications such as thin liquid crystal panels. On the other hand, fine-polishing techniques such as chemical mechanical polishing treatments, are important techniques in glass substrate manufacturing. However, these techniques may cause microcracks under the surface of glass substrates because they use mechanical friction. We propose a novel non-contact thermal stress-induced light-scattering method (N-SILSM) using a heating device for inspecting surfaces to detect polishing-induced microcracks. In this report, we carry out the selective detection of microcracks and tiny particles using an N-SILSM with temperature variation. Our results show that microcracks and tiny particles can be distinguished and measured by an N-SILSM utilizing temperature change, and that microcrack size can be estimated based on the change in light-scattering intensity.