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Effect of Source/Drain Lateral Straggle on Distortion and Intrinsic Performance of Asymmetric Underlap DG-MOSFETs

This paper presents a systematic study of the effect of source/drain (S/D) implant lateral straggle on the RF performance of the symmetric and asymmetric underlap double gate (UDG) MOSFET devices. The length of the underlap regions (Lun) on each side of the gate is a critical technology parameter in determining the performance of UDG-MOSFETs. However, the value of Lun is susceptible to variation due to S/D implant lateral diffusion. Therefore, it is critical to investigate the impact of S/D implant lateral straggle on the performance of UDG-MOSFETs. This paper shows that the improvement in the RF performance of the UDG-MOSFETs over the conventional DG-MOSFETs can be achieved by optimizing the S/D lateral straggle of the asymmetric UDG-MOSFETs. The RF performance study includes intrinsic capacitances and resistances, transport delay, inductance, and the cut-off frequency.