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Process-Consistency-Performance Relationships for Additively Printed Z-axis Interconnects in Multilayer Circuits

In this paper, the correlation of the mechanical properties of aerosol jet printed multi-layer substrates and z-axis interconnects with process parameters has been studied. The print process-parameters of the aerosol-jet printed traces have been correlated to the performance and properties of the printed lines. The shear load to failure, and resistivity of the printed line have been studied to quantify the performance of the printed lines. Process parameters studied include sheath flow rate, ink flow rate, stage speed, standoff height, chiller temperature, platen temperature. Better understanding of the effect of each process parameter in the printed lines will allow users to select appropriate process parameters for design functional performance. In addition, the development of process-property relationships will provide visibility into the critical parameters, which require added level of attention for process-control. Process parameter drift over a long production run may be important for a high-volume production environment. The effect on the print process may be in the form of line consistency, and resistance – both of which have been quantified in this study through the quantification of process-capability for z-axis interconnects. Data is presented on 2-layer and 5-layer substrates.