{'fraction_non_alphanumeric': 0.02664298401420959, 'fraction_numerical': 0.0, 'mean_word_length': 5.635294117647059, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Non-Destructive Fault Localization in Fan Out Wafer Level Packages Using Electro Optical Terahertz Pulse Reflectometry

Here, we demonstrate how electro optical terahertz pulse refiectometry (EOTPR), a time-domain refiectometry technique that utilizes terahertz frequency electrical pulses to identify device faults, can be used to quickly and non-destructively isolate faults in advanced fan-out wafer level (FOWL) packages. We present a case study to show how EOTPR can accurately locate faults in the densely spaced redistribution layers (RDLs) of the package.