{'fraction_non_alphanumeric': 0.012102874432677761, 'fraction_numerical': 0.0, 'mean_word_length': 4.95945945945946, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Thermal analysis of switchgear using FEM considering the heat from the main circuit

Now the switchgear is extensively used in the power grid. The temperature rise of switchgear issues have attracted people's great attention. The heat production and dissipation effect of the main circuit conductor is be taken into consideration comprehensively. The heat generated by the main circuitis is calculated by thermo-electricity coupled analysis. The key issue in thermal analysis of switchgear is the heat due to electric contact. The contact form of the switchgear is not only plane pair plane contact but also curved surface contact. This article uses two methods cooperatively to simulate such contact resistance for this contact. The first method uses the traditional conductive bridge model to simulate. The second method is the contact area coupling method. On the basis of not changing the model, the area on both sides of the contact surface is coupled together so that the current can only flow from the coupling surface. By controlling the coupling area value can achieve the current shrinkage effect and simulate the appropriate contact resistance value. On the basis of the theory, the author compares the simulation results with the actual values and further studies to prove the effectiveness of the two methods.