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Accuracy improvement of the H-drive air-levitating wafer inspection stage based on error analysis and compensation

In order to improve the inspection precision of the H-drive air-bearing stage for wafer inspection, in this paper the geometric error of the stage is analyzed and compensated. The relationship between the positioning errors and error sources are initially modeled, and seven error components are identified that are closely related to the inspection accuracy. The most effective factor that affects the geometric error is identified by error sensitivity analysis. Then, the Spearman rank correlation method is applied to find the correlation between different error components, aiming at guiding the accuracy design and error compensation of the stage. Finally, different compensation methods, including the three-error curve interpolation method, the polynomial interpolation method, the Chebyshev polynomial interpolation method, and the B-spline interpolation method, are employed within the full range of the stage, and their results are compared. Simulation and experiment show that the B-spline interpolation method based on the error model has better compensation results. In addition, the research result is valuable for promoting wafer inspection accuracy and will greatly benefit the semiconductor industry.