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3D RC modeling of substrate coupling noise in high-speed Flash A/D converters

Substrate coupling noise is a key problem in today's large mixed-signal systems. This noise is caused by the coupling of digital part and can propagate to analog circuits through the common substrate. The estimating and accurate modeling of noise coupling effects is a major challenge for designers. In this paper, method of 3D distributed resistive-capacitive is used to modeling the substrate, meanwhile power/ground network models are built. Also the noise injection is got by the ring oscillator which can inject noise more real. Finally, the above models are applied in a high-speed Flash ADC and then quantifying the impact of substrate coupling noise on the performance of the circuit.