{'fraction_non_alphanumeric': 0.03296703296703297, 'fraction_numerical': 0.02197802197802198, 'mean_word_length': 4.785714285714286, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Effect of SiC whiskers addition on microstructure, microhardness and wettablility of Sn-Ag-Cu solder

A novel SiC doped SAC305 composite solder was developed by mechanically mixing various amount of the SiC whiskers with Sn-3.0Ag-0.5Cu solder paste. The effect of SiC whiskers addition on microstructure, microhardness and wettability of the composite solders was investigated. It was found that the eutectic structure was refined in the composite solder, and both of the microhardness and wettability of the composite solders were improved. Specifically, 0.1 wt.% of SiC whiskers addition in composite solder lead to 29.2% increase in hardness while 0.2 wt.% of SiC whiskers addition cause a 6.3% decrease in the contact angle.