{'fraction_non_alphanumeric': 0.013745704467353952, 'fraction_numerical': 0.003436426116838488, 'mean_word_length': 5.625, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Laser processing of palladium for selective electroless copper plating

Various methods for laser-assisted activation of dielectric layers for selective electroless copper plating are investigated. The direct writing of palladium feature by the Ar+ laser-induced pyrolytic decomposition of an organometallic palladium resin on polyimide and Si3N4 leads to active Pd sites which are selectively copper plated. Other laser-induced processes for selective palladium seeding are studied. It is also shown that those are efficient seeding processes for the electroless plating of copper.