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FROM PHYSICS TO INNOVATION : GROWING IMPACT OF PACKAGING

The extreme shrinkage of pad sizes and pitches towards nano-technology and the fast level for integration into a system requires innovative solutions for packaging and assembly. These innovative solutions have to cope with the demanding physical challenges in thermal and electrical performance, high speed requirements etc. without jeopardising reliability and cost aspects. In this paper we describe challenges for packaging that will come up the next few years according to roadmaps and we show approaches how to face these challenges. We discuss i) package material challenges like alpha particle induced soft errors and move to “Green” products, ii) miniaturisation including decrease of cost combined with heat dissipation, high speed, reliability and larger complexity, iii) merge of front-end/back-end technologies, and iv) the trade-off between system in package vs. system on chip solutions. We especially highlight the growing importance of packaging for the innovation chain from physics to applications, the importance of a close collaboration between front-end and back-end technology, and the importance of chip/package co-design.