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Evaluation and verification of improved edgebead removal process in CMOS production

This paper describes an engineering approach that was taken to improve an existing edgebead removal process which used acetone exclusively. Production problems were encountered after exposure and develop of positive photoresist: after the UV bake step. These problems were manifested by popping photoresist. The approach taken here was to evaluate acetone by itself as an edgebead remover and compare it with a commercially available EBR. Specifically, a combination of ethyl lactate and 2-pentanone. The improved edgebead removal process is presented as a function of photoresist popping after the UV bake step for our CMOS process.