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Simulation and Fabrication of Embedded Capacitors in the Multilayer Printed Circuit Board

Embedded system technology can improve electrical performance and reduce assembly cost compared with those discrete component technologies. In this paper, simulation and characterization of embedded capacitors will be presented. The embedded capacitors were simulated and characterized employing eight layered printed circuit boards. Fabrication process of multilayer embedded capacitors will be presented. Theoretical considerations regarding the embedded capacitors have been paid to understand the frequency dependent impedance behavior. Frequency dependent impedances, capacitances, and quality-factors of fabricated embedded capacitors were investigated. As a result, parasitic inductance was developed mainly through via holes and it has almost same value regardless of different capacitances. Frequency dependent capacitance values of fabricated embedded capacitors were well matched with those of simulated embedded capacitors. Temperature dependent capacitance and loss tangent of fabricated embedded capacitor were presented.