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Development of moisture automation analysis system for microelectronic packaging structures

Moisture sensitivity of packages is an area of great concern for the electronics industry. The differential swelling of materials in a non-hermetic package during manufacture, handling, storage, assembly, and then also during its lifetime can cause stresses large enough to damage the package. A moisture automation analysis system is developed based on ANSYS Workbench and Excel platform in this paper. The goal of this paper is to develop an analysis system for moisture diffusion, hygro-mechanical stress and vapor pressure analysis automatically for different package family The application of moisture automation analysis system for moisture diffusion, vapor pressure diffusion, thermal-mechanical stress; hygro-mechanical stress; vapor equivalent thermal mismatch stress are performed. The comparisons of some results based on moisture automation analysis system with those from ANSYS are given. The results from this paper agree with those from pure ANSYS.