{'fraction_non_alphanumeric': 0.037346711259754736, 'fraction_numerical': 0.03455964325529543, 'mean_word_length': 4.790322580645161, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
An Investigation on Anti-Corrosion Properties of Electroplated Copper-Graphene Nano-Composite Films

In this report, graphene sheets used as reinforcements for improvement of anti-corrosion properties have been synthesized by electrochemical intercalation and exfoliation process. The (001) and (002) plane of graphene sheets at a 2θ angle of 13.2 and 26.13 confirmed by X-ray diffraction pattern. High-resolution TEM confirms 8-12 layers of graphene present in the final products. The as-received graphene sheets have been used as reinforcement with copper matrix to synthesize Cu-Gr nanocomposite by electrodeposition method. The results and investigations of Cu-Gr composite thin films deposited from the bath containing 0.1g/L and 0.5g/L graphene concentrations with acidic copper sulfate solution have been compared. The surface morphology and roughness of composites were studied by SEM, AFM and surface profiler. The presence of graphene in Cu-Gr nanocomposite confirmed by EDS analysis. It was observed that the reinforcement particle has increased the mechanical properties of Cu-Gr composite (by 30%) with the addition to the copper matrix. The corrosion resistance of sample was studied by Tafel extrapolation method in standard borate buffer solution. For nanocomposites of 0.5g/L graphene, the values of Tafel constants are, βa=177.37 mv, βc=138.51 mv, Icorr = 9.3165×10-7Amp/cm2, Ecorr = -0.051 volts and corrosion rate 0.01028 mm/a as comparison to the corrosion rate of pure electroplated copper of a value of 0.029 mm/a. The corrosion rate of 0.5g/L Cu-Gr composite was found to be decreased by 2.7 times as compared to pure copper thin films. The structure of the films before and after corrosion was also analyzed to co-relate the electrochemical and structural relationship.