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Embedded Power Delivery Decoupling in Small Form Factor Test Sockets

Growing gaps between testing and system environments is being observed for small form factor microprocessors. Power delivery high frequency resonances are significantly higher at test compared to actual system. Those gaps translate to poor yield for high performance products. Low inductance array capacitor implanted inside the test socket body is proposed. This feature can compensate for the power delivery gaps mentioned. Prototype for this advanced test socket was constructed. The paper will present simulated and measured data of the modified test socket performance and reliability.