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The electrodeposition of a copper/nickel multilayer alloy on beryllium bronze substrate

An electrodeposited Cu/Ni multilayer alloy on a beryllium bronze substrate was prepared by using a single-bath method. The thicknesses of the single layers varied in the range 8 - 300 nm. Scanning electron microscopy (SEM) and x-ray diffraction (XRD) analyses were used to investigate the structure and stress of the Cu/Ni multilayer. Wearing measurements of the Cu/Ni multilayer films have been conducted also. The microstructural observation of the films showed that highly compacted and smooth Cu/Ni multilayers were obtained from the bath containing organic brightness additives. The results from x-ray diffractomemter analysis indicated that the orientation of the Cu/Ni multilayers changed from (200) planes to (111) planes, which is parallel to the surface when the content of brighteners in the bath was increased from 0 to . Moreover, a low level of compressive stress of the Cu/Ni multilayers can be obtained at a brightener concentration of . Furthermore, the Cu/Ni multilayer film electrodeposited by the addition of brighteners to the bath had excellent anti-wearing properties.