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Silicon Micro-Machined Vibrating Gyroscope

Described in this paper is a novel silicon micromachined vibrating gyroscope that is fabricated by a dissolved wafer process. The gyroscope consists of an outer sense frame, comb wheel drives, torsional beam, sense capacitance and torque capacitance. It can be operated either by open-loop operation or by closedloop control. In order to reduce the quadrature mechanical motion, the force-balancing way is used. A high sensitivity circuit suitable for detecting the change in capacitance along the sensing direction of the gyroscope is presented. In a high vacuum chamber, the gyroscope with a self-drive oscillation loop is tested for a high quality factor. The experimental results indicate that the gyroscope has a maximum rate capability of ±500 °/s, a scale factor of 29.5mV/(°/s) and a resolution of 0.03 7s.