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Reliability, solderability and electrical performance of high density ultra thin capacitors based on carbon nanofibers

This paper investigates the suitability of the Carbon Nano-Fiber Metal-Insulator-Metal (CNF-MIM) capacitor for integration in future miniaturized electronics. The CNF-MIM has previously shown electrical properties suitable for use in a variety of applications such as digital electronics. The CNF-MIM capacitors are subjected to high ambient temperature and constant voltage bias environments over long periods of time to assess their long-term durability. The devices are also subjected to standard surface-mount solder reflow procedure to investigate the compatibility with industry-standard assembly techniques. The capacitors are characterized in both DC and RF and are shown to be robust against degradation in these scenarios. Finally, ultra-thin CNF-MIM capacitors are manufactured, showing that the established technology can be further shrunk for further miniaturization and future applications.