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Kerf-free wafering: Technology overview and challenges for thin PV manufacturing

Eliminating high absorber material loss while allowing thin and ultra-thin crystalline silicon PV has been a “Holy Grail” of the crystalline silicon PV industry for decades. Generally called “kerf-free wafering”, the fundamental approach is to substitute slurry saws with an alternative waste-free wafering technology. Ideally, the technology would also eliminate the difficulty to process thin to ultra-thin wafers inherent to slurry saws. Should such an alternative method become practical and compatible with high-volume PV wafering operations, the potential cost savings are first-order with game-changing implications for the PV industry and competing thin-film approaches.