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Detection Of Die Attach Defects Through Rapid Thermal Transient Tests

The presence die attach defects such as voids and delaminations in a semiconductor device will lead to increased junction temperatures and premature failure of the device. In this paper, a thermal quality testing method is presented which allows for the rapid detection of die attach defects and sorting of the production samples. The methodology is a combination of thermal transient tests for thermal characterization and 3D CFD simulations.