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METHODS FOR PERFORMANCE EVALUATION OF PRECISION POSITIONING SYSTEMS : DYNAMIC STRAIGHTNESS

INTRODUCTION Many new ultra-precision linear positioning systems are finding their way into emerging technologies that are requiring sub-micrometer straightness performance over tens of millimeters during both quasi-static and dynamic positioning conditions. A few technologies include photovoltaic panel scribing, wafer dicing, and laser machining. Measuring and specifying quasi-static straightness is a well-defined process described in existing performance standards [1-3]. However, a standard test method for characterizing and specifying straightness during dynamic conditions does not currently exist. As a result, many manufactures and users of linear positioning systems have developed their own internal methods and standards, which have led to customer confusion and ambiguity.