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Combined integral equation based circuit modeling of interconnections in electronic packaging

For the electrical modeling of electronic packaging composed of planar and vertical interconnections, this paper presents the combination of two integral equation based circuit extraction methods. Each method, which geometrically accords with planar or cylindrical structures, can generate equivalent circuit elements separately. The planar and cylindrical interconnection models are connected in circuit level, and the coupling between the two models can be considered by additional capacitive components.