{'fraction_non_alphanumeric': 0.039285714285714285, 'fraction_numerical': 0.0, 'mean_word_length': 5.678571428571429, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Applications of newly developed positive photosensitive block co-polyimides to CSPs

Meeting the challenging market-defined needs of CSPs (chip sized packages) industry requires a new substrate technology that provides higher I/O densities, higher performance, thinner and lighter packaging structures than previously available solutions. In this paper, the first applications to CSP interposer (CSP-IP) processes by newly developed positive photosensitive block co-polyimides (PPI), which P I R&D Co., Ltd. of Japan has commercialized recently, are discussed.