c19)  United States  c12)  Patent Application Publication  Cheng et al.  c10)  Pub. No.: US 2007/0213429 Al  (43)  Pub. Date:  Sep. 13, 2007  (54)  ANISOTROPIC CONDUCTIVE ADHESIVE  (76)  Inventors:  Chih-Min Cheng,  Westford, MA (US);  Jayesh P. Shah,  Plaistow, NH (US);  Bo  Xia,  Lexington, MA (US)  (21)  Appl. No.:  11/373,484  (22)  Filed:  Mar. 10, 2006  (51)  Int. Cl.  C0SL  63/00  (2006.01)  (52)  U.S. Cl.  .........................  523/458;  523/442; 523/443;  525/523; 525/529; 525/530;  525/533  (57)  ABSTRACT  Publication Classification  An anisotropic conductive adhesive that provides strong  adhesion to metals and organic substrates to generate stable  and reliable electric interconnects. The adhesive provides  the benefits of short thermocompression bond time at low  temperatures. The adhesive contains cationic curable resin,  latent cationic catalyst that thermally cures the resin at  high  speeds and low temperatures, conductive filler, optionally a  film forming thermoplastic solid resin and optionally nano  size filler. The optional nano filler provides the benefit of  reducing the coefficient of thermal energy mismatch,  improving the adhesion strength and reducing the total heat  of reaction for the system.  US 20070213429Al  Correspondence Address:  NATIONAL STARCH AND CHEMICAL  COMPANY  P.O. BOX 6500  BRIDGEWATER, NJ 08807-3300 (US) 