May 5, 2011  24  US 2011/0104454 Al  MonomerM  [0385]  To the above reaction solution, 0.17 g of 4-hydroxy  TEMPO (manufactured by TOKYO CHEMICAL INDUS› TRY CO., LTD.) and 75.9 g oftriethylamine were added and  allowed to react at room temperature for 4 hours. Thereafter,  112 g of a 70% aqueous solution of methane sulfonic acid  were added to the reaction solution. After the reaction, the  reaction solution was subjected to re-precipitation with water  and a solid was recovered. 25 g of specific polymer A having  the following structure were obtained. The acid value of spe› cific polymer A was 4.0 mmol/g.  Specific polymer A  [0386]  Preparation of Composition A for Forming a Layer  to be Plated  [0387]  0.30 g (7.5% by mass) of the specific polymer A (the  above-described structure; weight average molecular weight:  44,000; solid content: 87% by mass), 0.07 g (1.75% by mass)  of sodium hydrogen carbonate, and 1.63 g ( 40.6% by mass) of  water were mixed while stirring to dissolve the specific poly› mer A, and then 2.0 g (49.9% by mass) of methanol and 0.01  g (0.25% by mass) of water-insoluble photopolymerization  initiator (IRGACURE 907, trade name, Chiba Japan K.K.)  were added thereto and stirred to prepare a composition A for  forming a layer to be plated. At this time, the content of  methanol contained in the water-alcohol mixed solvent was  55.1 % by mass. Further, after the production of the compo› sition A for forming a layer to be plated and subsequent  leaving thereof to stand for 10 minutes, occurrence of pre› cipitation was not seen by visual observation.  [0388]  Formation of Layer to be Plated  [0389]  The thus-prepared composition A for forming a  layer to be plated was applied onto the adhesion-aiding layer  of the above-described substrate Al so as to be a thickness of  1 µm  according to a spin coat method, and was dried at 80°  C.  for 30 minutes.  [0390]  Then, pattern exposure to the coated film of the  composition for forming a layer to be plated was carried out  through a photomask having line-and-space of 300 µm  with  exposure energy of 100 mJ to 8,000 mJ using a UV exposure  machine (wavelength: 365 nm (wavelength cutting at short  [0401]  All Over Electroplating  [0402]  Subsequently, electroplating was performed in a  copper electroplating bath having the following composition  at 3 A/dm $^{2 }$for 20 minutes, using the copper electro less plating  film as a feed layer. The thickness of the obtained copper  electroplating film was 18 µm.  Composition of Electroless Plating Bath  [0400]  [0398]  Entire Surface Electroless Plating  [0399]  In order to evaluate adhesion, by use of the compo› sitionA for forming a layer to be plated and exposure without  a photomask, a composition layer to be plated was formed on  the entire surface of the substrate, and a plated film having a  thickness of 0.1  µm to 1.5 µm was produced as described  below.  [0397]  Composition of Electroless Plating Bath  wavelength side using soda glass), Model No: UVF-502S,  lamp: UXM-501MD, all trade names, manufactured by SAN› EI ELECTRIC CO., LTD.).  [0391]  After the exposure, the substrate was immersed in a  1 % NaHCo$_{3 }$ aqueous solution for 10 minutes, and was then  washed with distilled water.  [0392]  Substrate A2 having a patterned layer to be plated  was thus obtained.  [0393]  Application of Plating Catalyst  [0394]  SubstrateA2 with a layer to be plated was immersed  in a 1 % by mass silver nitrate aqueous solution for 10 min› utes, and was then immersed in water for washing.  [0395]  Patterned Electroless Plating  [0396]  SubstrateA2 with a patterned layer to be plated onto  which a plating catalyst had been applied was subjected to  electroless plating at 30°  C. for 30 minutes, using an electro› less plating bath having the following composition thereby  obtaining a metal pattern material. The thickness of the  obtained electroless plating film was 1  µm.  ~~~  OAO  OAO  (  (  :;(  CN  Distilled water  463 g  OPC COPPER Tl (manufactured by OKUNO CHEMICAL  33 g  INDUSTRIES CO., LTD)  OPC COPPER T3 (manufactured by OKUNO CHEMICAL  55 g  INDUSTRIES CO., LTD)  furmilin  5~g  Distilled water  ATS ADCOPPER IW-A  (trade name, manufactured by OKUNO CHEMICAL  INDUSTRIES, CO., LTD.)  ATS ADCOPPER IW-M  (trade name, manufactured by OKUNO CHEMICAL  INDUSTRIES, CO., LTD.)  ATS ADCOPPER IW-C  (trade name, manufactured by OKUNO CHEMICAL  INDUSTRIES, CO., LTD.)  NaOH  2,2’-bipyridyl  774 g  45 mL  72  mL  9  mL  1.98 g  1.8 mg 