c12)  United States Patent  Hirano et al.  (IO)  Patent No.:  US 9,291,896 B2  Mar.22,2016  (45)  Date of Patent:  US009291896B2  (54)  ACTINIC RAY-SENSITIVE OR  RADIATION-SENSITIVE RESIN  COMPOSITION, RESIST FILM USING THE  SAME, PATTERN FORMING METHOD,  MANUFACTURING METHOD OF  ELECTRONIC DEVICE, AND ELECTRONIC  DEVICE  (71)  Applicant:  FUJIFILM Corporation,  Tokyo (JP)  (72)  Inventors:  Shuji Hirano,  Shizuoka (JP);  Natsumi  Yokokawa,  Shizuoka (JP);  Hiroo  Takizawa,  Shizuoka (JP);  Wataru  Nihashi,  Shizuoka (JP)  (73)  Assignee:  FUJIFILM Corporation,  Tokyo (JP)  ( *)  Notice:  Subject to any disclaimer, the term of this  patent is extended or adjusted under 35  U.S.C. 154(b) by 0 days.  (21)  Appl. No.:  14/605,264  (22)  Filed:  Jan.26,2015  (63)  Continuation of application No. PCT/JP2013/070829,  filed on Jul. 25, 2013.  (51)  Int. Cl.  (52)  U.S. Cl.  CPC ..............  G03F  710388  (2013.01);  C08F  22110  (2013.01);  C08F  220128  (2013.01);  G03F  710002  (2013.01);  G03F  710392  (2013.01);  G03F  710397  (2013.01);  G03F  7111  (2013.01);  G03F  712002  (2013.01);  G03F  712037  (2013.01);  G03F  712041  (2013.01);  G03F  7130  (2013.01);  G03F  71325  (2013.01);  G03F  7138  (2013.01);  H0JL  2110274  (2013.01);  C08F  212/14  (2013.01)  (58)  Field of Classification Search  CPC ......... G03F 7/038; G03F 7/0388; G03F 7/30;  C08F 220/12; C08F 220/18; C08F 220/20;  C08F 220/26; C08F 12/24; C08F 2220/285;  H0lL 21/0271; H0lL 21/0273; H01L 21/0274  USPC ................ 430/270.1, 322,325,329; 526/320  See application file for complete search history.  US 2015/0132687 Al  May 14, 2015  International Search Report for PCT/JP2013/070829 dated Oct. 29,  2013 [PCT/ISA/210].  Primary Examiner  - Amanda C Walke  (74)  Attorney, Agent, or Firm  - Sughrue Mion, PLLC  There is provided an actinic ray-sensitive or radiation-sensi› tive resin composition comprising (P) a resin containing a  repeating unit represented by the specific formula (1) and a  repeating unit represented by the specific formula (A); a resist  film formed using the actinic ray-sensitive or radiation-sen› sitive resin composition; a pattern forming method compris› ing (i) a step of forming a film from the actinic ray-sensitive  or radiation-sensitive resin composition, (ii) a step of expos› ing the film, and (iii) a step of developing the exposed film by  using a developer to form a pattern; a method for manufac› turing an electronic device, comprising the pattern forming  method, and an electronic device manufactured by the manu› facturing method of an electronic device.  (57)  ABSTRACT  20 Claims, No Drawings  OTHER PUBLICATIONS  (Continued)  (Continued)  FOREIGN PATENT DOCUMENTS  (30)  Foreign Application Priority Data  (65)  Prior Publication Data  Related U.S. Application Data  (56)  References Cited  U.S. PATENT DOCUMENTS  6,090,526 A  7/2000 Kumar  8,252,504 B2 *  8/2012 Harada et al . .............. 430/270.1  8,426,115 B2 *  4/2013 Hatakeyama et al. ........ 430/312  8,795,948 B2 *  8/2014 Dazai et al. ................ 430/270.1  8,802,352 B2 *  8/2014 Ichikawa et  al. ........... 430/270.1  8,841,060 B2 *  9/2014 Kataoka et al. ............ 430/270.1  8,883,396 B2 *  11/2014 Yahagi et al. .............. 430/270.1  9,017,924 B2 *  4/2015 Takaki et al. .............. 430/270.1  2004/0023153 Al  2/2004 Takeda et al.  2008/0008961 Al  1/2008 Nishi et al.  2008/0008965 Al  1/2008 Ohashi et al.  2010/0055608 Al*  3/2010 Ohashi et al. .............. 430/270.1  2010/0136485 Al*  6/2010 Hasegawa et al. ............ 430/296  2011/0236826 Al *  9/2011 Hatakeyama et al. ..... 430/270.1  2011/0236831 Al *  9/2011 Hasegawa et al. ......... 430/285.1  JP  JP  JP  JP  JP  2000-029215  A  2004-045448 A  2008-031160 A  2008-033287  A  2013-083966  A  1/2000  2/2004  2/2008  2/2008  5/2013  Jul. 27, 2012  Mar. 15, 2013  (JP) ................................. 2012-167816  (JP) ................................. 2013-054403  G03F  71004  G03F  71038  H0JL21/027  C08F  220128  G03F  7100  G03F  71039  G03F  7111  G03F  7120  G03F  7132  G03F  7138  C08F  22110  G03F  7130  C08F 212/14  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (2006.01) 