May 5, 2011  28  US 2011/0104454 Al  photomask, the composition layer to be plated was formed on  the entire surface of the substrate, and a plated film having a  thickness of 18 µm  was produced by whole surface electro less  plating and electroplating.  [0449]  With respect to the plated film thus obtained, a cross  cut test (JIS-K5600) was carried out. From the result that  peeling of even 1 of 100 squares was not observed, it is  understood that the formed metal film has a sufficient adhe› siveness to the substrate.  [0450]  Evaluation of Sensitivity  [0451]  In the above-described Examples and Comparative  Examples, the coated film of the composition for forming a  layer to be plated was cured while fixing the exposure amount  at 3000  ml,  followed by development. When film formation  was exhibited, it was evaluated as "O", and when film forma› tion was not exhibited, it was evaluated as "X". The results are  shown in Table 1 below.  [0452]  Evaluation of Drying Time  [0453]  In the above-described Examples and Comparative  Examples, when sufficient drying was obtained at 80°  C. for  5 minutes, it was evaluated as "A"; when a sufficient drying  was obtained at 120°  C. for 15 minutes, it was evaluated as  "B"; when drying at 120°  C. for 60 minutes was necessary, it  was evaluated as "C", and when drying at 120°  C. for 60  minutes was insufficient, it was evaluated as "D". The deter› mination as to whether drying time is sufficient or insufficient  was performed as follows.  [0454]  In a case in which the coated film of the composition  for forming a layer to be plated was dried, when the amount of  a remaining solvent was 5% by weight or less with respect to  the weight of the film, the drying time is determined to be  sufficient. In contrast, when the amount was more than 5% by  weight, the drying time was determined to be insufficient. The  amount of remaining solvent was measured as follows.  [0455]  A value obtained by subtracting a weight of the  substrate before coating from a weight of substrate provided  with a coated film thereon after drying was designated as a  total weight of the solvent and the film. Further, a value  obtained by subtracting a weight of the substrate before coat› ing from a weight of the substrate after curing, developing and  drying a whole surface of the film provided on the substrate  was designated as a weight of the film. The amount of remain› ing solvent was obtained by subtracting the above-described  weight of the film from the above-described total weight of  the solvent and the film. The results are shown in the follow› ing Table 1.  [0456]  From the results of Examples 1 to 9 and Compara› tive Examples 1 to 3, it can be seen that a pattern is formed at  high sensitivity and a metal pattern having high resolution can  be easily obtained in Examples using the composition for  forming a layer to be plated according to the invention. Fur› ther, in comparison of Examples 1 to 7 with Examples 8 and  9, it can be seen that when a water-alcohol mixed solvent is  used as the water-water-soluble flammable liquid mixed sol› vent, the effect of the invention is conspicuous. On the other  hand, in the composition of Comparative Examples 1 and 2 in  which the amount of alcohol in a water-alcohol mixed solvent  was small, the water-insoluble photopolymerization initiator  was not homogeneously dissolved, resolution of the formed  pattern was deteriorated, and in the composition of Compara› tive Example 3 not containing water-insoluble photopoly› merization initiator, a cured film was not formed.  [0457]  All publications, patent applications, and technical  standards mentioned in this specification are herein incorpo› rated by reference to the same extent as if each individual  publication, patent applications, or technical standards was  specifically and individual indicated to be incorporated by  reference.  What is claimed is:  1.  A composition for forming a layer to be plated, the  composition comprising a solution in which from 1 % by mass  to 20% by mass of a polymer having a functional group that  forms an interaction with a plating catalyst or a precursor  thereof and a radical polymerizable group, and a water-in› soluble photopolymerization initiator are dissolved in a  mixed solvent comprising from 20% by mass to 99% by mass  of a water-soluble flammable liquid and water.  2.  The composition for forming a layer to be plated accord› ing to claim  1,  wherein the water-insoluble photopolymeriza› tion initiator is included in the range of from 1 % by mass to  20% by mass with respect to the polymer having a functional  group that forms an interaction with a plating catalyst or a  precursor thereof and a radical polymerizable group.  3.  The composition for forming a layer to be plated accord› ing to claim  1,  wherein the water-soluble flanimable liquid  comprises an alcohol-based solvent.  4.  The composition for forming a layer to be plated accord› ing to claim  1,  wherein the water-insoluble photopolymeriza› tion initiator comprises a compound having an absorbance  peak in the range of from 250 nm to 400 nm.  5.  The composition for forming a layer to be plated accord› ing to claim  1,  wherein, in the polymer having a functional  group that forms an interaction with a plating catalyst or a  precursor thereof and a radical polymerizable group, the  functional group that forms an interaction with a plating  catalyst or a precursor thereof comprises a non-dissociative  functional group or an ionic polar group that forms an inter› action with a plating catalyst or a precursor thereof.  6.  The composition for forming a layer to be plated accord› ing to claim  5,  wherein the non-dissociative functional group  comprises an ether group, or a cyano group.  7.  The composition for forming a layer to be plated accord› ing to claim  5,  wherein the ionic polar group comprises a  carboxylic acid group.  8.  The composition for forming a layer to be plated accord› ing to claim  1,  wherein the radical polymerizable group com› prises an acryloyl group, a methacryloyl group, an acryla› mide group, a methacrylamide group, an ally! group, a vinyl  group, or a styryl group.  TABLE 1  Pattern forming  performance  Sensitivity  Drying time  Example 1  0  0  A  Example 2  0  0  A  Example 3  0  0  A  Example4  0  0  A  Example 5  0  0  A  Example 6  0  0  B  Example 7  0  0  B  Example 8  0  0  C  Example 9  LI.  0  C  Comparative Example 1  X  0  B  Comparative Example 2  X  0  B  Comparative Example 3  Cured film  Cured film  Cured film  not formed  not formed  not formed 