228  US 9,829,796 B2  227  components becomes 3% by mass to 20% by mass. By doing  this, the coating properties of the composition can be further  improved.  (E) Hydrophobic Resin  The active light-sensitive or radiation-sensitive resin  composition of the present invention may have a hydropho› bic resin (E) separately from the resin (A).  The hydrophobic resin (E) preferably contains a group  having a fluorine atom, a group having a silicon atom, or a  hydrocarbon group having 5 or more carbon atoms, in order  to be unevenly distributed on a film surface. These groups  may be contained in the main chain of the resin or may be  substituted in the side chain. Specific examples of the  hydrophobic resin (E) will be described below.  (HR-1)  (HR-2)  (HR-3)  u  (HR-4)  F3C  CF3  OH  CF3  I  ---f-CH2 - C -t-- OAO  F3C  CF3  OH  (HR-6)  ~:¢:’  F  ~  F  F  ~  -Si- l  (HR-7)  -continued  (HR-8)  CH3  I  CH3  I  ---f-CH2 - C-,-- OAO  ---f-CH2 -c-,-- OAO  ~  ,......,.r .........  (HR-9)  (HR-10)  (HR-11) 