76  US 9,069,246 B2  75  -continued  OH  In the formulae, each of L $^{1 }$to L $^{8 }$independently represents  a hydrogen atom, a hydroxymethyl group, an alkoxymethyl  group (preferably a methoxymethyl group or an ethoxym› ethyl group) or an alkyl group having a carbon number of  1  to  6.  The amount added of the crosslinking agent is preferably  from 3 to 70 mass %, more preferably from 5 to 50 mass %,  based on the total solid content of the actinic ray-sensitive or  radiation-sensitive resin composition.  The positive actinic ray-sensitive or radiation-sensitive  resin composition of the present invention may further con› tain a dissolution inhibiting compound having a molecular  weight of3,000 or less and being capable of decomposing by  an action of an acid to increase the solubility in an alkali  developer (hereinafter, sometimes referred to as "dissolution  inhibiting compound"). In order to prevent reduction in the  transparency to light of220 nm or less, the dissolution inhib- iting compound is preferably an alicyclic or aliphatic com› pound containing an acid-decomposable group, such as acid› decomposable group-containing cholic acid derivatives  described in  Proceeding of SPIE,  2724, 355 (1996).  Examples of the acid-decomposable group are the same as  those described above for the acid-decomposable unit.  In the case where the composition according to the present  invention is exposed to a KrF excimer laser or irradiated with  an electron beam, the dissolution inhibiting compound is  preferably a compound containing a structure where a phe› nolic hydroxyl group of a phenol compound is substituted  with an acid-decomposable group. The phenol compound is  preferably a compound containing from  1  to 9 phenol frame› works, more preferably from 2 to 6 phenol frameworks.  The amount added of the dissolution inhibiting compound  is preferably from 3 to 50 mass %, more preferably from 5 to  40  mass%, based on the total solid content of the composi› tion.  Specific examples of the dissolution inhibiting compound  are illustrated below, but the present invention is not limited  thereto.  [ 6] Other Components  The positive or negative actinic ray-sensitive or radiation› sensitive resin composition according to the present invention  may further contain a basic compound, an organic solvent, a  surfactant, a dye, a plasticizer, a photosensitizer, a compound  for accelerating dissolution in developer, a compound having  a proton acceptor functional group, and the like.  (Basic Compound)  The composition according to the present invention may  further contain a basic compound. When a basic compound is  further contained, the change of the performance over time  between exposure and heating (post-bake) can be more  reduced. Also, when thus contained, the in-film diffusion of  an acid generated upon exposure can be controlled.  The basic compound is preferably a nitrogen-containing  organic compound. The compound that can be used is not  particularly limited, but, for example, compounds in the fol› lowing categories  (1)  to (5) can be used.  [5] Compound Having a Molecular Weight of3,000 or Less  and being Capable of Decomposing by an Action of an  Acid to Increase the Solubility in an Alkali Developer  [Chem. 39]  HO  COO-t-Bu  HO  HO  OH  0  -o+o- 0  t-Bu, O ~0  00 O ,,,.t-Bu  0  )l  ,.,....1-Bu  rfl  O  0  tkj’coo,Ra ~cm,Rs  OH  ~coo,Ra 