CLARIFICATION No: 1 Publication Ref: EuropeAid/140639/IH/SUP/TR  Subject: Supply of Equipment for Advanced Prototype Station (APS) application.  7. Ultrasonic processing steps depend upon the process flow and  can be changed.  Q8  Item 1.5.1 – various materials  Which materials? We need the full list with all specs for each material  The equipment will be mostly used for the micromachining of  sapphire and transparent ceramics such as Mg-spinel and yttrium  aluminum garnet.  Please refer to Changes No:1 to the Tender Dossier, article 1.5.1.  Q9  Item 1.5.2 – avg. power 8 W at least  ≥8 W avg. power at what rep. rate and wavelength? Example: would 200 µJ at 50  KHz (avg. 10 W) at 1030 nm be OK?  The wavelength shall be 1030nm ±1%. Repetition rate shall be  minimum 50kHz at 200 µJ by preserving the average power and  to take advantage of the fast-scanning system. 100 uJ for 100 kHz, 50 uJ for 200 kHz, etc. up to at least 1 MHz  ( so 10 uJ pulses) are suitable options for the uniform repetition  rate option.  Q10  Item 1.5.3 - various opaque and transparent materials such as sapphire, spinel,  ceramic, glass  What about max. size and thickness of each material?  Please refer to Changes No:1 to the Tender Dossier, article 1.5.1.  Q11  Item 1.5.4 - minimum wavelength of up to 1.5 GHz "burst mode"  What does it mean? We can offer a laser with both fundamental emission at 1030 nm  ± 10 nm and SHG beam  at 515 nm, including BiBurst option in both GHz & MHz mode:  In addition to uniform repetition rate pulses, the laser shall have  a burst mode operation with pulses more than 1.5 GHz repetition  rate inside the burst. For this process regime, number of pulses  inside burst should be at least 400.  The pulse energy can scale accordingly; for example for a 100  Sayfa  5  /  23