US 2019/0196326 Al  1  Jun.27,2019  ACTINIC RAY-SENSITIVE OR  RADIATION-SENSITIVE RESIN  COMPOSITION, RESIST FILM, PATTERN  FORMING METHOD, AND METHOD OF  MANUFACTURING ELECTRONIC DEVICE  CROSS-REFERENCE TO RELATED  APPLICATIONS  BACKGROUND OF THE INVENTION  1. Field of the Invention  2. Description of the Related Art  SUMMARY OF THE INVENTION  [0018]  (7) A resist film that is formed of the actinic  ray-sensitive  or  radiation-sensitive  resin  composition  according to any one of (1) to (6).  [0006]  The present inventors have conducted research on  the actinic ray-sensitive or radiation-sensitive resin compo› sition containing the acid generator specifically described in  the section of the example of JP5900255B and found that, in  a case where the actinic ray-sensitive or radiation-sensitive  [0017]  (6) The actinic ray-sensitive or radiation-sensitive  resin composition according to any one of (1) to (5), wherein  the resin is a resin that is decomposed due to an action of an  acid to increase polarity.  [0016]  (5) The actinic ray-sensitive or radiation-sensitive  resin composition according to any one of (1) to ( 4), in  Formula  (I), n is 1.  [0015]  ( 4) The actinic ray-sensitive or radiation-sensitive  resin composition according to any one of (1) to (3),  wherein, in Formula (I), R 1  is a linear or branched alkyl  group, and R $^{2 }$is an alkyl group having 2 to 20 carbon atoms.  [0014]  (3) The actinic ray-sensitive or radiation-sensitive  resin composition according to (1) or (2), wherein, in  Formula  (I), R $^{2 }$represents a hydrocarbon group having 2 to  20 carbon atoms which may include a hetero atom.  [0013]  (2) The actinic ray-sensitive or radiation-sensitive  resin composition according to (1), wherein, in Formula  (I),  R  1  represents a hydrocarbon group having 1 to 20 carbon  atoms.  [0005]  In the section of the example of JP5900255B, as  described below, an acid generator having a structure in  which a portion of hydrogen atoms on carbon atoms (in  other words, on the carbon atoms bonded to the sulfonic acid  ion) at the a-position of a sulfonic acid ion is substituted  with fluorine atoms is specifically disclosed.  [0012]  (1) An actinic ray-sensitive or radiation-sensitive  resin composition comprising: a compound that generates an  acid represented by Formula  (I) by irradiation with an  actinic ray or radiation; and a resin.  [0004]  For example, JP5900255B discloses a radiation› sensitive resin composition containing a monosulfonic acid› type acid generator which is cleaved upon irradiation with  radiation. The acid generated by cleavage of the acid gen› erator has a function of making a deprotection reaction of the  resin component in the composition occur or a crosslinking  reaction of the resin component occur.  (I)  [0003]  In the related art, microfabrication by lithography  using a radiation-sensitive resin composition has been per› formed in the process of manufacturing a semiconductor  device such as an integrated circuit  (IC) and a large scale  integrated circuit (LSI).  [0010]  As a result of diligent research so as to achieve the  above object, the present inventors have found that the  aforementioned objects can be achieved by causing the  actinic ray-sensitive or radiation-sensitive resin composition  to contain a compound which generates an acid having a  specific structure so as to complete the present invention.  [0011]  That is, the present inventors have found that the  above objects can be achieved by the following configura› tions.  [0002]  The present invention relates to an act1mc ray› sensitive or radiation-sensitive resin composition, a resist  film, a pattern forming method, and a method of manufac› turing an electronic device.  [0009]  Another object of the present invention is to pro› vide a resist film, a pattern forming method, and a method  of manufacturing an electronic device, each of which uses  the actinic ray-sensitive or radiation-sensitive resin compo› sition.  [0008]  Accordingly, an object of the present invention is to  provide an actinic ray-sensitive or radiation-sensitive resin  composition which has excellent preservation stability and  has small pattern line width roughness (LWR) in a case  where a resist pattern is formed.  [0001]  This application is a Continuation of PCT Interna› tional Application No. PCT/JP2017/021494 filed on Jun. 9,  2017, which claims priority under 35 U.S.C § 119(a) to  Japanese Patent Application No. 2016-170028 filed on Aug.  31, 2016 and Japanese Patent Application No. 2017-009460  filed on Jan. 23, 2017. Each of the above application(s) is  hereby expressly incorporated by reference, in its entirety,  into the present application.  [0007]  The present inventors also have found that a resist  pattern forming by the actinic ray-sensitive or radiation› sensitive resin composition containing the acid generator  needs to be further improved even in the pattern line width  roughness (LWR).  resin composition is preserved for a predetermined period of  time, a temporal change such as the increase of the number  of particles or the decrease of the sensitivity easily occurs.  That is, the present inventors have found that it is necessary  to further improve the preservation stability.  Rf  H03S+X+,;--R 1  R2 