Aug. 4, 2016  77  US 2016/0223905 Al  8.  The active light-sensitive or radiation-sensitive resin  composition according to claim  1,  wherein a boiling point of  the compound (C) is 200°  C. or higher.  9.  The active light-sensitive or radiation-sensitive resin  composition according to claim  1,  wherein a boiling point of  the compound (C) is 220°  C. or higher.  10.  The active light-sensitive or radiation-sensitive resin  composition according to claim  1,  wherein a content of the  compound  (C) is 30 parts by mass or less with respect to 100  parts by mass of the resin (A).  11.  The active light-sensitive or radiation-sensitive resin  composition according to claim  1,  further comprising an acid  diffusion control agent (D).  12.  The active light-sensitive or radiation-sensitive resin  composition according to claim  1,  wherein the compound (C)  has a partial structure represented by the following General  Formula (1):  General Formula (1)  18.  The pattern forming method according to claim  15,  wherein the top coat is formed of a top coat composition  including a hydrophobic resin and an alcohol-based solvent.  17.  The pattern forming method according to claim  15,  wherein the top coat includes a basic compound.  16.  The pattern forming method according to claim  15,  wherein the top coat includes a hydrophobic resin having a  repeating unit having a CH$_{3 }$ partial structure in a side chain  portion.  providing a top coat on the resist film.  13.  The active light-sensitive or radiation-sensitive resin  composition according to claim  12,  wherein in General For› mula (1 ), n represents an integer of 4 to 8.  14.  A pattern forming method comprising:  (1) forming a resist film on a substrate using the active  light-sensitive or radiation-sensitive resin composition  according to claim  1;  (2) exposing the resist film; and  (3) developing the exposed resist film using a developer  containing an organic solvent to form a resist pattern.  15.  The pattern forming method according to claim  14,  further comprising:  wherein in General Formula (1 ), R$_{11 }$represents analkylene  group which may have a substituent, n represents an  integer of 1 or more, and * represents a bonding hand.  *  *  *  *  * 