Aug. 4, 2016  25  US 2016/0223905 Al  -continued  (II-f-17)  -continued  (II-f-13)  (II-f-14)  (II-f-18)  (II-f-15)  (II-f-19)  (II-f-16)  [0183]  In addition to the repeating structural units, the resin  (A) used in the composition of the present invention can have  a variety of repeating structural units for the purpose of  adjusting dry etching resistance, suitability for a standard  developer, adhesion to a substrate, and a resist profile, and in  addition, resolving power, heat resistance, sensitivity, and the  like, which are characteristics generally required for the  resist. Examples of such repeating structural units include,  but are not limited to, repeating structural units corresponding  to the following monomers.  [0184]  Thus, it becomes possible to perform fine adjust› ments to performance required for the resin used in the com› position according to the present invention, in particular, (1)  solubility with respect to a coating solvent, (2) film-forming  properties (glass transition point), (3) alkali developability,  (4) film reduction (selection of hydrophilic, hydrophobic, or  alkali-soluble groups), (5) adhesion of an unexposed area to a  substrate, (6)  dry  etching resistance, and the like.  0  0  0  0  0 