I  1111111111111111 1111111111 11111 111111111111111 IIIII IIIII IIIIII IIII IIII IIII  US010031419B2  (IO)  Patent No.:  US 10,031,419 B2  (45)  Date of Patent:  Jul. 24, 2018  (54)  PATTERN FORMING METHOD,  COMPOSITION KIT AND RESIST FILM,  MANUFACTURING METHOD OF  ELECTRONIC DEVICE USING THESE, AND  ELECTRONIC DEVICE  (71)  Applicant:  FUJIFILM Corporation,  Tokyo (JP)  (72)  Inventors:  Hiroo Takizawa,  Shizuoka (JP);  Shuji  Hirano,  Shizuoka (JP)  (73)  Assignee:  FUJIFILM Corporation,  Tokyo (JP)  ( *)  Notice:  Subject to any disclaimer, the term ofthis  patent is extended or adjusted under 35  U.S.C. 154(b) by  O  days.  (21)  Appl. No.:  14/921,524  (22)  Filed:  Oct. 23, 2015  (65)  Prior Publication Data  US 2016/0048075 Al  Feb. 18, 2016  Related U.S. Application Data  Search Report dated Jul. 8, 2014, issued by the International  Searching Authority in counterpart International Application No.  PCT/JP2014/060522 (PCT/ISA/210).  Written Opinion dated Jul. 8, 2014, issued by the International  Searching Authority in counterpart International Application No.  PCT/JP2014/060522 (PCT/ISA/237).  Translation of Written Opinion dated Jul. 8, 2014, issued by the  International Searching Authority in counterpart International  Application No. PCT/JP2014/060522 (PCT/ISA/237).  Office Action dated Oct. 25, 2016, issued by the Japanese Patent  Office in counterpart Japanese Application No. 2013-094403.  Office Action dated Nov. 16, 2016 issued by the Korean Intellectual  Property Office in counterpart Korean Patent Application No.  10-2015-7030825.  OTHER PUBLICATIONS  (Continued)  Primary Examiner  - John S Chu  (74)  Attorney, Agent, or Firm  - Sughrue Mion, PLLC  (57)  ABSTRACT  There is provided a pattern forming method comprising (i)  forming a film on a substrate using an actinic ray-sensitive  or radiation-sensitive resin composition which contains (A)  a resin which decomposes due to an action of an acid to  change its solubility with respect to a developer and (C) a  specific resin, (ii) forming a top coat layer using a top coat  composition which contains a resin (T) on the film, (iii)  exposing the film which has the top coat layer to actinic rays  or radiation, and (iv) forming a pattern by developing the  film which has the top coat layer after the exposing.  18 Claims, No Drawings  (56)  References Cited  U.S. PATENT DOCUMENTS  8,241,832 B2 *  8/2012 Wang ..................... C09J 133/02  430/270.1  8,247,161 B2 *  8/2012 Takeshita .............. C08F 220/18  430/270.1  8,530,598 B2 *  9/2013 Takeshita .............. C08F 220/18  526/242  JP  JP  JP  JP  JP  JP  JP  WO  WO  WO  2010-160283 A  2010-175859 A  2011-100105 A  2011-219742 A  2012-027453 A  2013-015596 A  2013-029823 A  2009/041270 Al  2012/053302 Al  2013/047895 Al  7/2010  8/2010  5/2011  11/2011  2/2012  1/2013  2/2013  4/2009  4/2012  4/2013  FOREIGN PATENT DOCUMENTS  G03F  71004  G03F  7111  G03F  71039  C08F  220128  C08F  20128  G03F  7120  G03F  7132  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (51)  Int. Cl.  (52)  U.S. Cl.  CPC ..............  G03F  71039  (2013.01);  C08F  20128  (2013.01);  C08F  220128  (2013.01);  G03F  71004  (2013.01);  G03F  710397  (2013.01);  G03F  7111  (2013.01);  G03F  7120  (2013.01);  G03F  712004  (2013.01);  G03F  712037  (2013.01);  G03F  7132  (2013.01);  C08F  2220/283  (2013.01)  ( 58)  Field of Classification Search  CPC .... G03F 7/2041; G03F 7/0397; G03F 7/2004;  G03F 7/11  USPC .......... 430/270.1, 273.1, 326, 907, 942, 905  See application file for complete search history.  (63)  Continuation  of  application  No.  PCT/JP2014/060522, filed on Apr. 11, 2014.  (30)  Foreign Application Priority Data  Apr. 26, 2013  (JP) ................................. 2013-094403  Takizawa et al.  c12)  United States Patent  2006/0223008 Al* 10/2006 Yoshimura .............. G03F 7/091  10/2010 Kouno et al.  9/2011  Hasegawa et al.  6/2012 Kataoka et al.  430/311  2010/0255416 Al  2011/0236831 Al  2012/0156617 Al  2012/0264053 Al*  10/2012 Wang .................... G03F 7/0046  430/273.1  2012/0328987 Al  12/2012 Hatakeyama et al.  2013/0004740 Al*  1/2013 Kataoka ................ G03F 7/0045  428/195.1  2013/0078432 Al*  3/2013 Takahashi ................. B32B 3/10  428/195.1  2013/0209940 Al  2013/0216961 Al  2014/0212797 Al  2014/0242518 Al  8/2013 Sakamoto et al.  8/2013 Kouno et  al.  7/2014 Kawabata et al.  8/2014 Hatakeyama et al. 