38  US 2016/0223905 Al  Aug. 4, 2016  -continued  -continued  PAG-14  PAG-20  PAG-15  [0349]  <Compound (C) Having at Least One Oxygen  Atom>  [0350]  The compound (C) contained in the composition of  the present invention is not particularly limited as long as it is  a compound having at least one oxygen atom. However, the  compound  (C) does not include the resin (A) and the com› pound (B) as described above.  PAG-16  PAG-17  PAG-18  PAG-19  [0357]  In particular, the compound (C) is preferably a com› pound having an ether bond, more preferably a compound  having at least two ether bonds, still more preferably a com› pound having three or more ether bonds, and particularly  preferably a compound having four or more ether bonds.  [0356]  Moreover, in one embodiment of the present inven› tion, the compound (C) is preferably a compound having a  boiling point of 200°  C. or higher, more preferably a com› pound having a boiling point of 220°  C. or higher, and still  more preferably a compound having a boiling point of 240°  C. or higher. Further, the boiling point refers to a boiling point  at 1 atm.  [0355]  Incidentally, in one embodiment of the present  invention, the number of carbon atoms contained in the com› pound  (C) is preferably 30 or less, more preferably 20 or less,  and still more preferably 15 or less.  [0354]  Moreover, in one embodiment of the present inven› tion, the number of carbon atoms contained in the compound  (C) is preferably 8 or more, more preferably 9 or more, and  still more preferably 10 or more.  [0353]  Incidentally, in the present specification, in the case  where there is a distribution of the molecular weight of the  compound  (C), the molecular weight of the compound (C) is  intended to be the weight-average molecular weight of the  compound  (C). A method for calculating the weight-average  molecular weight is the same as above.  [0352]  In one embodiment of the present invention, the  molecular weight of the compound  (C) is preferably 3,000 or  less, more preferably 2,500 or less, still more preferably  2,000 or less, and particularly preferably 1,500 or less. The  molecular weight of the compound  (C) is typically 100 or  more, preferably 150 or more, more preferably 200 or more,  still more preferably 300 or more, and particularly preferably  500 or more.  [0351]  In one embodiment of the present invention, the  compound  (C) preferably contains two or more groups or  bonds selected from the group consisting of an ether bond, a  hydroxyl group, an ester bond, and a ketone bond, more  preferably contains three or more of the groups or bonds, and  still more preferably contains four or more of the groups or  bonds. In this case, groups or bonds selected from the ether  bonds, the hydroxyl groups, the ester bonds, and the ketone  bonds contained in plural numbers in the compound  (C) may  be the same as or different from each other.  OBu  c¢ 0 0 _!-hF  II  0  0  F  6  OBu  /7  ~  0  F  0  v  ~  0  II  II  0  F  0  8 0-~+F  II  II  H  0  F  0  0  F  e  11-h  0-S  II  o  0  F  0 