232  231  US 9,551,933 B2  -continued  -continued  (D-55)  (D-56)  +  oyo  ~N~  --fJ  oyo  ~N~  (D-58)  (D-59)  (D-60)  (D-61)  (D-62)  (D-63)  (D-64)  (D-65)  The compound represented by formula (A) can be syn- thesized by referring to, for example, JP-A-2007-298569  and JP-A-2009-199021.  In the present invention, as for the low molecular weight  compound (D), one compound may be used alone, or two or  more compounds may be mixed and used.  The composition of the present invention may or may not  contain the low molecular compound (D), but in the case of  containing the compound (D), the content thereof is usually  from 0.001 to 20 mass%, preferably from 0.001 to 10 mass  %, more preferably from 0.01 to 5 mass%, based on the total  solid content of the composition combined with the basic  compound.  In the case where the composition of the present invention  contains an acid generator, the ratio between the acid gen› erator and the compound (D) used in the composition is  preferably acid generator/[compound (D)+basic compound]  (by mol)=from 2.5 to 300. That is, the molar ratio is  preferably 2.5 or more in view of sensitivity and resolution  and is preferably 300 or less from the standpoint of sup› pressing the reduction in resolution due to thickening of the  resist pattern over time after exposure until heat treatment.  The acid generator/[compound (D)+basic compound] (by  mo!) is more preferably from 5.0 to 200, still more prefer› ably from 7.0 to 150.  Other examples of the basic compound which can be used  in the composition of the present invention include com- pounds synthesized in Examples of JP-A-2002-363146 and  compounds described in paragraph 0108 of JP-A-2007- 298569. 