2.2 Architecture of IBM FlashSystem 900 Model AE3 2.2.1 Overview The IBM FlashSystem architecture is explained. Key product design characteristics, including  performance, reliability, and serviceability, are described. Hardware components are also  described. The design goals for the IBM FlashSystem 900 Model AE3 are to provide the client with the  fastest and most reliable all-flash storage array on the market, while making it simple to  service and support with as little downtime as possible. The IBM FlashSystem 900 Model  AE3 uses many FPGA components and as little software as possible, which keeps I/O latency  to a minimum and I/O performance to a maximum.  The IBM FlashSystem 900 Model AE3 design is shown in Figure 2-15 on page 50. At the core  of the system are two high-speed non-blocking crossbar buses. The crossbar buses provide  two high-speed paths, which carry the data traffic. They can be used by any host entry path  into the system. A slower speed bus for management traffic also is featured. Connected to the crossbar buses are high-speed non-blocking RAID modules and IBM  MicroLatency modules. A passive main system board (midplane) also is used to which both  the RAID canisters and all the flash modules connect. Connections to battery modules, fan  modules, and power supply units also are included.  The two RAID canisters contain crossbar controllers, management modules, interface  controllers and interface adapters, and fan modules. The two RAID canisters form a logical  cluster. No single point of failure exists in the design (assuming that all host connections  include at least one path to each canister). Chapter 2. IBM FlashSystem 900 Model AE3 architecture  49