US 2016/0223905 Al  56  Aug. 4, 2016  -continued  -continued  (C-23)  (C-28)  (C-24)  (C-25)  (C-26)  (C-27)  (A)  TABLE2  Resin  Composition  Mw  Mw/Mn  C-1  50/50  9600  1.74  C-2  60/40  34500  1.43  C-3  30/70  19300  1.69  C-4  90/10  26400  1.41  C-5  100  27600  1.87  C-6  80/20  4400  1.96  C-7  100  16300  1.83  C-8  5/95  24500  1.79  C-9  20/80  15400  1.68  C-10  50/50  23800  1.46  C-11  100  22400  1.57  C-12  10/90  21600  1.52  C-13  100  28400  1.58  C-14  50/50  16700  1.82  C-15  100  23400  1.73  C-16  60/40  18600  1.44  C-17  80/20  12300  1.78  C-18  40/60  18400  1.58  C-19  70/30  12400  1.49  C-20  50/50  23500  1.94  C-21  10/90  7600  1.75  C-22  5/95  14100  1.39  C-23  50/50  17900  1.61  C-24  10/90  24600  1.72  C-25  50/40/10  23500  1.65  C-26  60/30/10  13100  1.51  C-27  50/50  21200  1.84  C-28  10/90  19500  1.66  [0466]  <Acid Diffusion Control Agent (D)>  [0467]  The composition of the present invention preferably  contains an acid diffusion control agent (D). The acid diffu› sion control agent (D) acts as a quencher that traps acids  generated from the acid generator or the like upon exposure  and inhibits a reaction of the acid-decomposable resin in the  unexposed area by extra generated acids. As the acid diffusion  control agent (D), a basic compound, a low-molecular com› pound which has a nitrogen atom and a group capable of  leaving by the action of an acid, a basic compound whose  basicity is reduced or lost upon irradiation with active light or  radiation, or an onium salt which becomes a relatively weak  acid with respect to the acid generator can be used.  [0468]  Preferred examples of the basic compound include  compounds having structures represented by the following  Formulae (A) to (E).  R201  I  R2oo_N-R202 