(IO)  Patent No.:  US 7,504,193 B2  (45)  Date of Patent:  Mar.17,2009  c12)  United States Patent  Sasaki  (54)  POSITIVE RESIST COMPOSITION AND  PATTERN FORMING METHOD USING THE  SAME  (75)  Inventor:  Tomoya Sasaki,  Shizuoka (JP)  (73)  Assignee:  FUJIFILM Corporation,  Tokyo (JP)  ( *)  Notice:  Subject to any disclaimer, the term ofthis  patent is extended or adjusted under 35  U.S.C. 154(b) by 176 days.  (21)  Appl. No.:  11/217,422  (22)  Filed:  Sep.2,2005  (51)  Int. Cl.  G03F  71039  (2006.01)  (52)  U.S. Cl.  ....................................  430/270.1;  430/326  (58)  Field of Classification Search  .............. 430/270.1,  430/907, 326, 176  See application file for complete search history.  17 Claims, No Drawings  (57)  ABSTRACT  OTHER PUBLICATIONS  FOREIGN PATENT DOCUMENTS  (65)  Prior Publication Data  (30)  Foreign Application Priority Data  (56)  References Cited  U.S. PATENT DOCUMENTS  EP  EP  JP  JP  JP  JP  JP  JP  0 440 374 A2  1367439 Al  *  6-41221 A  2000-122291 A  3173368 B2  2001-114825 A  2001-206917 A  2002-323768 A  8/1991  12/2003  2/1994  4/2000  3/2001  4/2001  7/2001  11/2002  5,695,910 A  *  12/1997 Urano et al. ............. 430/270.1  2003/0013036 Al  1/2003 Lee et al.  Patent Abstracts of Japan (JP-A-11-282163), Shiro Tan, "Positive  Photosensitive Composition" copyrighted 1999.  European Search Report dated Feb. 1, 2006.  * cited by examiner  Primary Examiner-Cynthia  Hamilton  (74)  Attorney, Agent, or Firm-Sughrue  Mion PLLC  A positive resist composition satisfying high sensitivity, high  resolution and good line edge roughness at the same time, and  a pattern forming method using the resist composition are  provided, which are a positive resist composition comprising  (A) a resin which becomes soluble in alkali developer  increases under the action of an acid, the resin having two  kinds of repeating units each having a specific styrene skel› eton, (B) a compound of generating an acid upon irradiation  with actinic rays or radiation, and (C) an organic basic com› pound, and a pattern forming method using the resist compo› sition.  Sep.2,2004  (JP)  .......................... P.2004-255473  US 2006/0046195 Al  Mar. 2, 2006  US007504193B2 