all functions of the device will be  accessible  and  the  enclosure  shall  provide  20dB  or  more  sound  dampening.  1.4.11 The device shall be delivered with a  stainless steel stand designed for said  device and sound isolating enclosure.  The stand shall have height adjustment  and shall carry the sound isolating  enclosure with the device inside of it.  1.5 High Pulse Laser  Quantity:1  Manufacturer’s name  Product model/type  Country of Origin  Definition  Machine shall be used for precision  processing,  scribing,  cutting  and  opening a hole on of work pieces such  as glass, metal and ceramic surfaces.  1.5.1 Machine  shall  be  configured  for  precision  processing  of  workpieces  made from various materials.  1.5.2 Machine  shall  be  equipped  with  femtosecond  or  picosecond  laser.  Average power of the laser system shall  be at least 8 W. 1.5.3 Machine shall be suitable for micro- machining  of  various  opaque  and  transparent materials such as sapphire,  spinel, ceramic, glass workpieces. August 2020 c4f_annexiitechspeciiitechoffer_en.doc  Page 21 of 49 