Draft Document for Review January 22, 2020 8:31 pm 8456ch_components.fm 2.2.4 DS8900F base frames a. For more details see “I/O enclosure adapters” on page 46 As mentioned in 2.1.1, “Storage system” on page 24, the DS8900F is available in different  racked and rack mounted models. The frame model number is determined by the  configuration and the hardware version. The specific combinations are shown in Table 2-1 on  page 24. Note:  The DS8910F model 994 and the DS8950F model 996 always comes with a base  frame which consists of a new 40U high-end rack with a reduced footprint, height and  depth. The DS8910F model 993 doesn’t have a base frame.  The DS8900F base frames accommodate the following components: The flash drives are installed in groups of 16 called an install group. This install group is  ordered as a set with one feature code. Each HPFE Gen2 enclosure pair can  accommodate 16, 32, or 48 flash drives.  Flash drives are available in 800 GB, 1.6 TB, 1.92 TB, 3.2 TB, 3.84 TB, 7.68 TB, and  15.36TB capacities. For more information about the HPFE, refer to the IBM Redbooks  publication,  IBM DS8000 High-Performance Flash Enclosure Gen2 , REDP-5422. Note:  The 1.92 TB flash drives can be used in the DS8910F models 993/994 only and  are not available on the DS8950F models 996/E96.  All enclosures have redundant power and integrated cooling, which draw air from front to  rear. For more information about cooling requirements, see Chapter 7, “IBM DS8900F  physical planning and installation” on page 179. The DS8900F family introduced a simplified rack power distribution by using the intelligent  Power Distribution Units (iPDUs) supporting single- or three-phase power in all models.  Each iPDU has its own dedicated input AC power cord. A choice of various AC input  connector line cords for different regions are available.  GLYPH<SM590000> The rack power subsystem GLYPH<SM590000> High-Performance Flash Enclosure Gen2 (HPFE Gen2), in the following configurations: – Up to four HPFE Gen2 enclosure pairs in the base frame. Chapter 2. IBM DS8900F hardware components and architecture  31 Flash drives Min / Max 16 / 384 HPFE Gen2 pairs Min / Max 1 / 8 Flash Raid adapter pairs Min / Max 1 / 8 iPDU Min / Max 2 / 6 Power Single Phase or Three Phase HMC 2 in Management Enclosure (ME) Ethernet Switches 2 8-port switches in ME, with E96 base frame includes 2 24-port switches Keyboard/Monitor 1 Features DS8950F