US 20110104454Al  c19)  United States  c12)  Patent Application Publication  KAWANO et al.  c10)  Pub. No.: US 2011/0104454 Al  (43)  Pub. Date:  May 5, 2011  (54)  COMPOSITION FOR FORMING LAYER TO  BE PLATED, METHOD OF PRODUCING  METAL PATTERN MATERIAL, AND METAL  PATTERN MATERIAL  (75)  Inventors:  Takatsugu KAWANO,  Kanagawa  (JP);  Takeyoshi KANO,  Kanagawa  (JP)  (73)  Assignee:  FUJIFILM CORPORATION,  Tokyo (JP)  (21)  Appl. No.:  12/910,884  (22)  Filed:  Oct. 25, 2010  (52)  U.S. Cl.  ................  428/195.1;  430/270.1; 430/286.1;  430/283.1; 430/324  Publication Classification  (57)  ABSTRACT  (30)  Foreign Application Priority Data  The present invention provide a composition for forming a  layer to be plated, including a solution in which from 1 % by  mass to 20% by mass of a polymer having a functional group  that forms an interaction with a plating catalyst or a precursor  thereof and a radical polymerizable group, and a water-in› soluble photopolymerization initiator are dissolved in a  mixed solvent comprising from 20% by mass to 99% by mass  of a water-soluble flammable liquid and water; a method of  producing a metal pattern material using the composition for  forming a layer to be plated; and a metal pattern material  produced by the method.  Oct. 29, 2009  (JP) ................................. 2009-249382  (51)  Int. Cl.  B32B 3/00  (2006.01)  G03F  71004  (2006.01)  G03F  7120  (2006.01) 