US 2019/0196326 Al  47  Jun.27,2019  [0461]  These surfactants may be used singly, or several  kinds thereof may be used in combination.  [0450]  The composition according to the embodiment of  the present invention generally contains a solvent.  [0451]  Examples of the solvent that can be used in pre› paring the composition include organic solvents such as  alkylene glycol monoalkyl ether carboxylate, alkylene gly› col monoalkyl ether, lactic acid alkyl ester, alkyl alkoxy› propionate, cyclic lactone (preferably having 4 to 10 carbon  atoms), a monoketone compound which may have a ring  (preferably having 4 to 10 carbon atoms), alkylene carbon› ate, alkyl alkoxyacetate, and alkyl pyruvate.  [0460]  According to the present invention, surfactants  other than fluorine-based and/or silicon-based surfactants  disclosed in paragraph <0280> ofUS2008/0248425A can be  used.  [0459]  Examples of the fluorine-based and/or silicon› based surfactants include surfactants disclosed in paragraph  <0276> of US2008/0248425A.  [0458]  In a case where the composition according to the  embodiment of the present invention contains a surfactant,  in a case where an exposure light source having 250 nm or  lower, particularly 220 nm or lower is used, a resist pattern  having excellent adhesiveness and fewer development  defects can be applied at favorable sensitivity and resolu› tions.  [0457]  The composition according to the embodiment of  the present invention may not further contain a surfactant,  but in a case where the composition contains a surfactant,  and a fluorine-based and/or silicon-based surfactant (fluo› rine-based surfactant, silicon-based surfactant, and surfac› tant having both of fluorine atom and silicon atom) are  preferable.  [0448]  In the hydrophobic resin (HR), the content of the  residual monomer or oligomer components is preferably  0.01 to 5 mass% and more preferably 0.01 to 3 mass%. The  molecular weight distribution (Mw/Mn, hereinafter, also  referred to as a "dispersion degree") is preferably in the  range of 1 to 5 and more preferably in the range of 1 to 3.  [0449]  As the hydrophobic resin (HR), various kinds of  commercially available products may be used, or the hydro› phobic resin (HR) may be synthesized by a general method  (for example, radical polymerization).  [0447]  The hydrophobic resin (HR) may be used singly  and two or more kinds thereof may be used in combination.  In a case where two or more hydrophobic resins (HR) are  used in combination, it is preferable that the total content is  in the above range.  [0456]  The solvent preferably includes propylene glycol  monomethyl ether acetate and is preferably a single solvent  of propylene glycol monomethyl ether acetate or a mixed  solvent of two or more kinds containing propylene glycol  monomethyl ether acetate.  [0446]  The content of the hydrophobic resin (HR) in the  composition is preferably 0.01 to 10 mass % and more  preferably 0.05 to 8 mass % with respect to the total solid  content in the composition according to the embodiment of  the present invention.  [0455]  The mixing ratio (mass) of the solvent containing  a hydroxyl group and the solvent not containing a hydroxyl  group is 1/99 to 99/1, preferably 10/90 to 90/10, and more  preferably 20/80 to 60/40. A mixed solvent containing 50  mass % or more of the solvent not containing a hydroxyl  group is particularly preferable in view of coating unifor› mity  [0445]  The weight-average molecular weight of the  hydrophobic resin (D) in terms of standard polystyrene is  preferably in the range of 1,000 to 100,000 and more  preferably in the range of 1,000 to 50,000.  [0454]  As the solvent containing a hydroxyl group in a  structure and the solvent not containing a hydroxyl group,  the example compounds described above can be appropri› ately selected, but the solvent containing a hydroxyl group  is preferably alkylene glycol monoalkyl ether and lactatic  acid alkyl ester and more preferably propylene glycol  monomethyl ether (PGME, also known as l-methoxy-2- propanol), methyl 2-hydroxyisobutyrate, and ethyl lactate.  As the solvent not containing a hydroxyl group, alkylene  glycol monoalkyl ether acetate, alkyl alkoxy propionate, a  monoketone compound that may contain a ring, cyclic  lactone, and alkyl acetate are preferable. Among these,  propylene glycol monomethyl ether acetate (PGMEA, also  referred to as l-methoxy-2-acetoxypropane), ethyl ethoxy› propionate, 2-heptanone, y-butyrolactone, cyclohexanone,  and butyl acetate are more preferable, and propylene glycol  monomethyl ether acetate, ethyl ethoxypropionate, and  2-heptanone are even more preferable.  [0444]  Meanwhile, particularly, in a case where the hydro› phobic resin (HR) includes a CH$_{3 }$ partial structure in a side  chain moiety, an aspect in which the hydrophobic resin (HR)  does not substantially contain a fluorine atom and a silicon  atom is also preferable. Also, it is preferable that the  hydrophobic resin (HR) is substantially constituted only by  repeating units constituted only by atoms selected from a  carbon atom, an oxygen atom, a hydrogen atom, a nitrogen  atom, and a sulfur atom.  [0443]  The repeating unit containing a fluorine atom is  preferably 10 to 100 mo! % and more preferably 30 to 100  mo! % with respect to the all repeating units included in the  hydrophobic resin (HR). The repeating unit including a  silicon atom is preferably 10 to 100 mo! % and more  preferably 20 to 100 mo! % with respect to the all repeating  units included in the hydrophobic resin (HR).  [0453]  According to the present invention, a mixed sol› vent obtained by mixing a solvent containing a hydroxyl  group in a structure and a solvent not containing a hydroxyl  group may be used as the organic solvent.  [0452]  Specific examples of these solvents include sol› vents disclosed in paragraphs <0441> to <0455> of  US2008/0187860A.  [0442]  The hydrophobic resin (HR) may further have a  repeating unit different from the repeating unit described  above.  group as provided as the resin (A). The repeating unit having  the group (z) which is decomposed by the action of an acid  may have at least one of a fluorine atom or a silicon atom.  With respect to the hydrophobic resin (HR), the content of  the repeating unit having a group (z) which is decomposed  due to an action of an acid is preferably 1 to 80 mo! %, more  preferably 10 to 80 mo!%, and even more preferably 20 to  60 mo! % with respect to all repeating units in the resin  (HR).  Other Additives  Surfactant  Solvent 