The amount of the solvent used is determined such that the  concentration of the total solid contents of the composition  becomes preferably from 0.1 % by weight to 10% by weight,  more preferably from 2.0% by weight to 6.0% by weight, and 55  even more preferably from 3.0% by weight to 5.0% by  weight.  US 8,574,814 B2  192  191  (ZI -4) having the sulfonic acid anion represented by General  Formula (SAi), since the acidity of the generated acid can be  appropriately adjusted in this combination.  When the composition according to the present invention  further contains the photoacid generator, the content of the  photoacid generator is preferably from 0.1 % by mass to 40%  by mass, more preferably from 0.5% by mass to 30% by mass,  and even more preferably from 1 % by mass to 20% by mass,  based on the total solid contents of the composition.  The composition according to the present invention pref› erably contains a solvent.  The solvent usable for preparing the composition is not  particularly limited as long as the solvent dissolves the  respective components. Examples of the solvent include an  alkylene glycol monoalkyl ether carboxylate (propylene gly› col monomethyl ether acetate (PGMEA, having another  name of l-methoxy-2-acetoxypropane) or the like), an alky› lene glycol monoalkyl ether (propylene glycol monomethyl  ether (PGME, having another name of l-methoxy-2-pro› panol) or the like), an alkyl lactate ester ( ethyl lactate, methyl  lactate, or the like), a cyclic lactone (y-butyrolactone or the  like preferably having 4 to 10 carbon atoms), a chain-like or  cyclic ketone (2-heptanone, cyclohexanone, or the like pref- erably having 4 to 10 carbon atoms), an alkylene carbonate  (ethylene carbonate, propylene carbonate, or the like), an  alkyl carboxylate (preferably an alkyl acetate such as butyl  acetate), an alkyl alkoxy acetate (ethyl ethoxy propionate),  and the like. Examples of other usable solvents include sol- vents disclosed from Paragraphs [0244]  of US2008/  0248425Al, and the like.  Among the above solvents, an alkylene glycol a monoalkyl  ether carboxylate, an alkylene glycol monoalkyl ether, and  ethyl lactate are particularly preferable.  These solvents may be used alone, or two or more kinds  thereof may be used as a mixture. When two or more kinds of  the solvent are used as a mixture, it is preferable to mix a  solvent containing a hydroxyl group with a solvent not con› taining a hydroxyl group. The mass ratio of the solvent con- taining a hydroxyl group to the solvent not containing a  hydroxyl group is generally from 1/99 to 99/1, preferably  from 10/90 to 90/10, and even more preferably from 20/80 to  60/40.  As the solvent containing a hydroxyl group, an alkylene  glycol monoalkyl ether or an alkyl lactate ester is preferable,  and as the solvent not containing a hydroxyl group, an alky› lene glycol monoalkyl ether carboxylate is preferable.  It is  particularly preferable to use a solvent in which the propor› tion of propylene glycol monomethyl ether is 50% by mass or  more of the solvent.  The composition according to the present invention may  further contain a surfactant. As the surfactant, a fluorosurfac- tant and/or a silicon surfactant are/is particularly preferable.  Examples of the surfactant include Megafac Fl 76 and ROS  manufactured by DIC CORPORATION, PF656 and 6320  manufactured by OMNOVA Solutions Inc., Troysol S-366  manufactured by Troy Chemical, Fluorad FC430 manufac- tured by Sumitomo 3M Inc., and a polysiloxane polymer  KP-341 manufactured by Shin-Etsu Chemical Co., Ltd.  Surfactants other than the fluorosurfactant and/or the sili› con surfactant can also be used. More specifically, polyoxy› ethylene alkyl ethers, polyoxyethylene alkyl aryl ethers, and  the like can be exemplified.  In addition, known surfactants can be appropriately used.  Examples of the usable surfactants include surfactants dis› closed from Paragraph [0273] ofUS2008/0248425Al.  The surfactant may be used alone, or two or more kinds  thereof may be used concurrently.  When the composition according to the present invention  further contains a surfactant, the content of the surfactant is  preferably from 0.0001 % by mass to 2% by mass, more  preferably from 0.001 % by mass to 1 % by mass, and even  more preferably from 0.01 by mass to 0.1 % by mass, based on  the total solid contents of the composition.  The composition according to the present invention may  further contain a dissolution inhibiting compound of which a  dissolution rate in an alkaline developer is increased by the  degradation of the compound caused by the action of an acid  and which has a molecular weight of 3000 or less (hereinbe› low, also referred to as a "dissolution inhibiting compound")  In order not to decrease permeability at 220 nm or less,  alicyclic or aliphatic compounds containing an acid-degrad› able group, such as cholic acid derivatives containing an  acid-degradable group disclosed in Proceedings of SPIE,  2724, 355 (1996), are preferable as the dissolution inhibiting  compound. Examples of the acid-degradable group include  the same groups as "OYi,, of General Formula (3) and  "COOY 2 "  of General Formula ( 4) in the above resin (P).  When the composition according to the present invention is  exposed with a KrF excimer laser or irradiated with an elec› tron beam, a compound having a structure in which the phe› nolic hydroxyl group of a phenol compound is substituted  with the acid-degradable group is preferable as the dissolu› tion inhibiting compound. The phenol compound preferably  contains 1 to 9 phenol structures, and more preferably con› tains 2 to 6 phenol structures.  The molecular weight of the dissolution inhibiting com› pound is 3000 or less, preferably from 300 to 3000, and more  preferably from 500 to 2500.  When the composition according to the present invention  contains the dissolution inhibiting compound, the amount of  the dissolution inhibiting compound added is preferably from  0.0001 % by mass to 20% by mass, and more preferably from  0.5% by mass to 10% by mass, based on the total solid  contents of the composition.  Specific examples of the dissolution inhibiting compound  shown below, but the present invention is not limited thereto.  [7] Dissolution Inhibiting Compound  [5] Solvent  [6] Surfactant  [Chem. 78]  0  HO 