US 20160223905Al  c19)  United States  c12)  Patent Application Publication  OU et al.  c10)  Pub. No.: US 2016/0223905 Al  (43)  Pub. Date:  Aug. 4, 2016  (54)  ACTIVE LIGHTRAY-SENSITIVE OR  RADIATION-SENSITIVE RESIN  COMPOSITION AND PATTERN FORMING  METHOD  (71)  Applicant:  FUJIFILM Corporation,  Tokyo (JP)  (72)  Inventors:  Keiyu OU,  Haibara-gun (JP);  Keita  KATO,  Haibara-gun (JP);  Michihiro  SHIRAKAWA,  Haibara-gun (JP);  Akiyoshi GOTO,  Haibara-gun (JP);  Sou  KAMIMURA,  Haibara-gun (JP)  (73)  Assignee:  FUJIFILM Corporation,  Tokyo (JP)  (21)  Appl. No.:  15/092,871  (22)  Filed:  Apr. 7, 2016  (63)  Continuation of application No. PCT /JP2014/080906,  filed on Nov. 21, 2014.  (52)  U.S. Cl.  CPC ................  G03F  710045  (2013.01);  G03F  7120  (2013.01);  G03F  7132  (2013.01);  G03F  7116  (2013.01);  G03F  7111  (2013.01)  (51)  Int. Cl.  Nov. 29, 2013  Nov. 19, 2014  (JP) ................................. 2013-248158  (JP) ................................. 2014-234279  G03F  71004  G03F  7111  G03F  7116  G03F  7120  G03F  7132  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (2006.01)  Publication Classification  (57)  ABSTRACT  Related U.S. Application Data  (30)  Foreign Application Priority Data  This active light-sensitive or radiation-sensitive resin compo› sition contains a resin (A), a compound (B) capable of gen› erating an acid upon irradiation with active light or radiation,  and a compound (C) having at least one oxygen atom. The  compound (C) does not include the resin (A) and the com› pound (B). 