215  US 9,291,896 B2  216  -continued  A photosensitive basic compound may be also used as the  basic compound. Examples of the photosensitive basic com› pound which can be used include compounds described in  JP-T-2003-524799 (the term "JP-T" as used herein means a  "published Japanese translation of a PCT patent application")  andJ.  Photopolym. Sci.  &  Tech.,  Vol. 8, pp. 543-553 (1995).  The molecular weight of the basic compound is usually  from 100 to 1,500, preferably from 150 to 1,300, more pref› erably from 200 to 1,000.  One kind of these basic compounds may be used alone, or  two or more kinds thereof may be used in combination.  In the case where the composition of the present invention  contains a basic compound, the content thereof is preferably  from0.01 to 8.0mass %,morepreferablyfrom0.1 to 5.0mass  %, still more preferably from 0.2 to 4.0 mass%, based on the  total solid content of the composition.  The molar ratio of the basic compound to the photoacid  generator is preferably from 0.01 to 10, more preferably from  0.05 to 5, still more preferably from 0.1 to 3. If the molar ratio  is excessively large, the sensitivity and/or resolution may be  reduced, whereas if the molar ratio is excessively small, thin› ning of the pattern may occur between exposure and heating  (post-baking). The molar ratio is more preferably from 0.05 to  5, still more preferably from 0.1 to 3. In this molar ratio, the  proportion of the photoacid generator is based on the total  amount of the repeating unit (B) of the resin and the photoacid  generator that may be further contained in the resin.  The actinic ray-sensitive or radiation-sensitive resin com› position of the present invention may contain (HR) a hydro› phobic resin separately from the resin (P).  The hydrophobic resin (HR) preferably contains a fluorine 35  atom-containing group, a silicon atom-containing group or a  hydrocarbon group having a carbon number of 5 or more so as  to be unevenly distributed to the film surface. Such a group  may be present in the main chain of the resin or may be  substituted on the side chain. Specific examples of the hydro- phobic resin (HR) are illustrated below.  [7] Hydrophobic Resin (HR)  (HR-1)  (HR-2)  (HR-3)  u  OH  (HR-4)  OH  (HR-5)  ~~"  F~F  F  (HR-6)  ~  -Si- l  (HR-7)  (HR-8)  (HR-9) 