US009718901B2  c12)  United States Patent  Tsuruta et al.  (IO)  Patent No.:  US 9,718,901 B2  (45)  Date of Patent:  *  Aug. 1, 2017  (54)  RESIN COMPOSITION AND PATTERN  FORMING METHOD USING THE SAME  (71)  Applicant:  FUJIFILM Corporation,  Minato-Ku,  Tokyo (JP)  (72)  Inventors:  Takuya Tsuruta,  Haibara-gun (JP);  Tomotaka Tsuchimura,  Haibara-gun  (JP);  Kaoru Iwato,  Haibara-gun (JP)  (73)  Assignee:  FUJIFILM Corporation,  Tokyo (JP)  ( *)  Notice:  Subject to any disclaimer, the term ofthis  patent is extended or adjusted under 35  U.S.C. 154(b) by  O  days.  This patent is subject to a terminal dis› claimer.  (21)  Appl. No.:  14/586,129  (22)  Filed:  Dec. 30, 2014  (63)  Continuation  of  application  No.  PCT/JP2013/068303, filed on Jun. 26, 2013.  (51)  Int. Cl.  (52)  U.S. Cl.  CPC ................  C08F  12124  (2013.01);  C08F  8102  (2013.01);  C08F  12132  (2013.01);  C08F  212114  (2013.01);  G03F  71004  (2013.01);  G03F  710045  (2013.01);  G03F  710382  (2013.01);  G03F  710392  (2013.01);  G03F  7120  (2013.01);  G03F 7/0388  (2013.01)  (58)  Field of Classification Search  None  See application file for complete search history.  (65)  Prior Publication Data  Related U.S. Application Data  (30)  Foreign Application Priority Data  (56)  References Cited  U.S. PATENT DOCUMENTS  28 Claims, 9 Drawing Sheets  (57)  ABSTRACT  OTHER PUBLICATIONS  FOREIGN PATENT DOCUMENTS  US 2015/0118623 Al  Apr. 30, 2015  Jul. 27, 2012  (JP) ................................. 2012-167509  G03F  71039  G03F  71038  G03F  7120  C08F  12124  C08F  12132  C08F  16112  C08F  16126  C08F  212114  G03F  71004  C08F  8102  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (2006.01)  5,585,218 A  12/1996 Nakano et al.  6,083,658  A  *  7/2000 Kunita .................. G03F 7/0045  430/270.1  6,153,349 A  11/2000 Ichikawa et al.  6,214,518 Bl*  4/2001 Kunita .................. B41C 1/1008  6,258,507 Bl  7,501,223 B2  7,977,027 B2 *  8,470,512 B2  8,501,942 B2  8,735,048 B2  8,828,645 B2  7/2001 Ochiai et al.  3/2009 Takeda et al.  430/270.1  7/2011 Takeda .................. G03F 7/0045  430/270.1  6/2013 Masunaga et al.  8/2013 Dornon et al.  5/2014 Inasaki et al.  9/2014 Tanaka et al.  2003/0232940 Al *  12/2003 Komoriya ............... C07C 33/46  526/242  (Continued)  (Continued)  Machine translation ofjp 2009-086353 (2009).*  (Continued)  Primary Examiner  - Martin Angebranndt  (74)  Attorney, Agent, or Firm  - Sughrue Mion, PLLC  A resin composition of the present invention includes a  polymer compound (A) containing a repeating unit (Q)  represented by the following general formula (1):  [Chem.!]  (1)  wherein  R$_{1 }$ represents a hydrogen atom, a methyl group, or a  halogen atom;  R$_{2 }$ and R$_{3 }$ represent a hydrogen atom, an alkyl group, or  a cycloalkyl group;  L represents a divalent linking group or a single bond;  Y represents a substituent excluding a methylol group;  Z represents a hydrogen atom or a substituent;  n represents an integer of 1 to 5; and  m represents an integer of  O  to 4;  m+n is 5 or less.  JP  JP  1-293338 A  11/1989  02-229804  *  9/1990 