US 20080067077Al  c10)  Pub. No.: US 2008/0067077 Al  (43)  Pub. Date:  Mar. 20, 2008  c19)  United States  c12)  Patent Application Publication  Kodera et al.  (54)  ELECTROLYTIC LIQUID FOR  ELECTROLYTIC POLISHING AND  ELECTROLYTIC POLISHING METHOD  (76)  Inventors:  Akira Kodera,  Kanagawa-ken (JP);  Yasushi Toma,  Kanagawa-ken (JP);  Tsukuru Suzuki,  Kanagawa-ken (JP);  Takayuki Saito,  Kanagawa-ken (JP);  Itsuki Kobata,  Tokyo (JP)  (51)  Int. Cl.  C25F 3/16  (2006.01)  B23H 3/00  (2006.01)  (52)  U.S. Cl.  .........................  205/645;  205/656; 205/662;  205/684  (21)  Appl. No.:  11/896,251  (22)  Filed:  Aug. 30, 2007  An electrolytic liquid is used for electrolytic polishing which  can provide a processed surface having high flattening  characteristics with a low voltage applied while ensuring a  higher processing rate for an conductive material, and can  remove an unnecessary conductive material and expose a  barrier film without causing dishing, erosion, or etching at  the interface between the barrier film and a metal ( conduc› tive material). The electrolytic liquid for use in electrolytic  polishing of a surface conductive material of a workpiece  comprises an aqueous solution containing at least one  organic acid or its salt, at least one strong acid having a  sulfonic acid group, a corrosion inhibitor and a water› soluble polymeric compound.  Sep. 4, 2006  Jan. 19, 2007  Jul. 2, 2007  (JP) ...................................... 2006-239347  (JP) ...................................... 2007-009849  (JP) ...................................... 2007-173908  (57)  ABSTRACT  Publication Classification  (30)  Foreign Application Priority Data  Correspondence Address:  WENDEROTH, LIND  &  PONACK, L.L.P.  2033 K STREET N. W.  SUITE 800  WASHINGTON, DC 20006-1021 (US)  82b  80  82a  84 