1111111111111111 IIIIII IIIII 1111111111 11111 111111111111111 IIIII IIIII IIIII IIIIII IIII 11111111  US 20200319551Al  c19)  United States  c12)  Patent Application Publication  Tsuchimura et al.  c10)  Pub. No.: US 2020/0319551 Al  (43)  Pub. Date:  Oct. 8, 2020  (54)  ACTINIC RAY-SENSITIVE OR  RADIATION-SENSITIVE RESIN  COMPOSITION, RESIST FILM, PATTERN  FORMING METHOD, MASK BLANK WITH  RESIST FILM, METHOD FOR PRODUCING  PHOTOMASK, AND METHOD FOR  MANUFACTURING ELECTRONIC DEVICE  (71)  Applicant:  FUJIFILM Corporation,  Tokyo (JP)  (72)  Inventors:  Tomotaka Tsuchimura,  Haibara-gun  (JP);  Takashi Kawashima,  Haibara-gun  (JP);  Akihiro Kaneko,  Haibara-gun  (JP);  Michihiro Ogawa,  Haibara-gun  (JP);  Michihiro Shirakawa,  Haibara-gun (JP);  Hajime Furutani,  Haibara-gun (JP);  Kyohei Sakita,  Haibara-gun (JP)  (73)  Assignee:  FUJIFILM Corporation,  Tokyo (JP)  (21)  Appl. No.:  16/905,566  (22)  Filed:  Jun. 18, 2020  (63)  Continuation  of application  No.  PCT/JP2018/  040207, filed on Oct. 30, 2018.  (51)  Int. Cl.  (52)  U.S. Cl.  CPC ..............  G03F  710045  (2013.01);  G03F  1122  (2013.01);  G03F  71038  (2013.01);  G03F  71039  (2013.01);  G03F  712037  (2013.01);  C08F  212124  (2020.02);  C08F 220/1806  G03F  71004  G03F  1122  G03F  71038  G03F  71039  G03F  7120  C08F  220118  C08F  220128  C08F  212114  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (57)  ABSTRACT  Related U.S. Application Data  (30)  Foreign Application Priority Data  Publication Classification  Dec. 22, 2017  (JP) ................................. 2017-246971  The present invention provides an actinic ray-sensitive or  radiation-sensitive resin composition that can provide a  resist film with excellent sensitivity and a pattern with  excellent LER performance, and can suppress pattern col› lapse during pattern formation. In addition, the present  invention also provides a resist film, a pattern forming  method, a mask blank with a resist film, a method for  producing a photomask, and a method for manufacturing an  electronic device, each using the actinic ray-sensitive or  radiation-sensitive resin composition. The actinic ray-sen› sitive or radiation-sensitive resin composition of an embodi› ment of the present invention includes a resin  X having a  repeating unit A represented by General Formula  (I), a  repeating unit  B having an acid-decomposable group, and a  repeating unit C selected from a repeating unit cl repre› sented by General Formula  (II) and the like; a compound Y  which is a basic compound or ammonium salt compound  whose basicity is reduced upon irradiation with actinic rays  or radiation; and a photoacid generator Z which is a com› pound other than the compound  Y.  (2020.02);  C08F  2201282  (2020.02);  C08F  220/1811  (2020.02);  C08F 2201281  (2020.02);  C08F 220/1804  (2020.02);  G03F 712004  (2013.01)  RI  ~ $_{JtfCF3) }$ CF3  OH  n  RI!  ~ $_{Q }$ T  0  (I)  (II) 