US 2007/0072121 Al  26  Mar. 29, 2007  DUV-30 Series, DUV-40 Series (produced by Brewer Sci› ence, Inc.), AR-2, AR-3 andAR-5 (produced by Shipley Co.,  Ltd.).  [0149]  In the production or the like of a precision inte› grated circuit device, the step of forming a pattern on a resist  film is performed by coating the positive resist composition  of the present invention on a substrate (for example, a  silicon/silicon dioxide-coated substrate, a glass substrate, an  ITO substrate or a quartz/chromium oxide-coated substrate)  to form a resist film, irradiating thereon actinic rays or  radiation such as KrF excimer laser light, electron beam or  EUV light, and then subjecting the resist film to heating,  development, rinsing and drying, whereby a good resist  pattern can be formed.  [0150]  The alkali developer which can be used in the  development is an aqueous solution of an alkali (usually, 0.1  to 20 mass %) such as inorganic alkalis (e.g., sodium  hydroxide, potassium hydroxide, sodium carbonate, sodium  silicate, sodium metasilicate, aqueous ammonia), primary  amines (e.g., ethylamine, n-propylamine), secondary amines  (e.g., diethylamine, di-n-butylamine), tertiary amines (e.g.,  triethylamine, methyldiethylamine), alcohol amines (e.g.,  dimetylethanolamine, triethanolamine), quaternary ammo› nium salts (e.g., tetramethylannnonium hydroxide, tetra› ethylammonium hydroxide, choline) and cyclic amines  ( e.g., pyrrole, piperidine ). This aqueous solution of an alkali  may be used after adding thereto alcohols such as isopropyl  alcohol or a surfactant such as nonionic surfactant in an  appropriate amount.  [0151]  Among these developers, preferred are a quater› nary ammonium salt, more preferred are tetramethylammo› nium hydroxide and choline.  [0152]  The pH of the alkali developer is usually from 10  to 15.  [0153]  The present invention is described in greater detail  below by referring to Examples, but the present invention  should not be construed as being limited thereto. In the  following, Resins A-1 to A-20 correspond to Resins (1) to  (20) set forth above. (Synthesis Example  1:  synthesis of  Resin A-1)  [0154]  Acetoxystyrene, styrene and 2-methyl-2-adaman› tyl cinnamate were charged at a ratio of 60/20/20 (by mo!)  and dissolved in tetrahydrofuran to prepare 100 mL of a  solution having a solid content concentration of 20 mass  %.  Subsequently, 2 mo! % of polymerization initiator V-65  (produced by Waka Pure Chemical Industries, Ltd.) was  added thereto and the resulting solution was added dropwise  to 10 ml oftetrahydrofuran heated at 60°  C., over 4 hours in  a nitrogen atmosphere. After the completion of dropwise  addition, the reaction solution was heated for 4 hours, and 1  mo!  % of V-65 was again added, followed by stirring for 4  hours. After the completion of reaction, the reaction solution  was cooled to room temperature and then crystallized in 3 L  of hexane, and the precipitated white powder was collected  by filtration.  [0155]  The compositional ratio of the polymer determined  from C$^{13}$NMR was 58/20/22 (by mo!). Also, the weight  average molecular weight determined from GPC was 9,500  in terms of the standard polystyrene.  [0156]  This polymer was dissolved in 100 ml of acetone,  5 ml of hydrochloric acid was then added thereto and after  stirring 1 hour, distilled water was added to precipitate a  polymer. The precipitate was washed with distilled water  and dried under reduced pressure. Furthermore, the polymer  was dissolved in 100 ml of ethyl acetate and after adding  hexane, the polymer precipitated was dried under reduced  pressure to obtain a powder form of the polymer. The weight  average molecular weight of this powder determined by  GPC was 10,000 in terms of the standard polystyrene.  [0157]  The resins shown in Table 1, having structures set  forth above, were synthesized in the same manner as in  Synthesis Example 1. In Table 1, the molar ratio of repeating  units is a molar ratio of repeating units starting from the left  in the structure shown above.  [0158]  Incidentally, Resin C-1 of Comparative Example is  a p-hydroxystyrene-styrene-tert-butyl acrylate copolymer  (molar ratio: 60/20/20) having a weight average molecular  weight of 10,000 and a dispersity of 2.28.  [0159]  The sulfonic acid generators and carboxylic acid  generators used in Examples all were synthesized by a  known synthesis method such as synthesis method described  in JP-A-2002-27806.  [0161]  These components were dissolved in 8.8 g of  propylene glycol monomethyl ether acetate, and 0.003 g of  D-1 (see below) as the organic basic compound and 0.001 g  ofMegafac Fl 76 (produced by Dainippon Ink & Chemicals,  Inc., hereinafter simply referred to as "W-1") as the surfac› tant were further added thereto and dissolved. The obtained  Example 1  EXAMPLES  TABLE 1  Repeating Unit  Weight Average  Polymer  (mo!%)  Molecular Weight  Dispersity  A-1  60/20/20  10000  1.75  A-2  60/25/15  8500  1.73  A-3  60/20/20  9500  1.64  A-4  60/25/15  10000  1.65  A-5  60/25/15  9500  1.80  A-6  60/20/20  10500  1.65  A-7  60/25/15  9500  1.78  A-8  60/20/20  10000  1.70  A-9  60/20/20  8500  1.85  A-10  60/25/15  8500  1.92  A-11  60/20/20  12000  1.74  A-12  60/25/15  9000  1.55  A-13  65/10/25  7900  1.52  A-14  60/20/20  11500  1.42  A-20  70/20/10  9000  1.29  C-1  60/20/20  10000  2.28  [0160]  (1) Preparation and Coating of Positive Resist  Resin A-2  Sulfonic Acid Generator B-2  Carboxylic Acid Generator C-2  0.93 g  0.065 g  0.005 g 