US 2020/0319555 Al  11  Oct. 8, 2020  (18)  pounds, having a boiling point of at least 100° C. at 1  atmosphere pressure, having structure (22), wherein Rl  O  is  a C2-C25 alkyl.  (22)  [0114]  In another embodiment of any of the above aspects  of this invention said solid component e ), said quencher  system consists only of a compound or a mixture of com› pounds, having a boiling point of at least 100° C. at 1  atmosphere pressure, having structure (19), wherein where n  and n’ are independently 2 to 4.  (19)  [0118]  In another embodiment of the above aspects of this  invention said solid component e ), said quencher system,  where the quencher has a boiling point of at least 100°  C. at  1 atmosphere pressure, is one having one compound of  structure (1), wherein R$_{1 }$ is a C2 to C20 alkyl moiety, and  R$_{1}$ a  is a Cl to  CS  alkyl, and further wherein position 3 and  2 are connected by a double bond.  [0119]  In another embodiment of any of the above aspects  of this invention said solid component e ), said quencher  system consists only of a compound having structure (23).  (23)  [0115]  In another embodiment of any of the above aspects  of this invention said solid component e ), said quencher  system consists only of a compound having structure (20).  (20)  [0120]  In the above described novel composition the solid  components may be dissolved in a solvent component f)  which is an organic solvent. Examples of suitable organic  solvents include, without limitation, butyl acetate, amyl  acetate, cyclohexyl acetate, 3-methoxybutyl acetate, methyl  ethyl ketone, methyl amyl ketone, cyclohexanone, cyclo› pentanone, ethyl-3-ethoxy propanoate, methyl-3-ethoxy  propanoate, methyl-3-methoxy propanoate, methyl acetoac› etate, ethyl acetoacetate, diacetone alcohol, methyl pivalate,  ethyl pivalate, propylene glycol monomethyl ether, propyl› ene glycol monoethyl ether, propylene glycol monomethyl  ether propanoate, propylene glycol monoethyl ether pro› panoate, ethylene glycol monomethyl ether, ethylene glycol  monoethyl ether, diethylene glycol monomethyl ether, dieth› ylene glycol monoethyl ether, 3-methyl-3-methoxybutanol,  N-methylpyrrolidone, dimethyl sulfoxide, gamma-butyro› lactone, propylene glycol methyl ether acetate, propylene  glycol ethyl ether acetate, propylene glycol propyl ether  acetate, methyl lactate, ethyl lactate, propyl lactate, tetram› ethylene sulfone, propylene glycol dimethyl ether, dipropyl› ene glycol dimethyl ether, ethylene glycol dimethyl ether or  diethylene glycol dimethyl ether, gamma butyrolactone.  These solvents may be used singly or in a mixture of two or  more.  [0121]  In one embodiment, the solid components are  dissolved in PGMEA (1-Methoxy-2-propanyl acetate).  [0122]  Other optional additives, which have compatibility  with and can be added to the novel photoresist composition  disclosed and claimed herein according to need, include  auxiliary resins, plasticizers, surface leveling agents and  stabilizers to improve the properties of the resist layer, and  the like. Surface leveling agents may include surfactants.  [0116]  In another embodiment of any of the above aspects  of this invention said solid component e ), said quencher  system consists only of a compound or a mixture of com› pounds, having a boiling point of at least 100° C. at 1  atmosphere pressure, having structure (21), wherein R$_{9 }$ and  R$_{10 }$are independently selected from H, or a C-2-C25 alkyl  and further wherein at least one of R9 or Rl  O  is a C2-C25  alkyl.  (21)  [0117]  In another embodiment of any of the above aspects  of this invention said solid component e ), said quencher  system consists only of a compound or a mixture of com- H  I  0  H-0\_(  N\_0-H.  f o"’--.  r~J~-ro- -0 