May 5,  2011  27  US 2011/0104454 Al  a layer to be plated and subsequent leaving thereof to stand for  10 minutes, occurrence of precipitation was not seen by  visual observation.  [  043 2]  A metal pattern material having a copper plated film  was obtained in the same manner as Example 6 except that the  composition F for forming a layer to be plated, used in  Example 6, was changed to the above obtained composition I  for forming a layer to be plated.  [0433]  Preparation of Composition  J  for Forming a Layer  to be Plated  [0434]  0.70 g (6.97% by mass) of the specific polymer A  (solid content:87% by mass), 8.56 g (85.24% by mass) of  water and 0.24 g (2.39% by mass) of sodium hydrogen car› bonate were mixed and stirred to prepare a solution contain› ing the specific polymer A dissolved therein. Separately, 0.5 g  (4.98% by mass) of methanol, 0.021 g (0.21% by mass) of  water-insoluble photopolymerization initiator (IRGACURE  907 used in Example 1) and 0.021 g (0.21% by mass) of  surfactant (Aqalon RN-20, trade name, manufactured by  DAI-ICHI KOGYO SEIYAKU CO., LTD.) were mixed and  dissolved to prepare a solution, and then the resultant solution  was slowly added while stirring to the solution containing the  specific polymer A dissolved therein so as to disperse the  photopolymerization initiator therein. The resultant liquid  was heated at 60°  C. for 8 hours, and methanol was removed.  A quantity of water equal to the decreased weight was added.  Thereafter, filtration with #420 filter cloth (pore size: 60.5  µm)  was carried out, so that solids having a large dispersion  size were removed to produce a composition  J  for forming a  layer to be plated ( dispersion liquid) of Comparative Example  1. At this time, the content of methanol contained in the  water-alcohol mixed solvent was 5.51 % by mass. Further,  after the production of the composition  J  for forming a layer  to be plated of Comparative Example 1 and subsequent leav› ing thereof to stand for 10 minutes, occurrence of precipita› tion was seen by visual observation.  [0435]  A metal pattern material having a copper plated film  was obtained in the same manner as Example 1 except that the  composition A for forming a layer to be plated, used in  Example 1, was changed to the above obtained composition  J  for forming a layer to be plated.  [0436]  Preparation of Composition K for Forming a Layer  to be Plated  [0437]  8.9 g of water, 0.37 g ofNaHCO$_{3}$ ,  and 0.66 g of the  specific polymer B (the above-described structure, solid con› tent: 99% by mass, weight average molecular weight: 16,000)  were mixed and stirred to prepare a solution containing the  specific polymer B dissolved therein. Separately, 0.5 g of  methanol, 0.021 g of water-insoluble photopolymerization  initiator (IRGACURE 907) and 0.021 g of surfactant (Aqalon  RN-20) were mixed and dissolved to prepare a solution, and  then the resultant solution was slowly added while stirring to  the solution containing the specific polymer B dissolved  therein so as to disperse the water-insoluble photopolymer› ization initiator therein. The resultant liquid was heated at 60°  C. for 8 hours, and methanol was removed. A quantity of  water equal to the decreased weight was added. Thereafter,  filtration with #420 filter cloth was carried out, so that solids  having a large dispersion size were removed to produce a  composition k for forming a layer to be plated ( dispersion  liquid) of Comparative Example 2. At this time, the content of  methanol contained in the water-alcohol mixed solvent was  0% by mass. Further, after the production of the composition  K for forming a layer to be plated of Comparative Example 2  and subsequent leaving thereof to stand for 10 minutes, occur› rence of precipitation was seen by visual observation.  [0438]  A metal pattern material having a copper plated film  was obtained in the same manner as Example 1 except that the  composition A for forming a layer to be plated, used in  Example 1, was changed to the above obtained composition K  for forming a layer to be plated.  [0439]  Preparation of Composition L for Forming a Layer  to be Plated  [0440]  0.30 g (7.5% by mass) of the specific polymer A  (solid content: 87% by mass) used in Example 1, 0.07 g  (1.75% by mass) of sodium hydrogen carbonate, 1.63 g (40.  6% by mass) ofwaterand2.0 g (49.9% by mass) of methanol  were mixed while stirring to dissolve the specific polymer A,  followed by further stirring to prepare a composition L for  forming a layer to be plated of Comparative Example 3.  [0441]  The same manner as Example 1 was carried out  except that the composition A for forming a layer to be plated,  used in Example 1, was changed to the above-obtained com› position L for forming a layer to be plated.  [0442]  Evaluation of Pattern-Forming Performance  [0443]  The plated film produced by using each of the com› positions for forming a layer to be plated, obtained in  Examples 1 to 8, had a thickness of 1 µm,  and a metal pattern  having high resolution of mask size of –1 % or less was  confirmed by observation using an optical microscope.  It  was  confirmed that the metal pattern obtained in Example 9 is a  metal pattern having high resolution of mask size of –5% or  less.  [0444]  The plated films produced by using the composition  for forming a layer to be plated, obtained in Comparative  Examples 1 and 2, had a thickness of 1 µm.  It  was confirmed  that the metal pattern obtained by using a photomask having  line and space of300  µm  had a wiring width exhibiting a 40%  to 50% increase. In the composition obtained without filtra› tion by a filter cloth, spaces between wirings were filled in  (metal pattern having a wiring width exhibiting a 100% or  more increase), and formation of a pattern having high reso› lution was difficult.  [0445]  Further, pattern formation was attempted using the  composition for forming a layer to be plated, not containing  the water-insoluble photopolymerization initiator obtained in  Comparative Example 3, but a film was not formed.  [0446]  Line and space of the pattern obtained in the above› described Examples and Comparative Examples were mea› sured. With respect to the line width of line and space of the  photomask used in pattern exposure, when a fluctuation range  of the wiring width was less than 1 %, it was evaluated as "O";  when a fluctuation range of the line width was from 1 % to less  than 5%, it was evaluated as  "li.";  and when a fluctuation range  of the line width was 5% or more, it was evaluated as "X". In  this evaluation, "O" and  "ti."  are levels where there are no  practical problems. The results are shown in Table 1 below.  [0447]  Evaluation of Adhesion  [0448]  Using the composition for forming a layer to be  plated, each obtained in Examples 1 to 9 and Comparative  Examples 1 to 2, and carrying out exposure thereto without a  Comparative Example 2  Comparative Example 3  Comparative Example 1 