US009829796B2  c12)  United States Patent  Takizawa et al.  (54)  PATTERN FORMATION METHOD, ACTIVE  LIGHT-SENSITIVE OR  RADIATION-SENSITIVE RESIN  COMPOSITION, RESIST FILM,  PRODUCTION METHOD FOR ELECTRONIC  DEVICE USING SAME, AND ELECTRONIC  DEVICE  (IO)  Patent No.:  US 9,829,796 B2  Nov. 28, 2017  (45)  Date of Patent:  (71)  Applicant:  FUJIFILM Corporation,  Tokyo (JP)  (72)  Inventors:  Hiroo Takizawa,  Shizuoka (JP);  Takuya Tsuruta,  Shizuoka (JP);  Tomotaka Tsuchimura,  Shizuoka (JP)  (73)  Assignee:  FUJIFILM Corporation,  Tokyo (JP)  ( *)  Notice:  Subject to any disclaimer, the term of this  patent is extended or adjusted under 35  U.S.C. 154(b) by  O  days.  (21)  Appl. No.:  15/011,863  (22)  Filed:  Feb. 1, 2016  (51)  Int. Cl.  (52)  U.S. Cl.  CPC ..............  G03F  71325  (2013.01);  C08F  12122  (2013.01);  C08F  12132  (2013.01);  G03F  710045  (2013.01);  G03F  710046  (2013.01);  G03F  71038  (2013.01);  G03F  710382  (2013.01);  G03F  710388  (2013.01);  G03F  710392  (2013.01);  G03F  710397  (2013.01);  G03F  712004  (2013.01);  G03F  712059  (2013.01)  ( 58)  Field of Classification Search  None  See application file for complete search history.  (57)  ABSTRACT  54 Claims, No Drawings  (56)  References Cited  U.S. PATENT DOCUMENTS  OTHER PUBLICATIONS  FOREIGN PATENT DOCUMENTS  (65)  Prior Publication Data  Related U.S. Application Data  (30)  Foreign Application Priority Data  US 2016/0147155 Al  May 26, 2016  (63)  Continuation  of  application  PCT/JP2014/066448, filed on Jun. 20, 2014.  No.  Aug. 1, 2013  (JP) ................................. 2013-160616  G03F  7132  G03F  71039  G03F  71038  G03F  71004  G03F  7120  C08F  12132  C08F  12122  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (2006.01)  (2006.01)  2012/0077131 Al  2012/0308930 Al  2013/0029254 Al  2013/0101936 Al  2014/0113236 Al  2014/0193749 Al  2014/0227642 Al  2015/0118623 Al*  3/2012 Enomoto et al.  12/2012 Hatakeyama et al.  1/2013 Tsuchimura et al.  4/2013 Taniguchi et al.  4/2014 Senzaki et al.  7/2014 Takizawa et al.  8/2014 Shirakawa et al.  4/2015 Tsuruta ..................... C08F 8/02  430/286.1  JP  JP  JP  JP  JP  JP  JP  JP  JP  JP  JP  JP  JP  JP  JP  JP  KR  TW  WO  WO  2002-148806  A  2008-268935  A  2010-085971  A  2010-217884 A  2010-256856  A  2011-123469 A  2012-215826  A  2012-242556  A  2013-011866  A  2013-029554  A  2013-054253  A  2013-060537  A  2013-076991  A  2013-083937  A  2013-092590  A  2013-140336 A  10-2011-0023773  A  201314365 Al  2012/169620 Al  WO 2013/129864 Al *  5/2002  11/2008  4/2010  9/2010  11/2010  6/2011  11/2012  12/2012  1/2013  2/2013  3/2013  4/2013  4/2013  5/2013  5/2013  7/2013  3/2011  4/2013  12/2012  9/2013  Google English translation for WO 2013/129864 Al (2013).*  Preliminary Report (PCT/IB/373) dated Feb. 2, 2016, issued by the  International Searching Authority in counterpart International  Application No. PCT/JP2014/066448.  Translation ofWritten Opinion (PCT/ISA/237) dated Aug. 19, 2014,  issued by the International Searching Authority in counterpart  International Application No. PCT/JP2014/066448.  Search Report dated Aug. 19, 2014, issued by the International  Searching Authority in counterpart International Application No.  PCT/JP2014/066448 (PCT/ISA/210).  Written Opinion dated Aug. 19, 2014, issued by the International  Searching Authority in counterpart International Application No.  PCT/JP2014/066448 (PCT/ISA/237).  Office Action dated Oct. 25, 2016 issued by the Japanese Patent  Office in counterpart Japanese Patent Application No. 2013-160616.  Office Action dated Feb. 17, 2017, issued by the Korean Intellectual  Property Office in counterpart Korean Application No. 10-2016- 7002776.  Notification of Reason for Refusal, dated Aug. 28, 2017, issued in  corresponding KR Application No. 10-2016-7002776, 17 pages in  English and Korean.  Office Action dated Sep. 6, 2017 in corresponding Taiwanese  Application No. 103125994.  * cited by examiner  Primary Examiner  - Sin Lee  (74)  Attorney, Agent, or Firm  - Sughrue Mion, PLLC  There are provided A pattern formation method, including:  (1) forming a film using an active light-sensitive or  radiation-sensitive resin composition;  (2) exposing the film to active light or radiation; and  (3) developing the exposed film using a developer includ› ing an organic solvent,  wherein the active light-sensitive or radiation-sensitive  resin composition contains a resin (A) having specific  3 repeating units.  9,170,489 B2  10/2015 Takizawa et al.  2002/0061462 Al  5/2002 Uenishi  2010/0248143 Al  9/2010 Ito et al.  2011/0159433 Al  6/2011 Takahashi et al.  2011/0189609 Al*  8/2011 Kawabata .  C07D 327/08  430/270.1  2011/0300485 Al  12/2011 Tsubaki et al. 