US 2019/0235380 Al  29  Aug. 1, 2019  [0340]  A cured film of the present embodiment is obtained  by curing the negative type photosensitive resin composition  according to the embodiment described above. The tensile  elasticity of the cured film according to the present embodi› ment is preferably 2.0 GPa or greater and more preferably  [0339]  (Cured Film)  [0330]  Examples of the ester solvents include methyl  acetate, butyl acetate, ethyl acetate, isopropyl acetate, amyl  acetate, isoamyl acetate, ethyl methoxyacetate, ethyl ethoxy› acetate, propylene glycol monomethyl ether acetate (PG› MEA), ethylene glycol monoethyl ether acetate, ethylene  glycol monopropyl ether acetate, ethylene glycol monobutyl  ether acetate, ethylene glycol monophenyl ether acetate,  diethylene glycol monomethyl ether acetate, diethylene gly› col monopropyl ether acetate, diethylene glycol monoethyl  ether acetate, diethylene glycol monophenyl ether acetate,  diethylene glycol mono butyl ether acetate, diethylene glycol  monoethyl  ether  acetate,  2-methoxybutyl  acetate,  3-methoxybutyl acetate, 4-methoxybutyl acetate, 3-methyl- 3-methoxybutyl acetate, 3-ethyl-3-methoxybutyl acetate,  propylene glycol monomethyl ether acetate, propylene gly› col monoethyl ether acetate, propylene glycol monopropyl  ether acetate, 2-ethoxybutyl acetate, 4-ethoxybutyl acetate,  4-propoxybutyl  acetate,  2-methoxypentyl  acetate,  3-methoxypentyl  acetate,  4-methoxypentyl  acetate,  2-methyl-3-methoxypentyl acetate, 3-methyl-3-methoxy› pentyl  acetate,  3-methyl-4-methoxypentyl  acetate,  4-methyl-4-methoxypentyl acetate, propylene glycol diac› etate, methyl formate, ethyl formate, butyl formate, propyl  [0338]  According to the pattern forming method of the  embodiment described above, since the negative type pho› tosensitive resin composition according to the first embodi› ment is used, the sensitivity is improved, and the amount of  residues is decreased so that a pattern having an excellent  shape and high resolution can be formed.  [0337]  In the rinse treatment, water rinse using pure water  is preferable in a case of an alkali developing solution.  Further, it is preferable to use a rinsing liquid containing an  organic solvent in a case of an organic developing solution.  [0336]  The rinse treatment (washing treatment) performed  using a rinse liquid can be carried out according to a known  rinse method. Examples of the rinse treatment method  include a method of continuously ejecting a rinse liquid onto  a support rotating at a constant speed ( a rotary coating  method), a method of immersing a support in a rinse liquid  for a predetermined time (a dip method), and a method of  spraying a rinse liquid to the surface of a support (a spray  method).  [0329]  Examples of the ketone solvents include 1-oc› tanone,  2-octanone,  1-nonanone, 2-nonanone, acetone,  4-heptanone, 1-hexanone, 2-hexanone, diisobutyl ketone,  cyclohexanone,  methylcyclohexanone,  phenylacetone,  methyl ethyl ketone, methyl isobutyl ketone, acetylacetone,  acetonylacetone, ionone, diacetonylalcohol, acetylcarbinol,  acetophenone, methyl naphthyl ketone, isophorone, propyl› enecarbonate, y-butyrolactone and methyl amyl ketone  (2-heptanone). Among these examples, as a ketone solvent,  methyl amyl ketone (2-heptanone) is preferable.  [0335]  The developing treatment can be performed by a  known developing method. Examples thereof include a  method of immersing a support in a developing solution for  a predetermined time (a dip method), a method of stacking  up a developing solution on the surface of a support using  the surface tension and maintaining the state for a predeter› mined time (a puddle method), a method of spraying a  developing solution to the surface of a support (a spray  method), and a method of continuously ejecting a develop› ing solution from a developing solution ejecting nozzle onto  a support rotating at a constant speed while scanning the  developing solution ejecting nozzle at a constant rate (a  dynamic dispense method).  [0334]  In a case where a surfactant is blended, the amount  thereof to be blended is typically in a range of0.001 % to 5%  by mass, preferably in a range of0.005% to 2% by mass, and  more preferably in a range of 0.01 % to 0.5% by mass with  respect to the total amount of the organic developing solu› tion.  [0328]  As the organic solvent contained in the organic  developing solution, a solvent which is capable of dissolving  the component (A) (the component (A) which has not been  exposed yet) may be used and can be appropriately selected  from known organic solvents. Specific examples of the  organic solvent include polar solvents such as ketone sol› vents, ester solvents, alcohol solvents, nitrile solvents, amide  solvents, and ether solvents; and hydrocarbon solvents.  [0327]  As the alkali developing solution, a 0.1 to 10 mass  % tetramethylammonium hydroxide (TMAH) aqueous solu› tion can be exemplified.  [0326]  The developing solution used in the development  treatment may be an alkali aqueous solution or an organic  developing solution containing an organic solvent.  [0333]  As the surfactant, a non-ionic surfactant is prefer› able, and a non-ionic fluorine-based surfactant or a non› ionic silicon-based surfactant is more preferable.  [0332]  Known additives can be blended with the organic  developing solution as necessary. Examples of the additive  include surfactants. The surfactant is not particularly lim› ited, and for example, an ionic or non-ionic fluorine-based  and/or silicon-based surfactant can be used.  [0331]  Examples of the nitrile solvents include acetoni› trile, propionitrile, valeronitrile, and butyronitrile.  [0325]  By performing the above-described film forming  step, exposure step, and development step, a pattern can be  formed.  [0324]  Next, the exposed photosensitive resin film is sub› jected to a development treatment. After the development  treatment, it is preferable that a rinse treatment be per› formed. As necessary, a bake treatment (post bake) may be  performed.  [0323]  [Development Step]  formate, ethyl lactate, butyl lactate, propyl lactate, ethyl  carbonate, propyl carbonate, butyl carbonate, methyl pyru› vate, ethyl pyruvate, propyl pyruvate, butyl pyruvate, methyl  acetoacetate, ethyl acetoacetate, methyl propionate, ethyl  propionate, propyl propionate, isopropyl propionate, methyl  2-hydroxypropionate, ethyl 2-hydroxypropionate, methyl-3- methoxypropionate,  ethy 1-3-methoxypropionate, ethy 1-3- ethoxypropionate,  and  propyl-3-methoxypropionate.  Among these examples, as an ester solvent, butyl acetate or  PGMEA is preferable.  [0322]  The haze value of the photosensitive resin film  after the exposure step is measured using a method in  conformity with JIS K 7136 (2000).  or the photosensitive resist film according to the embodi› ment is highly transparent. Therefore, the optical transpar› ency is increased during the exposure in pattern formation so  that a negative type pattern with excellent lithography  characteristics is likely to be obtained. 