Aug. 7, 2008  33  US 2008/0188162 Al  a polishing head adapted to press a substrate against said  polishing surface;  a first electrode coupled to one of poles of a power source  and arranged below said polishing pad;  a second electrode coupled to another of the poles of the  power source and adapted to supply an electric current to  a conductive film on the substrate;  an electrolytic-solution supply section for supplying an  electrolytic solution to said polishing pad; and  a moving mechanism for providing relative movement  between said polishing pad and the substrate held by  said polishing head,  wherein each of said through-holes has an upper opening  with a smaller diameter than a diameter of a lower open› ing thereof.  a diameter of each of said through-holes is decreased  gradually from said lower opening to said upper open› ing.  before or after said polishing, conditioning the processing  electrode and/or the polishing pad using a conditioning  solution including components of the electrolytic solu› tion other than the corrosion inhibitor.  each of said through-holes comprises plural holes arranged  vertically in series with different diameters.  polishing a conductive material of a workpiece by provid› ing sliding contact between the conductive material and  the polishing pad, which is arranged between the pro› cessing electrode and the conductive material, and by  applying a voltage between the conductive material and  at least one organic acid or its salt; and  at least one strong acid having a sulfonic acid group,  wherein said conditioning solution does not contain a cor- rosion inhibitor.  20.  The electrochemical mechanical polishing apparatus  according to claim  19,  wherein  21.  The electrochemical mechanical polishing apparatus  according to claim  19,  wherein  22.  A method of conditioning a processing electrode and/or  a polishing pad of an electrochemical mechanical polishing  apparatus, said method comprising:  the processing electrode in the presence of an electro› lytic solution containing an organic acid and a corrosion  inhibitor; and  23.  The method according to claim  22,  wherein the condi› tioning solution further containing an oxidizing agent.  24.  The method according to claim  22,  wherein the organic  acid comprises at least one of acetic acid, propionic acid,  oxalic acid, malonic acid, succinic acid, glutaric acid, adipic  acid, maleic acid, fumaric acid, citric acid, aconitic acid,  glyoxylic acid, glycolic acid, lactic acid, gluconic acid, malic  acid, and tartaric acid.  25.  The method according to claim  22,  wherein the organic  acid comprises a strong acid having a sulfonic acid group.  26.  The method according to claim  22,  wherein the strong  acid having a sulfonic acid group comprises benzenesulfonic  acid, methanesulfonic acid, taurine, cysteic acid, analkylben› zene sulfonic acid having one to six carbons in an alkyl group,  trifluoromethanesulfonic acid, and fluorosulfonic acid.  27.  A conditioning solution for use in conditioning a pro› cessing electrode and/or a polishing pad of an electrochemi› cal mechanical polishing apparatus, said conditioning solu› tion comprising:  28.  The conditioning solution according to claim  27,  fur› ther comprising an oxidizing agent.  *  *  *  *  * 