(IO)  Patent No.:  US 7,410,747 B2  (45)  Date of Patent:  Aug. 12, 2008  c12)  United States Patent  Sasaki  (54)  POSITIVE RESIST COMPOSITION AND  PATTERN FORMING METHOD USING THE  SAME  (75)  Inventor:  Tomoya Sasaki,  Shizuoka (JP)  (73)  Assignee:  FUJIFILM Corporation,  Tokyo (JP)  ( *)  Notice:  Subject to any disclaimer, the term ofthis  patent is extended or adjusted under 35  U.S.C. 154(b) by 120 days.  (21)  Appl. No.:  11/234,187  (22)  Filed:  Sep.26,2005  (51)  Int. Cl.  G03F  71039  (2006.01)  (52)  U.S. Cl.  ....................  430/270.1;  430/176; 430/326;  430/907  (58)  Field of Classification Search  .............. 430/270.1,  430/176, 326, 907  See application file for complete search history.  FOREIGN PATENT DOCUMENTS  OTHER PUBLICATIONS  (57)  ABSTRACT  20 Claims, No Drawings  (56)  References Cited  U.S. PATENT DOCUMENTS  (65)  Prior Publication Data  (30)  Foreign Application Priority Data  2003/0031952 Al*  2/2003 Harada et al ............. 430/270.1  2003/0180653 Al*  9/2003 Ohsawa et al. .............. 430/170  2004/0087694 Al  5/2004 Nakao  2005/0130444 Al*  6/2005 Rogalli et al. ............... 438/780  2005/0147916 Al*  7/2005 Yueh et al. ............... 430/270.1  EP  0 102 450 A  3/1984  EP  0 404 206 A  12/1990  EP  0701171 Al *  3/1996  GB  2360774  A  * 10/2001  JP  6-41221 A  2/1994  JP  2000-122291  A  4/2000  JP  2000-241976  A  9/2000  JP  3173368 B2  3/2001  JP  2001-114825 A  4/2001  JP  2001-206917  A  7/2001  JP  2002-202610  A  7/2002  JP  2002-323768  A  11/2002  4,603,101 A  *  4,678,737  A  5,300,404  A  *  5,342,727  A  5,397,680  A  *  5,541,263  A  *  5,558,978  A  7/1986 Crivello ................... 430/270.1  7/1987 Schneller et al. ......... 430/270.1  4/1994 Tani et al. ................... 430/326  8/1994 Vicari et al. ................ 430/157  3/1995 Schadeli et al. .......... 430/270.1  7/1996 Thackeray et al. ....... 525/328.8  9/ 1996 Schadeli et al.  US 2006/0068322 Al  Mar. 30, 2006  Sep.24,2004  (JP)  ......................... P. 2004-278320  A positive resist composition satisfying high sensitivity, high  resolution and good line edge roughness at the same time, and  a pattern forming method using the composition, are pro› vided, which is a positive resist composition comprising (A)  a resin of which solubility in an alkali developer increases  under the action of an acid, the resin containing a repeating  unit having a specific styrene skeleton and a repeating unit  having a specific ring structure, and (B) a compound of gen› erating an acid upon irradiation with actinic rays or radiation;  and a pattern forming method using the composition.  European Search Report dated Dec. 7, 2005.  * cited by examiner  Primary Examiner-Cynthia  Hamilton  (74)  Attorney, Agent, or Firm-Sughrue  Mion, PLLC  US007 4107 4 7B2 