c19)  United States  c12)  Patent Application Publication  Moore  c10)  Pub. No.: US 2007 /0191243 Al  (43)  Pub. Date:  Aug. 16, 2007  (54)  REMOVAL OF SILICA BASED ETCH  RESIDUE USING AQUEOUS CHEMISTRY  (75)  Inventor:  John C. Moore,  Camarillo, CA (US)  (73)  Assignee:  GENERAL CHEMICAL PERFOR› MANCE PRODUCTS, LLC,  Parsip› pany, NJ (US)  (21)  Appl. No.:  11/307,556  (22)  Filed:  Feb. 13, 2006  (51)  Int. Cl.  CllD  7132  (2006.01)  Correspondence Address:  ARTHUR J. PLANTAMURA  GENERAL CHEMICAL PERFORMANCE  PRODUCTS LLC.  90 EAST HALSEY ROAD  PARSIPPANY, NJ 07054 (US)  Removal of silica-based etch residue is effected by use of an  aqueous chemistry which eliminates hazard concerns in  connection with electronic component fabrication tooling.  The system employs a formulated product comprising a  controlled level of ionized fluorine in a citrate buffer con› taining a dual surfactant system for etch residue penetration  and rinsing. The combined system is proven to be ideal for  Si-based etch residue dissolution and removal. The Si› residue removal rates have been characterized at specific  buffered pH values and normal process conditions at times  between 45 sec. to 3 min., and with those described being  effectual at times of the order of 45 sec. or less when  processed in a single-wafer tool. The product simplifies and  reduces cost time and materials.  Publication Classification  (57)  ABSTRACT  11  10  11  Lithography  - - -$^{(52) }$ Plasma  13  Aqueous  Cleaning  U.S. Cl.  ..............................................................  510/175  US 20070191243Al 