US 9,829,796 B2  298  297  (11-2)  wherei~, in General Formula (II-2), each ofRgi, Rg$_{2}$ ,  and  Rg$_{3 }$ mdependently represents an alkyl group, an alkenyl  group, a cycloalkyl group, or an aryl group; n81  represents 0 or 1; and at least two of Rg$_{1 }$ to Rg$_{3 }$ may be  connected to each other to form a ring, and  w~erein, in Formula (V), each of Rg$_{1}$ ,  Rg$_{2}$ ,  and Rg$_{3 }$ mdependently represents a hydrogen atom, an alkyl  group, a cycloalkyl group, a halogen atom, a cyano  group, or an alkoxycarbonyl group; here, Rg$_{2 }$ may be  bonded to Lg to form a ring, and Rg$_{2 }$ in this case  represents a single bond or an alkylene group; Xg  represents a single bond or a divalent connecting group;  Lg represents a single bond or an (s+l) valent connect› ing group, and in the case of being bonded to Rg$_{2 }$ to  form a ring, represents an (s+2) valent connecting  group; s represents an integer of 1 to 5; here, in a case  where Lg is a single bond, s is 1; and Bg represents a  group containing a cross-linking group.  46.  The active light-sensitive or radiation-sensitive resin  composition according to claim  45,  wherein a cross-linking group included in Bg in General  Formula (V) is a hydroxymethyl group, an alkoxym› ethyl group, an oxirane ring, or an oxetane ring.  47.  The active light-sensitive or radiation-sensitive resin  composition according to claim  45,  48.  The active light-sensitive or radiation-sensitive resin  composition according to claim  47,  49.  The active light-sensitive or radiation-sensitive resin  composition according to claim  45,  50.  The active light-sensitive or radiation-sensitive resin  composition according to claim  45,  51.  The active light-sensitive or radiation-sensitive resin  composition according to claim  45,  52.  The active light-sensitive or radiation-sensitive resin  composition according to claim  45,  53.  The active light-sensitive or radiation-sensitive resin  composition according to claim  52,  54.  A resist film which is formed using the active light- sensitive or radiation-sensitive resin composition according  to claim  45.  *  *  *  *  *  wherein the compound (B) that generates an acid by  active light or radiation is a compound that generates an  acid having a volume of 240 Angstroms 3  or greater.  wherein the active light-sensitive or radiation-sensitive  resin composition further includes a compound (B) that  generates an acid by active light or radiation.  wherein the content of the repeating unit represented by  General Formula  (I)  is 10 mo!  %  to 40 mo!  %  with  respect to the entirety of repeating units in the resin (A).  wherein the bond between X$_{4 }$ and L$_{4 }$ in General Formula  (I)  is a single bond.  wherein the content of the repeating unit represented by  General Formula (V) is 1 mo!  %  to 20 mo!  %  with  respect to the entirety of repeating units in the resin (A).  wherein Bg in General Formula (V) is a group which has  a phenol structure having a hydroxymethyl group or an  alkoxymethyl group, provided that the hydroxymethyl  group is not directly bonded to a nitrogen atom, and the  alkoxymethyl group is not directly bonded to a nitrogen  atom.  wherein Bg in General Formula (V) is a group which has  a phenol structure, a urea structure, or a melamine  structure, having a hydroxymethyl group  or an  alkoxymethyl group.  (V)  Rs1  Rg3  I  I  +c-c+  I  I  Rs2 Xs  I  Ls  I  (Bs), 