[0149]  Copper Slurry Composition (Slurry "8" Composi› tion)  [0150]  In another preferred form, the present invention  doubles the weight percent of 1,6-dioxaspiro(4,4) nonane  2,7-dione (diether) (an Insoluble Complexing Agent).  [0151]  Composition concentrations for one example of the  Slurry 8 Composition are shown in the following table and  is should be noted that the concentration of, inter alia, the  Insoluble Complexing Agent of the present invention may  be changed to alter the resultant slurry.  [0152]  Slurry 8 Composition  [0153]  The slurry composition has a preferred pH range of  about 2.72.  [0154]  The CMP process and results for two examples  employing the Slurry 8 Composition are shown in the  following table. This process may be altered using the same  slurry to acquire different CMP Results. Abrasive A is  colloidal silica, and abrasive B is alumina.  [0155]  CMP Process and Results Utilizing the Slurry 8  Composition  [0156]  Thus, the first above process using the Slurry 8  Composition is achieved by using a polish time of 60  seconds, a polish pressure of 5 psi, a polish table speed of 90  RPM, a spindle speed of 90 RPM and a slurry flow of 175  ml/min.  [0157]  The second process example using the Slurry 8  Composition is achieved using a polish time of 60 seconds,  a polish pressure of 3 psi, a polish table speed of 75 RPM,  a spindle speed of 75 RPM and a slurry flow of 175 ml/min.  [0158]  As  mentioned above, the oxidizers in accordance  with the present invention may further include sulfuric  and/or citric acid. Sulfuric acid provides a way of modifying  the  pH  of the oxidizer so that the hydroxylamine chemistries  are on the acidic side and are therefore oxidizers. Citric acid  works as a complexing agent for copper for helping to retain  copper in a complex form (i.e., in a copper I or copper II  state) so as to preclude copper from redepositing or coming  out of solution because of other secondary chemical reac› tions. Below are some polishing rates obtained with various $^{5.2% }$ Oxidizer E formulations, where Oxidizer E contains 2%  Hydroxylamine, 3%  HAS,  2.7% sulfuric acid, balance  water.  [0159]  In further preferred forms, the present invention  includes slurry compositions comprised of Oxidizer E. The  following table delineates static etching rate (Nmin.) at  130°  F.  for twenty-two specific examples and static etching  rate at a few different temperatures for a few of the twenty› two specific examples of slurry compositions in accordance  with the present invention and further delineates composi› tion concentrations (mixing ratios) for the twenty-two  examples.  [0160]  Static Etching Rate For Copper CMP Slurry Com› positions  [0161]  The stock solution for the 9011 Oxidizer is 1 %  Hydroxylamine nitrate, 0.016% ETA, and 0.006% nitric  acid. It is then diluted down at the percentage values in the  Tables.  [0162]  The stock solution for MPX-073, also sometimes  called CMP9060, is 0.2% ETA in water.  Aug. 15,2002  14  US 2002/0111024 Al  Component  Oxidizer D  1,6-dioxaspiro( 4,4)nonane 2, 7-dione  (diether)  H$_{2}$SO$_{4 }$ Abrasive  DI Water  Composition (wt. %)  60.0%  0.10%  2.0%  20.0  18%  Dia-58 pt  Polar-49 pt/6 mmEE  CMP Process  Mean Removal  Mean Removal  Slurry  s/pp/ts/ss/sf  Rate (A/min)  WWNU  %  Rate (A/min)  WWNU  (%)  Slurry 8 60/5/90/90/175 4654  Slurry 8 60/3/75/75/175 2308  6.2%  5.2%  4545  2331  8.8%  CMP Mixing Ratios, Processes and Results for  Slurry Compositions Comprising Oxidizer E  Cu RR  TaN RR  CMP  CMP  CMP  Process  Process  Process  s/pp/ts/ss/sf  s/pp/ts/ss/sf  s/pp/ts/ss/sf  Slurry Composition  5/2/90/90/** 3/2/75/75/* * 3/2/75/75/* *  1) 60% Oxidizer E, 20%  7867  4785  195  Abrasive B, 20% DI water  2) 60% Oxidizer E, 20%  4648  2557  182  Abrasive B, 0.5%  NH$_{2}$NH$_{2 }$ and 19.5% DI water  (pH~ 3)  3) 60% Oxidizer E, 20% of  6001  3444  193  Abrasive B, 0.25%  NH$_{2}$NH2,  and 19.75% DI water  (pH~ 3)  4) 30% Oxidizer 9011, 20%  586  183  185  Abrasive B, 0.5%  H$_{2}$O$_{2 }$ 5% MPX073,  and 44.5% DI water  5) 4.8% Hydroxylamine (50%  7028  3833  179  solution), 3.0%  Hydroxylamine Sulfate  (solid), 5.0%  NH$_{2}$NH$_{2}$ ,  4.2% H$_{2}$SO$_{4}$ ,  20% Abrasive B, and  63.0% DI water 