(19)  United States  (12)  Patent Application Publication  Small et al.  (10)  Pub. No.: US 2002/0111024 Al  ( 43)  Pub. Date:  Aug. 15, 2002  (54)  CHEMICAL MECHANICAL POLISHING  COMPOSITIONS  US 20020111024Al  (76)  Inventors:  Robert  J.  Small,  Dublin, CA (US);  Laurence McGhee,  Glasgow (GB);  David  J.  Maloney,  Pleasanton, CA  (US);  Maria L. Peterson,  Belmont, CA  (US)  (21)  Appl. No.:  09/985,870  (22)  Filed:  Nov. 6, 2001  (63)  Continuation-in-part of application No. 09/481,050,  filed on Jan. 11, 2000, now patented, which is a  continuation of application No. 09/043,505, filed on  Mar. 23, 1998, now patented, filed as 371 of interna› tional application No. PCT/US97/12220, filed on Jul.  21, 1997.  (60)  Provisional application No. 60/023,299, filed on Jul.  26, 1996.  (57)  ABSTRACT  A  composition for chemical mechanical polishing that  includes a slurry is described.  A  sufficient amount of a  selectively oxidizing and reducing compound is provided to  produce a differential removal of a metal and a dielectric  material.  A pH  adjusting compound adjusts the  pH  of the  composition to provide a  pH  that makes the selectively  oxidizing and reducing compound provide the differential  removal of a metal and a dielectric material.  A  composition  may include an effective amount of an hydroxylamine  compound, ammonium persulfate, a compound which is an  indirect source of hydrogen peroxide, and a per acetic acid or  periodic acid.  A  method for chemical mechanical polishing  is described which includes applying a slurry that includes  the composition to a surface to produce mechanical removal  of the metal and dielectric material.  Correspondence Address:  PENNIE  &  EDMONDS LLP  1667 K STREET NW  SUITE 1000  WASHINGTON, DC 20006  Related U.S. Application Data  Publication Classification  (51)  Int. Cl.7  .......................  H0lL 21/302;  H0lL 21/461  (52)  U.S. Cl.  ..............................................................  438/689 