Aug. 15,2002  11  US 2002/0111024 Al  90 rpm carrier speed (8 inch diameter). When the table speed  is reduced to 70 rpm, and the downward force is reduced to  2 psi, the copper polishing rate is 2240 with an NU % of  8.6%, and the TaN polishing rate is 171 with an NU % of  14.3%.  [0106]  When hydroxylamine and hydroxylamine salts are  used together in a formulation, the ratio of Hydroxylamine  to Hydroxylamine sulfate, Hydroxylamine nitrate, or both  Hydroxylamine sulfate and Hydroxylamine nitrate is advan› tageously between about 5:1 to 1:10, preferably between  about 2:1 to 1:4. For example, a composition may contain  5% Hydroxylamine and 1 % each of Hydroxylamine sulfate  and Hydroxylamine nitrate.  [0107]  Another tested oxidizer composition, formulation  D, comprised of 2% hydroxylamine, 3% hydroxylamine  sulfate, and DI water. The hydroxylamine solution of oxi› dizer D is preferably between about 0.5 to 5 wt. %, more  preferably between about 1 to 4%, and most preferably  about 2%. The hydroxylamine sulfate (solid) of oxidizer D  is preferably between about 0.5 to 5%. Another preferred  oxidizer (Oxidizer "E") according to the present invention  comprises hydroxylamine, hydroxylamine sulfate, sulfuric  acid, and DI water. One example of approximate component  concentrations for Oxidizer E is shown in the following  table.  Oxidizer E  Component  Hydroxylamine (50% solution)  Hydroxylamine Sulfate (solid)  Sulfuric acid H$_{2}$SO$_{4 }$ (95-98% acid)  DI water  Concentration  (wt.%)  4.0%  3.0%  2.7%  90.3%  [0108]  Oxidizer E composition has a preferred pH range  of about 3 to 3.2. The hydroxylamine solution of oxidizer E  is preferably between about 1 to 10 wt. %, more preferably  between about 2 to 8%, and most preferably about 4%. The  hydroxylamine sulfate (solid) of oxidizer E is preferably  between about 0.5 to 5%, more preferably between about 1  to 3%, and most preferably about 3%. The sulfuric acid of  oxidizer E is preferably between about 1 to 5 wt. %, more  preferably between about 2 to 3%, and most preferably  about 2.7%.  [0109]  Oxidizer Components (Oxidizer "F")  [0110]  Another preferred oxidizer (Oxidizer "F") accord› ing to the present invention comprises hydroxylamine,  hydroxylamine sulfate, sulfuric acid, and DI water. One  example of approximate component concentrations for Oxi› dizer F is shown in the following table.  [0111]  Oxidizer F  [0112]  Oxidizer F Composition has a preferred pH range  of about 3 to 3.2.  Component  Hydroxylamine (50% solution)  Hydroxylamine Sulfate (solid)  Sulfuric acid H$_{2}$SO$_{4 }$ (95-98% acid)  Citric acid (solid)  DI water  Concentration  (wt.%)  4.0%  3.0%  2.7%  0.2%  90.1%  [0113]  The hydroxylamine solution of oxidizer F is pref› erably between about 1 to 10 wt. %, more preferably  between about 2 to 8%, and most preferably about 4%. The  hydroxylamine sulfate (solid) of oxidizer F is preferably  between about 0.5 to 5%, more preferably between about 1  to 3%, and most preferably about 3%. The sulfuric acid of  oxidizer F is preferably between about 1 to 5 wt. %, more  preferably between about 2 to 3%, and most preferably  about 2.7%. The citric acid of oxidizer F is preferably  between about 0.05 to 1 wt. %, more preferably between  about 0.1 to 0.5%, and most preferably about 0.2%.  [0114]  Oxidizer Components (Oxidizer "G")  [0115]  As  mentioned above, the oxidizers in accordance  with the present invention may further include a hydrazine  inhibitor. Another preferred oxidizer (Oxidizer "G") accord› ing to the present invention comprises hydroxylamine sul› fate, hydroxylamine, sulfuric acid, hydrazine  (NH$_{2}$NH$_{2}$ ),  4-hydrazine benzoic acid (solid), and  DI  water. One example  of approximate component concentrations for Oxidizer G is  shown in the following table.  [0116]  Oxidizer G  [0117]  Oxidizer G composition has a preferred pH range  of about 3.  Component  Hydroxylamine (50% solution)  Hydroxylamine sulfate (solid)  Sulfuric acid H$_{2}$SO  4  (95-98% acid)  Hydrazine (99%)  4-hydrazine benzoic acid (solid) (HBA)  DI Water  Concentration  (wt.%)  4.8%  3.0%  4.2%  0.2%  0.03%  88.77  [0118]  The hydroxylamine solution of oxidizer G is pref› erably between about 1 to 10 wt. %, more preferably  between about 2 to 8%, and most preferably about 4.8%. The  hydroxylamine sulfate (solid) of oxidizer G is preferably  between about 0.5 to 5%, more preferably between about 1  to 3%, and most preferably about 3%. The sulfuric acid of  oxidizer G is preferably between about 1 to 10 wt. %, more  preferably between about 2 to 8%, and most preferably  about 4.2%. The hydrazine of oxidizer G is preferably  between about 0.05 to 1 wt. %, more preferably between  about 0.1 to 0.5%, and most preferably about 0.2%.  [0119]  Composition concentrations and the CMP process  may be altered to acquire different CMP results. Typically,  the CMP process includes covering the surface of the wafer  with the slurry and polishing the wafer. Thus, the CMP  process is effected by polish time in seconds ("s"), polish 