Evaluation of the impact of solder die attach versus epoxy die attach in   a state of the art power package
  Subject of this paper is the thermal investigation of epoxy (EDA) and solder (SDA) die attaches by a comparison of an ASIC with multiple heat sources in different package assemblies. Static and transient thermal measurements and simulations were performed to investigate the thermal behavior of two samples in a state of the art QFP power package differing only in the die attach material (EDA and SDA). 
J. Czernohorsky, B. Maj, Matthias Viering, L. Wright, G. Balanon