AFM and Raman studies of topological insulator materials subject to   argon plasma etching
  Plasma etching is an important tool in nano-device fabrication. We report a study on argon plasma etching of topological insulator materials Bi2Se3, Bi2Te3, Sb2Te3 and Bi2Te2Se using exfoliated flakes (with starting thicknesses of ~100 nm) derived from bulk crystals. We present data mainly from atomic force microscopy (AFM) and Raman spectroscopy. Through AFM measurements, plasma exposure is observed to decrease the thickness of our samples and increase surface roughness (with height fluctuations reaching as large as ~20 nm). We extract an etching rate for each type of material. Plasma exposure also causes a widening (especially Eg2) of the characteristic Raman peaks, with no significant change in peak position. The overall Raman intensity is observed to initially increase, then decrease sharply after the samples are etched below ~20 nm in thickness. Our findings are valuable for understanding the effects of argon plasma etching on topological insulator materials. 
Isaac Childres, Jifa Tian, Ireneusz Miotkowski, Yong Chen
cond-mat.mtrl-sci