Sub-\mu m Josephson Junctions for Superconducting Quantum Devices
  For high-performance superconducting quantum devices based on Josephson junctions (JJs) decreasing lateral sizes is of great importance. Fabrication of sub-\mu m JJs is challenging due to non-flat surfaces with step heights of up to several 100 nm generated during the fabrication process. We have refined a fabrication process with significantly decreased film thicknesses, resulting in almost flat surfaces at intermediate steps during the JJ definition. In combination with a mix-&-match process, combining electron-beam lithography (EBL) and conventional photolithography, we can fabricate JJs with lateral dimensions down to 0.023 \mu m^2. We propose this refined process as an alternative to the commonly used chemical-mechanical polishing (CMP) procedure. We present transport measurements of JJs at 4.2 K that yield critical-current densities in the range from 50 to 10^4 A/cm^2. Our JJ process yields excellent quality parameters, Rsg/Rn up to ~50 and Vgap up to 2.81 mV, and also allows the fabrication of high-quality sub-\mu m wide long JJs (LJJs) for the study of Josephson vortex behavior. The developed technique can also be used for similar multilayer processes and is very promising for fabricating sub-\mu m JJs for quantum devices such as SQUIDs, qubits and SIS mixers. 
J. M. Meckbach, M. Merker, S. J. Buehler, K. Ilin, B. Neumeier, U.   Kienzle, E. Goldobin, R. Kleiner, D. Koelle, M. Siegel
cond-mat.supr-con