Surfactant induced smooth and symmetric interfaces in Cu/Co multilayers
  In this work we studied Ag surfactant induced growth of Cu/Co multilayers. The Cu/Co multilayers were deposited using Ag surfactant by ion beam sputtering technique. It was found that Ag surfactant balances the asymmetry between the surface free energy of Cu and Co. As a result, the Co-on-Cu and Cu-on-Co interfaces become sharp and symmetric and thereby improve the thermal stability of the multilayer. On the basis of obtained results, a mechanism leading to symmetric and stable interfaces in Cu/Co multilayers is discussed. 
S. M. Amir, Mukul Gupta, Ajay Gupta, J. Stahn and A. Wildes
cond-mat.mtrl-sci