Interplay between grain boundary grooving, stress, and dealloying in the   agglomeration of NiSi1-xGex films
  Germanosilicides, especially those formed on compressive substrates, are less stable than silicides against agglomeration. By studying the solid-state reaction of Ni thin film on strained Si0.8Ge0.2(001), we show that nickel germanosilicide is different from nickel silicide and nickel germanide in several respects: the grains are smaller and faceted, the groove angle is sharper, and dealloying takes place. The germanium out-diffusion creates a stress in the film which favors grooving and agglomeration. 
H. B. Yao, M. Bouville, D. Z. Chi, H. P. Sun and X. Q. Pan, D. J.   Srolovitz, D. Mangelinck