High Power Density Multichip Cooling Modules for Large      Digital Computers
{'Code': '07020000', 'Directorate': {'Abbreviation': 'ENG', 'LongName': 'Directorate For Engineering'}, 'Division': {'Abbreviation': 'CBET', 'LongName': 'Div Of Chem, Bioeng, Env, & Transp Sys'}}
{'SignBlockName': 'George P. Peterson', 'PO_EMAI': None, 'PO_PHON': None}
The capability to remove heat dissipated in integrated circuitry                is a highly critical factor in the successful design and                        operation of the next generation of general propose mainframe                   computers.  It is virtually a certainty that some sort ofliquid                 immersion-cooling scheme will be adopted.  However, there are                   many candidate schemes, and it is still open as to which scheme                 will be used.  The present proposal is aimed at providing                       information about one such scheme--the impingement of multiple                  jets, with the heat transfer being removed by boiling.  The                     expectation is that the experimental results will be fully                      sufficient is adopted.
{'FirstName': 'Issam', 'LastName': 'Mudawwar', 'PI_MID_INIT': None, 'PI_SUFX_NAME': None, 'PI_FULL_NAME': 'Issam Mudawwar', 'EmailAddress': None, 'NSF_ID': '000102479', 'StartDate': '08/01/1987', 'EndDate': None, 'RoleCode': 'Principal Investigator'}
{'Name': 'Purdue Research Foundation', 'CityName': 'WEST LAFAYETTE', 'ZipCode': '479064353', 'PhoneNumber': '3174946200', 'StreetAddress': '1281 WIN HENTSCHEL BLVD STE 2500', 'StreetAddress2': None, 'CountryName': 'United States', 'StateName': 'Indiana', 'StateCode': 'IN', 'CONGRESSDISTRICT': '04', 'CONGRESS_DISTRICT_ORG': 'IN04', 'ORG_UEI_NUM': 'C1G1LGYJF5G5', 'ORG_LGL_BUS_NAME': 'PURDUE RESEARCH FOUNDATION', 'ORG_PRNT_UEI_NUM': 'YRXVL4JYCEF5'}
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{'Code': '1406', 'Text': 'TTP-Thermal Transport Process'}
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