Dispersive Models For High Frequency Interconnects and      Microstrip Junctions
{'Code': '07010000', 'Directorate': {'Abbreviation': 'ENG', 'LongName': 'Directorate For Engineering'}, 'Division': {'Abbreviation': 'ECCS', 'LongName': 'Div Of Electrical, Commun & Cyber Sys'}}
{'SignBlockName': 'Lawrence Goldberg', 'PO_EMAI': None, 'PO_PHON': None}
With the increasing complexity of microwave and millimeter wave                 integrated circuits, the understanding and modeling of proximity                coupled passive components and microstrip junctions play an important           role in accurately predicting the circuit performance.  In the                  research proposed in this document, a dynamic dispersive rigorous               approach based on solving integral equations with numerical methods             will be applied to a class of important microstrip junctions and                transitions frequently encountered in integrated circuit structures.            The research will also investigate theoretically and experimentally             the issue of interconnects with emphasis on microwave and millimeter            wave integrated circuit applications.  It will focus initially on               microstrip interconnects; the modelling and experimentation of                  multilevel collinear and transversely coupled interconnects in a                substrate-super-strate configuration with the intent of optimizing the          power coupled from one circuit level to another.  Subsequently, multi-          level cross-over interconnects will be studied with the intent of               minimizing cross-talk as for VLSI applications, or maximizing coupling          of power for certain integrated circuit microstrip antenna array                applications.  This will be subsequently expanded to deal with                  multiple or arrays of multi-level microstrip inter-connects in                  collinear, transverse as well as cross-over configurations.  The issue          of optical interconnects will also be addressed for dielectric                  waveguiding structures in a similar way as for microwave and                    millimeter wave circuits.
{'FirstName': 'Nicolaos', 'LastName': 'Alexopoulos', 'PI_MID_INIT': 'G', 'PI_SUFX_NAME': None, 'PI_FULL_NAME': 'Nicolaos G Alexopoulos', 'EmailAddress': 'alfios@uci.edu', 'NSF_ID': '000319190', 'StartDate': '09/01/1988', 'EndDate': None, 'RoleCode': 'Principal Investigator'}
{'Name': 'University of California-Los Angeles', 'CityName': 'LOS ANGELES', 'ZipCode': '900244200', 'PhoneNumber': '3107940102', 'StreetAddress': '10889 WILSHIRE BLVD STE 700', 'StreetAddress2': None, 'CountryName': 'United States', 'StateName': 'California', 'StateCode': 'CA', 'CONGRESSDISTRICT': '36', 'CONGRESS_DISTRICT_ORG': 'CA36', 'ORG_UEI_NUM': 'RN64EPNH8JC6', 'ORG_LGL_BUS_NAME': 'UNIVERSITY OF CALIFORNIA, LOS ANGELES', 'ORG_PRNT_UEI_NUM': None}
{'Name': None, 'CityName': None, 'StateCode': None, 'ZipCode': None, 'StreetAddress': None, 'CountryCode': None, 'CountryName': None, 'StateName': None, 'CountryFlag': None, 'CONGRESSDISTRICT': None, 'CONGRESS_DISTRICT_PERF': '""'}
{'Code': '1517', 'Text': 'EPMD-ElectrnPhoton&MagnDevices'}
{'url': 'https://www.nsf.gov/awardsearch/download?DownloadFileName=1988&All=true', 'xml': '8802617.xml'}