Test Sections with Integrated Microthermometry for Heat     Transfer Studies
{'Code': '07020000', 'Directorate': {'Abbreviation': 'ENG', 'LongName': 'Directorate For Engineering'}, 'Division': {'Abbreviation': 'CBET', 'LongName': 'Div Of Chem, Bioeng, Env, & Transp Sys'}}
{'SignBlockName': 'Tammi Owens', 'PO_EMAI': None, 'PO_PHON': None}
This research seeks to develop and calibrate new microelectronic                temperature measurement devices and test sections for basic heat                transfer studies.  Using monolithic circuit technology, arrays of               temperature sensors will be developed to determine the temperature              fields on the integrated heat source.  The devices to be investigated           will include thin and thick film (metallic) resistors, diffused                 resistors, diodes, bipolar transistors, junction field-effect                   transistors, and metal oxide semiconductor field-effect transistors.            Bipolar and MOS analog circuit techniques and signal conditioning               circuitry will be explored.                                                                                                                                     Traditional large scale thermometers such as thermocouples can                  interfere with the thermal field being investigated.  In addition, the          underlining microscale phenomena cannot be quantified.  This research           program will develop the sensors to measure the temperature on the              scale of a few micrometers.  Since the associated boundary conditions           become very important at these scales, the research will also                   investigate the integration of these temperature sensors with heat              sources.
[{'FirstName': 'Richard', 'LastName': 'Jaeger', 'PI_MID_INIT': 'C', 'PI_SUFX_NAME': None, 'PI_FULL_NAME': 'Richard C Jaeger', 'EmailAddress': 'jaeger@eng.auburn.edu', 'NSF_ID': '000263079', 'StartDate': '06/15/1988', 'EndDate': None, 'RoleCode': 'Co-Principal Investigator'}, {'FirstName': 'John', 'LastName': 'Goodling', 'PI_MID_INIT': 'S', 'PI_SUFX_NAME': None, 'PI_FULL_NAME': 'John S Goodling', 'EmailAddress': 'goodling@me.eng.auburn.edu', 'NSF_ID': '000265582', 'StartDate': '06/15/1988', 'EndDate': None, 'RoleCode': 'Principal Investigator'}]
{'Name': 'Auburn University', 'CityName': 'AUBURN', 'ZipCode': '368490001', 'PhoneNumber': '3348444438', 'StreetAddress': '321-A INGRAM HALL', 'StreetAddress2': None, 'CountryName': 'United States', 'StateName': 'Alabama', 'StateCode': 'AL', 'CONGRESSDISTRICT': '03', 'CONGRESS_DISTRICT_ORG': 'AL03', 'ORG_UEI_NUM': 'DMQNDJDHTDG4', 'ORG_LGL_BUS_NAME': 'AUBURN UNIVERSITY', 'ORG_PRNT_UEI_NUM': None}
{'Name': None, 'CityName': None, 'StateCode': None, 'ZipCode': None, 'StreetAddress': None, 'CountryCode': None, 'CountryName': None, 'StateName': None, 'CountryFlag': None, 'CONGRESSDISTRICT': None, 'CONGRESS_DISTRICT_PERF': '""'}
{'Code': '1406', 'Text': 'TTP-Thermal Transport Process'}
{'url': 'https://www.nsf.gov/awardsearch/download?DownloadFileName=1988&All=true', 'xml': '8805607.xml'}