Ball Formation Processes in Wire Bonding Apparatus
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More than half of the integrated circuits manufactured in the world             have wire leads attached by the ball-bonding process.  Almost all of            the information about this process is empirical--an analytical model            does not exist.  In the attachment process the bonding wire is heated           by an electric discharge; it then melts and forms a ball under the              influence of surface tension.  The ball is pressed onto the contacts on         the silicon chip to form a bond.  The researcher will study ball                formation by scaled-up experiments, using high-speed motion pictures.           Gold wire in air, and aluminum alloy wire in air and in argon will be           used.  The alloy will contain magnesium as the strengthening agent, but         other alloys will also be evaluated.
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