Particulate Removal from Electronic Circuits by             High-Intensity Acoustic Waves
{'Code': '07020000', 'Directorate': {'Abbreviation': 'ENG', 'LongName': 'Directorate For Engineering'}, 'Division': {'Abbreviation': 'CBET', 'LongName': 'Div Of Chem, Bioeng, Env, & Transp Sys'}}
{'SignBlockName': 'Charles Alexander Garris, Jr.', 'PO_EMAI': None, 'PO_PHON': None}
High decibel acoustic waves will be used to remove micron- and                  submicron-sized particulates contaminants from the surface of high              density integrated circuits.  Efficient use of the acoustic energy              provides the removal force necessary to overcome the particle/surface           adhesion.  This innovative cleaning technique has the potential to              increase substantially the production yields of current chip                    manufacturing processes and to advance the miniaturization of future            circuit designs.  The experimental portion of the investigation                 includes:  morphological characterization of the contaminants prior to          and after cleansing, characterization of the acoustic field during the          procedure, and a parametric study of the removal efficiency as a                function of the acoustic waver form (e.g., random, gated-random, tone           burst) and intensity.  The research also involves a theoretical                 investigation of the interaction of acoustic waves with the surface of          the IC and of relative adhesive and removal forces under various                configurations and acoustic fields.
[{'FirstName': 'Arthur', 'LastName': 'Vetter', 'PI_MID_INIT': 'F', 'PI_SUFX_NAME': None, 'PI_FULL_NAME': 'Arthur F Vetter', 'EmailAddress': None, 'NSF_ID': '000391334', 'StartDate': '05/01/1986', 'EndDate': None, 'RoleCode': 'Co-Principal Investigator'}, {'FirstName': 'John', 'LastName': 'Beddow', 'PI_MID_INIT': 'K', 'PI_SUFX_NAME': None, 'PI_FULL_NAME': 'John K Beddow', 'EmailAddress': None, 'NSF_ID': '000373383', 'StartDate': '05/01/1986', 'EndDate': None, 'RoleCode': 'Co-Principal Investigator'}, {'FirstName': 'Patrick', 'LastName': 'Butler', 'PI_MID_INIT': 'B', 'PI_SUFX_NAME': None, 'PI_FULL_NAME': 'Patrick B Butler', 'EmailAddress': 'patrick-butler@uiowa.edu', 'NSF_ID': '000302069', 'StartDate': '05/01/1986', 'EndDate': None, 'RoleCode': 'Principal Investigator'}]
{'Name': 'University of Iowa', 'CityName': 'IOWA CITY', 'ZipCode': '522421316', 'PhoneNumber': '3193352123', 'StreetAddress': '105 JESSUP HALL', 'StreetAddress2': None, 'CountryName': 'United States', 'StateName': 'Iowa', 'StateCode': 'IA', 'CONGRESSDISTRICT': '01', 'CONGRESS_DISTRICT_ORG': 'IA01', 'ORG_UEI_NUM': 'Z1H9VJS8NG16', 'ORG_LGL_BUS_NAME': 'THE UNIVERSITY OF IOWA', 'ORG_PRNT_UEI_NUM': None}
{'Name': None, 'CityName': None, 'StateCode': None, 'ZipCode': None, 'StreetAddress': None, 'CountryCode': None, 'CountryName': None, 'StateName': None, 'CountryFlag': None, 'CONGRESSDISTRICT': None, 'CONGRESS_DISTRICT_PERF': '""'}
{'Code': '1415', 'Text': 'PMP-Particul&MultiphaseProcess'}
{'url': 'https://www.nsf.gov/awardsearch/download?DownloadFileName=1986&All=true', 'xml': '8609157.xml'}