Electron Beam Imagable Polyimides
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{'SignBlockName': 'Ritchie B. Coryell', 'PO_EMAI': None, 'PO_PHON': None}
This work will investigate several polyimide precursors to choose one           which will be directly imagable by electron beams and which will be a           dielectric with properties suitable for use in the semiconductor                industry.  Phase I research demonstrated that a polyimide precursor can         be made a negative or a positive resist, and the sensitivity can be             enhanced, by the addition of a small percentage of a polymeric                  additive.  One positive- and two negative-acting polyimide resists will         be studied during Phase II to provide an explanation for this effect.           This information will be used to improve the properties of one                  material.  Integrated circuit process tests which include thickness and         uniformity of coatings, adhesion tests, and thermal stability will be           performed.  Lithographic properties (electron beam sensitivity and              resolution) and dielectric properties (resistivity, dielectric                  strength, dielectric constant, and dissipation factor) will be tested.
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{'Code': '5373', 'Text': 'SBIR Phase II'}
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