Ball Formation Processes in Wire Bonding Apparatus
{'Code': '07030000', 'Directorate': {'LongName': 'Directorate For Engineering'}, 'Division': {'LongName': 'Div Of Civil, Mechanical, & Manufact Inn'}}
{'SignBlockName': 'F. Hank Grant'}
This project deals with the manufacture of integrated circuits.            Specifically, it deals with the bonding of wire between proper                  junctions on the chip and terminals on the supporting lead frame.               The bonding wire is heated by an electric discharge, melts, forms a             ball and is pressed to the contacts to form a bond.  Insecure bonds             can result from improperly formed balls.  Despite the ubiquity of               the process in semiconductor chip fabrication, no fundamental study             has yet provided understanding of the discharge and heat transfer               phenomena involved.  The object of this study is to provide a clear             picture of the mechanisms involved and to establish the relationship            between discharge parameters and ball quality parameters.                            Two undergraduate students will participate in this research.
[{'FirstName': 'Ira', 'LastName': 'Cohen', 'EmailAddress': 'imcohen@seas.upenn.edu', 'StartDate': '06/01/1988', 'EndDate': None, 'RoleCode': 'Principal Investigator'}, {'FirstName': 'Portonovo', 'LastName': 'Ayyaswamy', 'EmailAddress': 'ayya@seas.upenn.edu', 'StartDate': '06/01/1988', 'EndDate': None, 'RoleCode': 'Co-Principal Investigator'}]
{'Name': 'University of Pennsylvania', 'CityName': 'Philadelphia', 'ZipCode': '191046205', 'PhoneNumber': '2158987293', 'StreetAddress': 'Research Services', 'CountryName': 'United States', 'StateName': 'Pennsylvania', 'StateCode': 'PA'}
[{'Code': '1406', 'Text': 'THERMAL TRANSPORT PROCESSES'}, {'Code': '1467', 'Text': 'MATERIALS PROCESSING AND MANFG'}, {'Code': '9120', 'Text': 'CROSS-DIRECTORATE PROGRAMS'}]
{'url': 'https://www.nsf.gov/awardsearch/download?DownloadFileName=1987&All=true', 'xml': '8709537.xml'}