Realistic Modeling of Residual and Thermal Stress in        Electronic Devices
{'Code': '07030000', 'Directorate': {'Abbreviation': 'ENG', 'LongName': 'Directorate For Engineering'}, 'Division': {'Abbreviation': 'CMMI', 'LongName': 'Div Of Civil, Mechanical, & Manufact Inn'}}
{'SignBlockName': 'Dianne McCormick', 'PO_EMAI': None, 'PO_PHON': None}
The primary objective of the research is to develop reliable methods to         predict residual (fabrication) stress and applied thermal stress levels         in microelectronic device structures.  In addition, the research will           also suggest ways to systematically reduce stresses arising during              fabrication.  The types of structures for which this research will be           applicable are:  semiconductor wafers, integrated circuit chips, hybrid         circuits, and heterojunction lasers.  Stresses induced during forming           can adversely effect reliability of the end product and cause premature         failure of devices via fracture, anomalous diffusion of dopants, or             deleterious electromigration.  Furthermore, high stresses also occur            during subsequent operation due to substantial temperature gradients            within components.  Both fabrication and operating stresses arise               because of the wide disparity of thermal expansion between various              device materials, such as silicon and various thin film oxides or               metals.  Current methods for predicting such stresses are very                  approximate.  The research will use a variety of solid mechanics                principles to address some unsolved problems regarding layered                  electronic structures, particularly interfacial stresses in wafers.             Simple but useful stress analysis formulas will be developed to assist          preliminary mechanical design of electronic devices, while finite               element stress analysis will be employed to study the detailed nature           of complex singular stress systems which must exist at material                 interfaces.
{'FirstName': 'Jeffrey', 'LastName': 'Eischen', 'PI_MID_INIT': 'W', 'PI_SUFX_NAME': None, 'PI_FULL_NAME': 'Jeffrey W Eischen', 'EmailAddress': 'eischen@ncsu.edu', 'NSF_ID': '000447038', 'StartDate': '06/15/1987', 'EndDate': None, 'RoleCode': 'Principal Investigator'}
{'Name': 'North Carolina State University', 'CityName': 'RALEIGH', 'ZipCode': '276950001', 'PhoneNumber': '9195152444', 'StreetAddress': '2601 WOLF VILLAGE WAY', 'StreetAddress2': None, 'CountryName': 'United States', 'StateName': 'North Carolina', 'StateCode': 'NC', 'CONGRESSDISTRICT': '02', 'CONGRESS_DISTRICT_ORG': 'NC02', 'ORG_UEI_NUM': 'U3NVH931QJJ3', 'ORG_LGL_BUS_NAME': 'NORTH CAROLINA STATE UNIVERSITY', 'ORG_PRNT_UEI_NUM': None}
{'Name': None, 'CityName': None, 'StateCode': None, 'ZipCode': None, 'StreetAddress': None, 'CountryCode': None, 'CountryName': None, 'StateName': None, 'CountryFlag': None, 'CONGRESSDISTRICT': None, 'CONGRESS_DISTRICT_PERF': '""'}
{'Code': '1441', 'Text': 'MECHANICS'}
{'url': 'https://www.nsf.gov/awardsearch/download?DownloadFileName=1987&All=true', 'xml': '8708960.xml'}