Over deze norm
Specifies the composition, property requirements and tolerances on dimensions and form for copper and copper alloy strip for lead frame material, with widths up to and including 100 mm. Thicknesses from 0,1 mm up to and including 1,0 mm, generally used for stamped lead frames for integrated circuits and low power devices and thicknessess from 1,0 mm up to and including 2,0 mm are generally used for stamped lead frames for high power devices. The sampling procedures, the methods of test for verification of conformity to the requirements of this standard, and the delivery conditions are also specified.
||Koper en koperlegeringen - Band voor systeemdragers
||Copper and copper alloys - Strip for lead frame
The text passage describes the specifications for copper and copper alloy strip used in lead frames for integrated circuits and low/high power devices, including dimensions, property requirements, and testing methods. It does not contain any mathematical questions or answers.
no_question
Given a text passage, determine:
    1. If it contains a mathematical question (including word problems or calculations)
    2. If an answer to that mathematical question is provided in the text

First, describe the content structure you found in 1-2 sentences.

Then provide your analysis in the following format:
TYPE: <one of the following values>
- NO_QUESTION
- SINGLE_QUESTION
- SINGLE_QUESTION_WITH_ANSWER
- MULTIPLE_QUESTIONS
- MULTIPLE_QUESTIONS_WITH_ANSWERS
system
Over deze norm
Specifies the composition, property requirements and tolerances on dimensions and form for copper and copper alloy strip for lead frame material, with widths up to and including 100 mm. Thicknesses from 0,1 mm up to and including 1,0 mm, generally used for stamped lead frames for integrated circuits and low power devices and thicknessess from 1,0 mm up to and including 2,0 mm are generally used for stamped lead frames for high power devices. The sampling procedures, the methods of test for verification of conformity to the requirements of this standard, and the delivery conditions are also specified.
||Koper en koperlegeringen - Band voor systeemdragers
||Copper and copper alloys - Strip for lead frame
user
The text passage describes the specifications for copper and copper alloy strip used in lead frames for integrated circuits and low/high power devices, including dimensions, property requirements, and testing methods. It does not contain any mathematical questions or answers.

TYPE: NO_QUESTION