Using magnetron sputtering to create the metal vapor allows to achieve higher yields. Conductive layers can be deposited chemically, or using vacuum deposition techniques (e.g., gold sputtering). Amorphous metal wires have been produced by sputtering molten metal onto a spinning metal disk. Metals can be deposited by electroplating, evaporation, and sputtering processes. The starting method and frequency affects cathode sputtering. In the semiconductor industry sputtering is used to etch the target. Traditional methods of fabrication involve vacuum processes including co-evaporation and sputtering. There is also a physical part, which is similar to the sputtering deposition process. Another application of sputtering is to etch away the target material. The most common PVD processes are sputtering and evaporation. Selectivity to hydrogen gas was achieved by sputtering Pd clusters on the nanorod surface. Other applications include ultrasonic welding, wave soldering, and sputtering targets. Oxygen escape is dominated by charge exchange and sputtering escape. Electrodeposition of elemental layers is similar to the sputtering of elemental layers. Such processes include sputtering, which results in the formation of brittle layers.