Optical switches are optoelectronic devices which can be integrated with integrated or discrete microelectronic circuits. The wafer serves as the substrate for microelectronic devices built in and upon the wafer. Tantalum(III) nitride is used as a thin film insulator in some microelectronic fabrication processes. Microelectronic device fabrication methods can be employed to perform the 3D printing of nanoscale-size objects. Single-crystal silicon is used to manufacture most Si-based microelectronic devices. Resistive-capacitive delay, or RC delay, hinders the further increasing of speed in microelectronic integrated circuits. Their lack of bulky inductors also makes them easier to integrate into microelectronic devices. DMSO is finding increased use in manufacturing processes to produce microelectronic devices. Bismuth telluride is also used in many microelectronic devices, such as photoreceptors. Originally, microelectronic devices were manufactured by companies that both designed and produced the devices. Many components of normal electronic design are available in a microelectronic equivalent. It is primarily involved in the research, design, and manufacturing of electronic and microelectronic instruments. Telecom Solutions, Information Technologies, and Microelectronic Solutions. As techniques have improved, the scale of microelectronic components has continued to decrease. This standard is intended to apply only to microelectronic devices.