Interconnect layout are further restrained by design rules that apply to collections of interconnects. Types of wired interconnects are Ethernets and fiber optic cables. To make vertical connects between interconnects on different levels, vias are used. These transistors have potential for digital displays and on-chip optical interconnects. Repeated throughout semiconductor manufacturing, these technologies help create transistors, interconnects, advanced memory, and packaging structures. This suggests the possibility of using them for semiconductor interconnects in computer chips. The chip's high-level design had to be turned into drawings of transistors and interconnects. This allows the separation of RAM from CPU by optical interconnects. Crossbar geometry is potentially useful for networks of interconnects. HiPerMOS process with copper interconnects and SOI. Ways that this is possible is wired interconnects and wireless interconnects. It was to be fabricated in a 0.18 micrometre CMOS process with copper interconnects. They often feature thousands of CPUs, customized high-speed interconnects, and specialized computing hardware. This forced aluminum's replacement by copper interconnects. The IMSI is used in "any" mobile network that interconnects with other networks.