The maximum operating ambient temperature is determined by the power dissipation and thermal resistance. Increasing the conductivity in a surface results in less dissipation. Further increase of heat dissipation capability is possible with power modules. Laptops present a difficult mechanical airflow design, power dissipation, and cooling challenge. Aluminum conducts heat better than cast iron, which improves heat dissipation and reduces fade. Resistors are rated according to their maximum power dissipation. Its folds increase surface area for heat dissipation. MOSFET devices to achieve a high speed with low power dissipation. These physical limitations can cause significant heat dissipation and data synchronization problems. Its main advantage is efficient heat dissipation. It is suitable for low-mass heat sinks and for components with low power dissipation. Thermocouples measure matric potential as a function of heat dissipation. They used fans forcing air across copper fins for heat dissipation. This also allows for increased heat dissipation during strenuous exercise. More complex packages have been adapted for efficient heat dissipation in high-power LEDs.