As of 2014, a number of memory products such as High Bandwidth Memory (HBM) and the Hybrid Memory Cube have been launched that implement 3D IC stacking with TSVs.
Alates aastast 2014 on välja lastud mitmeid mälutooteid nagu High Bandwidth Memory (HBM) ja Hybrid Memory Cube (HMC), mis kasutavad 3D-IC-sid koos TSV-dega.