MIL-HDBK-217F notice 2, section 5.3, for 100,000 gate 0.8 micrometre CMOS commercial ICs at 40C; failure rates in 2010 are better, because line sizes have decreased to 0.045 micrometres, and fewer off-chip connections are needed per gate.
اطلع عليه بتاريخ 05 سبتمبر 2014.  الوسيط |تاريخ الأرشيف= تم تجاهله (مساعدة); الوسيط |مسار الأرشيف= تم تجاهله (مساعدة); تحقق من التاريخ في: |archive-date= (مساعدة) MIL-HDBK-217F notice 2, section 5.3, for 100,000 gate 0.8 micrometre CMOS commercial ICs at 40C; failure rates in 2010 are better, because line sizes have decreased to 0.045 micrometres, and fewer off-chip connections are needed per gate.