Datasets:

Taylor658
/

SiN-photonic-waveguide-loss-efficiency

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train · 90k rows

waveguide_width float32 0.5 2	waveguide_height float32 200 600	cladding_material stringclasses 3 values	cladding_thickness float32 1 5	deposition_method stringclasses 3 values	etch_method stringclasses 3 values	sidewall_roughness float32 0.5 5	annealing_params stringclasses 4 values	wavelength float32 1.5k 1.6k	polarization stringclasses 2 values	input_power float32 -10 10	temperature float32 20 80	bend_radius float32 20 200	device_length float32 1 50	insertion_loss float32 0.53 26.5	propagation_loss float32 0.1 5	coupling_efficiency_input float32 40 90	coupling_efficiency_output float32 40 90	scattering_loss float32 0.01 0.5	effective_index float32 1.5 2	mode_confinement_factor float32 0.7 0.95	batch_id stringclasses 50 values	data_source stringclasses 2 values	measurement_method stringclasses 4 values	uncertainty float32 0.01 0.2
1.024	510.079987	SiO2	2.22	PECVD	Wet Etch	1.82	900C_3hr	1,598.780029	TM	2.39	67.879997	95.790001	30.700001	10.974	3.25	57.369999	64.779999	0.476	1.807	0.898	BATCH_43	Measurement	ring_resonance	0.026
1.878	296.579987	Air	3.73	PECVD	Wet Etch	0.53	900C_3hr	1,514.869995	TE	-4.47	44.049999	178.529999	45.349998	10.236	1.985	72.269997	76.720001	0.459	1.946	0.925	BATCH_22	Measurement	ring_resonance	0.185
1.743	259.910004	Polymer	2.48	LPCVD	Wet Etch	4.39	No_Anneal	1,525.599976	TE	-6.91	26.73	155.25	32.830002	2.806	0.445	47.290001	68.040001	0.46	1.551	0.812	BATCH_16	Measurement	microring_Q	0.195
1.53	331.359985	SiO2	1.54	Sputtering	RIE	4.14	900C_1hr	1,540.73999	TE	4.93	39.32	55.849998	28.610001	9.653	2.807	45.830002	86.980003	0.221	1.932	0.768	BATCH_27	Synthetic	cut-back	0.06
1.785	234.179993	Air	4.26	LPCVD	RIE	0.65	900C_3hr	1,595.599976	TE	-1.68	76.589996	139.160004	21.549999	7.335	2.99	51.889999	80.760002	0.199	1.66	0.842	BATCH_45	Measurement	ring_resonance	0.174
1.096	485.700012	SiO2	1.87	LPCVD	ICP	2.87	900C_1hr	1,513.640015	TM	5.3	37.82	36.75	16.780001	7.611	4.106	40.439999	76.830002	0.165	1.706	0.928	BATCH_43	Measurement	OTDR	0.181
1.873	375.5	Air	3.26	PECVD	ICP	4.95	900C_3hr	1,501.130005	TE	6.23	38.450001	109.519997	17.549999	5.274	2.432	88.400002	73.639999	0.264	1.563	0.919	BATCH_5	Synthetic	ring_resonance	0.145
0.965	244.100006	Air	4.95	Sputtering	RIE	0.7	900C_1hr	1,561.280029	TE	7.77	72.279999	127.550003	30.049999	8.132	2.447	60.02	40.939999	0.427	1.78	0.732	BATCH_13	Synthetic	cut-back	0.168
1.75	532.799988	Polymer	3.11	LPCVD	Wet Etch	3.73	900C_3hr	1,594.939941	TM	-6.99	57.700001	195.149994	25.84	9.094	3.24	45.720001	49.77	0.258	1.786	0.822	BATCH_3	Synthetic	microring_Q	0.045
0.541	362.839996	SiO2	1.41	PECVD	RIE	1.32	900C_3hr	1,558.719971	TM	-8.79	20.780001	129.649994	12.15	1.471	0.749	55.830002	53.360001	0.342	1.733	0.739	BATCH_20	Synthetic	ring_resonance	0.072
1.831	497.670013	Air	1.47	Sputtering	Wet Etch	4.21	900C_3hr	1,515.880005	TM	6.88	62.34	187.970001	14.28	6.975	3.82	67.519997	55.259998	0.171	1.675	0.892	BATCH_37	Synthetic	OTDR	0.074
1.938	376.480011	SiO2	4.5	PECVD	Wet Etch	4.39	900C_1hr	1,582.560059	TE	1.68	41.84	114.279999	4.13	2.476	3.688	52.189999	44.380001	0.097	1.598	0.862	BATCH_19	Measurement	cut-back	0.023
1.672	582.700012	Polymer	3.64	LPCVD	RIE	3.27	900C_1hr	1,571.030029	TE	-6.8	52.810001	161.169998	45.220001	23.622999	4.908	71.540001	54.860001	0.227	1.552	0.874	BATCH_11	Measurement	OTDR	0.168
0.88	214.029999	SiO2	1.93	LPCVD	Wet Etch	1.33	1000C_1hr	1,526.359985	TE	0.36	28.629999	170.149994	19.030001	2.427	0.39	71.419998	82.43	0.011	1.581	0.737	BATCH_4	Synthetic	microring_Q	0.101
1.099	243.570007	Polymer	2.31	Sputtering	Wet Etch	3.65	1000C_1hr	1,597.089966	TE	-9.35	48.07	189.899994	2.01	0.695	0.153	42.880001	47.43	0.435	1.673	0.869	BATCH_7	Measurement	OTDR	0.062
1.208	271.170013	Polymer	2.11	PECVD	Wet Etch	3.15	1000C_1hr	1,585.109985	TE	1.06	27.709999	33.330002	49.25	12.085	2.232	80.809998	43.049999	0.394	1.852	0.711	BATCH_37	Synthetic	microring_Q	0.04
0.792	269.790009	Air	3.5	LPCVD	RIE	2.78	900C_3hr	1,568.310059	TM	3.56	29.4	125.489998	17.5	8.148	4.012	61.439999	86.25	0.012	1.56	0.741	BATCH_35	Synthetic	OTDR	0.047
0.625	471.609985	Air	2.76	PECVD	Wet Etch	0.71	900C_1hr	1,524.810059	TM	0.48	75.029999	196.899994	44.259998	10.181	2.144	67.949997	65.07	0.132	1.758	0.764	BATCH_41	Synthetic	OTDR	0.052
1.683	304.76001	SiO2	3.83	LPCVD	Wet Etch	0.59	900C_3hr	1,540.119995	TM	9.07	23.389999	138.550003	39.630001	10.735	2.467	64.529999	62.939999	0.411	1.665	0.915	BATCH_1	Measurement	microring_Q	0.075
0.857	556.25	SiO2	2.41	Sputtering	Wet Etch	1.66	900C_3hr	1,532.589966	TE	7.42	66.599998	192.240005	20.280001	1.924	0.322	50.540001	89.669998	0.283	1.937	0.771	BATCH_20	Measurement	microring_Q	0.048
1.234	388.529999	SiO2	4.93	LPCVD	Wet Etch	4.72	No_Anneal	1,526.199951	TE	7.52	30.15	31.51	35.619999	5.291	1.344	43.09	83.080002	0.443	1.576	0.926	BATCH_37	Synthetic	microring_Q	0.162
0.705	547.23999	SiO2	1.4	LPCVD	ICP	4.32	1000C_1hr	1,562.310059	TE	-7.85	61.419998	130.630005	6.94	3.416	3.262	58.93	43.610001	0.427	1.572	0.715	BATCH_23	Synthetic	cut-back	0.028
1.248	518.820007	SiO2	3.19	LPCVD	Wet Etch	3.08	No_Anneal	1,505.23999	TE	-0.15	50.540001	84	48.34	10.506	1.775	46.939999	83.75	0.178	1.774	0.814	BATCH_35	Measurement	OTDR	0.115
0.533	229.029999	Air	3.42	LPCVD	ICP	2.08	900C_1hr	1,567.849976	TE	-8.27	41.970001	136.449997	8.1	3.124	2.693	74.949997	87.309998	0.466	1.684	0.921	BATCH_23	Synthetic	ring_resonance	0.091
1.336	229.619995	Polymer	3.44	PECVD	ICP	0.64	900C_3hr	1,549.030029	TM	9.16	71.559998	81.169998	2.39	2.349	3.131	64.93	73.269997	0.125	1.855	0.932	BATCH_4	Measurement	OTDR	0.1
0.92	426.399994	Air	4.88	PECVD	ICP	4.73	1000C_1hr	1,502.300049	TM	8.23	57.950001	102.900002	6.6	2.694	2.725	55.240002	57.919998	0.146	1.685	0.866	BATCH_25	Synthetic	cut-back	0.012
1.222	422.320007	Polymer	1.65	PECVD	ICP	0.71	No_Anneal	1,510.219971	TM	3.82	46.130001	29.700001	1.1	0.914	2.284	66.610001	52.220001	0.166	1.983	0.724	BATCH_41	Synthetic	OTDR	0.153
1.767	545.950012	Polymer	1.3	Sputtering	ICP	1.06	900C_1hr	1,564.209961	TE	-5.11	37.509998	133.149994	15.63	4.778	2.646	82.589996	56.310001	0.309	1.687	0.887	BATCH_17	Synthetic	cut-back	0.123
1.655	223.820007	Air	4.57	LPCVD	ICP	4.28	900C_3hr	1,571.890015	TM	5.51	77.32	44.619999	43.98	11.626	2.435	51.689999	88.690002	0.475	1.677	0.919	BATCH_48	Measurement	cut-back	0.04
1.698	217.380005	Air	2.31	LPCVD	ICP	3.88	900C_3hr	1,544.859985	TE	-7.1	25.290001	102.379997	8.04	1.685	0.255	44.240002	58.080002	0.184	1.738	0.878	BATCH_7	Measurement	OTDR	0.02
1.558	514.030029	Air	4.64	Sputtering	RIE	4.98	1000C_1hr	1,532.709961	TE	9.77	36.720001	177.440002	42.810001	15.766	3.252	53.59	60.48	0.066	1.661	0.892	BATCH_23	Synthetic	OTDR	0.011
1.438	565.849976	Polymer	3.13	PECVD	Wet Etch	4.16	No_Anneal	1,534.22998	TM	0.08	63.91	140.199997	29.959999	4.82	1.283	59	42.099998	0.074	1.751	0.851	BATCH_31	Measurement	ring_resonance	0.156
0.807	509.089996	SiO2	4.41	PECVD	RIE	4.21	900C_3hr	1,509.98999	TE	4.44	28.35	85.739998	19.690001	7.094	3.281	75.019997	83.309998	0.326	1.706	0.941	BATCH_46	Measurement	microring_Q	0.039
0.797	438.700012	Air	2.9	Sputtering	Wet Etch	3.1	No_Anneal	1,513.140015	TE	-4.11	53.52	96.220001	14.75	4.336	2.527	58.470001	54.060001	0.318	1.853	0.787	BATCH_48	Measurement	cut-back	0.104
1.954	297.859985	Air	4.39	Sputtering	ICP	4.11	1000C_1hr	1,587.619995	TE	-5.44	34.02	114.75	21.76	7.682	3.006	75.910004	48.490002	0.304	1.522	0.947	BATCH_39	Measurement	OTDR	0.022
0.725	344.549988	SiO2	4.52	Sputtering	ICP	3.71	900C_1hr	1,555.310059	TE	-0.11	28.629999	82.510002	25.42	13.711	4.806	41.32	81.779999	0.088	1.709	0.711	BATCH_17	Measurement	microring_Q	0.03
1.382	313.769989	SiO2	3.55	PECVD	ICP	1.32	900C_1hr	1,519.25	TE	1.06	52.720001	101.449997	9.91	5.547	4.425	82.309998	77.879997	0.311	1.853	0.847	BATCH_43	Synthetic	cut-back	0.02
1.888	257.630005	Polymer	4.47	Sputtering	RIE	1.1	900C_3hr	1,575.530029	TM	2.44	79.629997	186.820007	36.41	19.288	4.834	71.050003	57.66	0.282	1.697	0.906	BATCH_15	Synthetic	cut-back	0.127
0.9	553.210022	SiO2	4.36	PECVD	ICP	4.33	900C_1hr	1,518.829956	TM	-5.41	62.75	34.040001	33.169998	5.59	1.469	85.760002	85.959999	0.034	1.526	0.858	BATCH_36	Measurement	ring_resonance	0.152
1.778	425.190002	Polymer	4.04	PECVD	RIE	4.59	1000C_1hr	1,536.189941	TE	0.3	48.779999	134.139999	3.61	3.068	3.703	63.880001	54.799999	0.424	1.9	0.86	BATCH_3	Measurement	cut-back	0.183
1.26	492.859985	SiO2	4.05	LPCVD	ICP	1.4	900C_1hr	1,589.47998	TE	-1.54	48.18	113.019997	32.959999	15.452	4.083	74.57	40.939999	0.377	1.918	0.719	BATCH_6	Synthetic	microring_Q	0.057
0.964	412.359985	Polymer	4.47	Sputtering	RIE	2.31	1000C_1hr	1,592.439941	TM	-7.29	32.700001	62.52	2.67	2.621	4.091	67.690002	75.139999	0.124	1.722	0.73	BATCH_34	Synthetic	cut-back	0.135
1.221	401.320007	SiO2	1.21	LPCVD	ICP	4.09	900C_1hr	1,526.040039	TE	9.63	44.950001	126.269997	7.31	2.22	2.001	63.470001	65.160004	0.263	1.683	0.783	BATCH_11	Synthetic	microring_Q	0.045
1.612	376.109985	SiO2	3.61	Sputtering	RIE	4.56	1000C_1hr	1,590.630005	TM	0.84	20.440001	114.889999	22.780001	3.2	0.605	43.560001	54.700001	0.492	1.751	0.751	BATCH_38	Synthetic	cut-back	0.088
0.529	478.529999	SiO2	4.29	PECVD	RIE	3.95	900C_3hr	1,550.709961	TM	-2.45	38.810001	193.779999	18.709999	9.518	4.16	71.040001	57.810001	0.064	1.829	0.7	BATCH_15	Synthetic	cut-back	0.027
1.673	441.019989	Air	1.71	PECVD	Wet Etch	1.88	900C_3hr	1,536.609985	TM	3.75	58.419998	108.949997	34.459999	10.342	2.604	58.310001	79.43	0.066	1.518	0.941	BATCH_11	Synthetic	cut-back	0.094
1.201	273.75	SiO2	1.47	LPCVD	RIE	2.86	No_Anneal	1,538.839966	TE	7.46	49.25	102.169998	48.040001	24.426001	4.836	73.169998	47.130001	0.245	1.993	0.791	BATCH_39	Measurement	OTDR	0.08
1.36	551.849976	Air	4.38	PECVD	Wet Etch	2.93	1000C_1hr	1,587.170044	TM	-7.69	42.369999	161.619995	19.18	3.726	1.269	68.410004	81.919998	0.163	1.909	0.707	BATCH_8	Measurement	cut-back	0.089
1.714	230.639999	Air	4.13	Sputtering	RIE	3.32	900C_3hr	1,579.119995	TE	-6.27	56.07	162.740005	44.93	20.884001	4.477	67.080002	64.440002	0.088	1.822	0.929	BATCH_1	Synthetic	cut-back	0.181
0.55	409.040009	SiO2	1.97	Sputtering	ICP	0.79	No_Anneal	1,585.449951	TE	-0.5	39.18	155.539993	37.889999	7.536	1.695	45.68	86.07	0.481	1.811	0.803	BATCH_50	Measurement	ring_resonance	0.153
1.015	382.609985	Air	3.4	Sputtering	RIE	4.12	No_Anneal	1,540.550049	TM	-8.8	40.650002	92.209999	22.08	6.405	2.074	61.880001	59.689999	0.085	1.638	0.761	BATCH_4	Measurement	cut-back	0.091
1.91	403.339996	Polymer	4.52	PECVD	Wet Etch	4.27	900C_1hr	1,546.430054	TM	8.22	48.73	108.489998	3.22	1.71	3.025	74.720001	50.849998	0.275	1.908	0.809	BATCH_10	Measurement	OTDR	0.144
1.505	279.220001	SiO2	3.2	Sputtering	RIE	3.15	No_Anneal	1,570.709961	TM	-5.16	53.799999	178.039993	18.16	6.923	3.086	45.209999	73.660004	0.175	1.701	0.701	BATCH_46	Measurement	microring_Q	0.19
1.267	310.929993	Air	3.9	LPCVD	RIE	3.03	900C_3hr	1,516.949951	TM	3.57	23.68	51.91	2.37	1.661	0.218	58.48	44.709999	0.384	1.603	0.869	BATCH_10	Measurement	OTDR	0.123
1.484	253.110001	Polymer	5	LPCVD	Wet Etch	2.68	No_Anneal	1,553.589966	TM	6.77	30.66	90.040001	30.5	8.116	2.203	44.599998	78.57	0.131	1.523	0.94	BATCH_12	Synthetic	cut-back	0.025
1.833	553.789978	Polymer	3.41	Sputtering	Wet Etch	1.32	900C_1hr	1,541.619995	TM	7.39	62.740002	192.289993	10.32	5.659	4.925	48.900002	54.459999	0.45	1.871	0.864	BATCH_36	Measurement	microring_Q	0.193
0.949	412.549988	Polymer	1.83	Sputtering	RIE	3.15	1000C_1hr	1,502.329956	TE	-2.65	24.25	92.349998	17.459999	1.115	0.346	42.68	76.910004	0.193	1.588	0.742	BATCH_18	Measurement	ring_resonance	0.194
0.638	214.860001	Polymer	1.04	LPCVD	Wet Etch	0.62	No_Anneal	1,532.23999	TM	9.1	22.27	114.290001	18.26	5.641	2.034	61.130001	78.610001	0.247	1.999	0.936	BATCH_29	Synthetic	cut-back	0.097
0.768	437.399994	Polymer	3.88	PECVD	ICP	1.15	1000C_1hr	1,514.219971	TE	-7.38	36.209999	82.949997	44.84	2.665	0.291	41.209999	54.369999	0.405	1.716	0.829	BATCH_36	Synthetic	microring_Q	0.037
0.885	321.649994	Air	4.73	Sputtering	Wet Etch	2.99	900C_3hr	1,507.26001	TM	5.85	51.18	191.990005	44.700001	8.046	1.639	80.510002	40.889999	0.334	1.505	0.917	BATCH_16	Measurement	microring_Q	0.047
0.682	579.440002	Air	2.76	PECVD	Wet Etch	4.67	1000C_1hr	1,511.589966	TM	0.43	22.129999	28.549999	18.700001	3.541	1.565	52.959999	66.540001	0.053	1.747	0.943	BATCH_45	Measurement	microring_Q	0.041
0.835	280.570007	Air	3.08	PECVD	RIE	4.03	No_Anneal	1,529.72998	TM	-2.46	33.029999	135.850006	49.169998	2.534	0.185	46.830002	45.880001	0.12	1.551	0.916	BATCH_27	Measurement	ring_resonance	0.016
0.884	255.080002	Polymer	3.68	PECVD	Wet Etch	1.79	No_Anneal	1,518.189941	TM	4.96	58.009998	105.169998	28.16	5.784	1.715	74.470001	85.580002	0.305	1.706	0.894	BATCH_20	Measurement	OTDR	0.089
0.774	232.899994	Polymer	3.92	PECVD	Wet Etch	4.44	1000C_1hr	1,584.920044	TM	1.82	32.279999	194.570007	18.6	3.754	1.476	74.07	81.889999	0.132	1.952	0.836	BATCH_14	Measurement	cut-back	0.047
1.266	592.48999	SiO2	2.16	PECVD	RIE	3.21	900C_1hr	1,510.780029	TE	6.68	50.849998	111.239998	8.87	2.818	1.346	76.989998	46.310001	0.024	1.619	0.744	BATCH_47	Measurement	OTDR	0.056
1.476	578.780029	SiO2	1.59	Sputtering	ICP	4.69	No_Anneal	1,571.51001	TM	3.35	29.32	47.18	28.889999	4.27	1.062	41.040001	71.650002	0.485	1.939	0.885	BATCH_14	Synthetic	cut-back	0.032
1.004	357.709991	Air	2.08	LPCVD	RIE	3.34	900C_1hr	1,520.699951	TE	-9.05	27.969999	122.139999	9.74	4.542	3.701	47.950001	88.019997	0.332	1.702	0.817	BATCH_50	Measurement	OTDR	0.184
0.607	466.459991	Polymer	4.82	LPCVD	Wet Etch	4.47	1000C_1hr	1,548.180054	TE	-1.29	41.169998	175.570007	33.740002	10.119	2.728	63.610001	89.470001	0.287	1.832	0.939	BATCH_40	Measurement	OTDR	0.185
0.525	353.649994	SiO2	2.31	Sputtering	Wet Etch	0.57	No_Anneal	1,590.119995	TE	8.45	41.740002	41.220001	43.43	16.691	3.664	48.689999	43.700001	0.062	1.926	0.889	BATCH_21	Measurement	cut-back	0.07
1.772	294.929993	Air	1.02	PECVD	RIE	2.57	1000C_1hr	1,552.319946	TM	-4.12	57.5	40.169998	41.93	19.837	4.444	52.75	82.970001	0.33	1.827	0.873	BATCH_24	Measurement	ring_resonance	0.033
1.32	570.580017	SiO2	3.62	Sputtering	RIE	1.28	No_Anneal	1,557.420044	TM	6.27	31.32	59.41	34.91	14.129	3.734	68.760002	86.629997	0.122	1.567	0.833	BATCH_34	Measurement	ring_resonance	0.139
1.323	594.880005	SiO2	2.48	PECVD	ICP	3.15	1000C_1hr	1,501.97998	TE	-1.27	64.089996	197.080002	7.51	2.724	2.271	41.240002	65.599998	0.498	1.544	0.733	BATCH_2	Measurement	OTDR	0.154
1.421	396.290009	Air	1.62	PECVD	Wet Etch	3.5	900C_1hr	1,576.640015	TE	5.93	54.57	90.769997	7.52	3.475	2.546	51.049999	51.139999	0.394	1.682	0.886	BATCH_33	Measurement	microring_Q	0.161
0.685	514.75	SiO2	4.98	LPCVD	RIE	0.73	No_Anneal	1,503.73999	TM	7.8	34.25	161.570007	41.310001	5.26	0.828	85.550003	73.720001	0.222	1.903	0.737	BATCH_27	Measurement	ring_resonance	0.143
0.948	351.839996	Air	3.61	PECVD	ICP	3.28	1000C_1hr	1,521.109985	TE	-2.43	31.639999	22.08	37.27	5.862	1.261	60.52	70.790001	0.024	1.655	0.863	BATCH_19	Measurement	ring_resonance	0.112
1.576	389.910004	Air	2.79	LPCVD	ICP	4.72	No_Anneal	1,583.199951	TE	-0.82	52.799999	171.350006	13.97	6.003	3.674	50.709999	88.089996	0.478	1.781	0.835	BATCH_13	Measurement	OTDR	0.059
1.51	401.429993	Polymer	1.8	PECVD	Wet Etch	0.8	900C_3hr	1,557.119995	TM	2.37	40.34	111.639999	35.200001	11.208	2.851	52.209999	67.540001	0.037	1.742	0.825	BATCH_27	Synthetic	ring_resonance	0.19
1.866	509.940002	SiO2	1.3	Sputtering	Wet Etch	4.02	900C_3hr	1,511.469971	TE	4.63	74.239998	81.190002	24.860001	2.893	0.821	47.02	86.160004	0.381	1.925	0.737	BATCH_43	Synthetic	ring_resonance	0.052
1.115	306.329987	Polymer	3.77	Sputtering	ICP	4.02	No_Anneal	1,540.790039	TE	-6.92	44.049999	143.460007	14.94	4.149	1.856	75.239998	76.139999	0.491	1.814	0.914	BATCH_20	Synthetic	microring_Q	0.182
1.672	547.47998	SiO2	4.71	LPCVD	RIE	3.49	No_Anneal	1,589.170044	TM	4.62	39.529999	93.669998	6.55	3.761	2.711	54.59	75.790001	0.042	1.555	0.77	BATCH_17	Synthetic	microring_Q	0.183
0.516	334.380005	Polymer	4.55	PECVD	Wet Etch	2.42	1000C_1hr	1,558.449951	TE	-0.62	29.629999	27.52	18.309999	3.54	1.537	82.040001	44.389999	0.013	1.518	0.712	BATCH_3	Measurement	microring_Q	0.164
1.66	384.529999	SiO2	2.89	PECVD	ICP	3.07	1000C_1hr	1,597.329956	TM	4.92	56.630001	28.23	20.120001	10.811	4.559	75.639999	62.610001	0.331	1.994	0.789	BATCH_14	Measurement	ring_resonance	0.068
1.479	506.51001	Air	2.88	LPCVD	RIE	3.12	900C_1hr	1,546.079956	TE	-4.34	49.540001	149.330002	38.25	4.527	0.813	63.470001	60.849998	0.067	1.739	0.857	BATCH_40	Measurement	ring_resonance	0.117
1.125	305.690002	Polymer	3.51	LPCVD	RIE	4.51	900C_3hr	1,545.089966	TM	-1.26	22.700001	175.059998	34.380001	6.812	1.801	59.610001	73.809998	0.248	1.761	0.755	BATCH_45	Measurement	cut-back	0.15
1.829	332.380005	Polymer	3.27	Sputtering	RIE	4.89	900C_3hr	1,554.670044	TE	-6.38	45.150002	194.910004	31.120001	12.649	3.752	48.139999	88.970001	0.477	1.658	0.824	BATCH_27	Synthetic	OTDR	0.089
0.733	575.280029	SiO2	1.44	Sputtering	RIE	3.85	900C_1hr	1,549.040039	TM	-7.62	66.900002	134.800003	18.68	6.315	3.006	45.259998	66.400002	0.211	1.687	0.949	BATCH_11	Synthetic	cut-back	0.106
1.98	448.26001	Polymer	3.82	PECVD	RIE	4.08	900C_3hr	1,583.089966	TM	7.7	34.93	128.229996	25.9	14.287	4.945	78.169998	40.709999	0.062	1.787	0.934	BATCH_33	Measurement	microring_Q	0.086
1.439	439.829987	Air	3.56	Sputtering	ICP	4.97	900C_3hr	1,587.530029	TM	-2.39	67.879997	46.630001	25.83	8.548	2.781	76.639999	73.360001	0.187	1.762	0.9	BATCH_35	Measurement	OTDR	0.137
1.325	295.059998	Polymer	2.15	Sputtering	Wet Etch	0.77	900C_1hr	1,559.790039	TE	1.49	31.73	94.230003	27.790001	12.199	3.77	55.75	85.169998	0.403	1.899	0.854	BATCH_19	Synthetic	OTDR	0.184
0.776	583.429993	SiO2	2.29	PECVD	ICP	3.66	No_Anneal	1,516.589966	TM	5.2	33.82	91.639999	44.830002	8.557	1.498	76.580002	46.740002	0.026	1.934	0.74	BATCH_19	Measurement	microring_Q	0.139
1.963	497.600006	SiO2	1.15	Sputtering	Wet Etch	2.67	900C_3hr	1,508.150024	TE	7.16	53.34	193.740005	38.700001	3.629	0.728	66	47.779999	0.295	1.707	0.944	BATCH_27	Synthetic	OTDR	0.182
1.02	587.640015	SiO2	2.09	Sputtering	Wet Etch	4.59	No_Anneal	1,567.290039	TE	-9.85	42.84	196.270004	28.889999	5.747	1.364	73.050003	86.400002	0.266	1.903	0.928	BATCH_7	Synthetic	OTDR	0.156
0.593	495.200012	Air	2.63	PECVD	ICP	4.4	No_Anneal	1,586.890015	TM	-9.83	46.25	189.759995	11.13	2.331	0.582	60.48	63.150002	0.359	1.984	0.841	BATCH_49	Synthetic	ring_resonance	0.065
1.729	386.579987	Air	3.66	PECVD	RIE	4.61	900C_1hr	1,543.369995	TM	-6.11	73.360001	140.119995	5.85	3.904	4.434	41.57	55.540001	0.045	1.653	0.787	BATCH_42	Measurement	OTDR	0.16
0.945	497.519989	Air	4.05	Sputtering	RIE	3.68	900C_1hr	1,577.069946	TE	-7.51	20.25	85.580002	5.04	2.68	2.529	84.910004	51.720001	0.415	1.794	0.834	BATCH_31	Measurement	microring_Q	0.063
0.52	472.720001	Polymer	3.53	PECVD	ICP	4.26	900C_3hr	1,504.790039	TM	4.43	22.719999	103.050003	31.08	6.99	2.088	58.790001	68.379997	0.135	1.571	0.825	BATCH_9	Measurement	OTDR	0.028
0.566	465.98999	SiO2	2.11	Sputtering	ICP	4.49	No_Anneal	1,565.380005	TE	-1.3	26.5	118.269997	14.58	4.412	2.486	76.580002	61.549999	0.234	1.672	0.767	BATCH_17	Measurement	ring_resonance	0.134
0.515	311.600006	Air	2.47	PECVD	RIE	2.79	900C_3hr	1,532.550049	TE	9.33	58.32	88.040001	13.57	5.406	2.894	64.690002	68.489998	0.229	1.64	0.897	BATCH_7	Synthetic	microring_Q	0.198
0.999	473.970001	Air	4.66	LPCVD	ICP	3.11	900C_3hr	1,596.599976	TE	8.88	66.730003	181.880005	3.62	3.127	4.865	79.620003	66.639999	0.451	1.683	0.919	BATCH_24	Measurement	OTDR	0.136
1.072	503.220001	Polymer	3.63	LPCVD	ICP	4.08	900C_1hr	1,573.51001	TE	0.55	70.489998	55.189999	18.450001	10.351	4.832	82.339996	44.73	0.363	1.644	0.77	BATCH_19	Synthetic	ring_resonance	0.029

Subsets and Splits